Acid etching solution used for copper or copper alloy surface and surface treatment method
A micro-etching solution and surface treatment technology, applied in the field of acid micro-etching solution and surface treatment, surface treatment of high-density interconnected printed circuit boards, can solve problems such as increasing treatment procedures, and achieve the effect of simple and easy treatment methods
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[0035] The following examples will be used to further illustrate the present invention:
[0036] The surface treatment methods of the embodiments are all the same: the acidic microetching solution is brought into contact with the copper surface, and then the copper surface of the printed circuit board is covered with an organic coating layer. See Table 1 for the comparison between the acidic microetching solutions of Examples 1-4 and two existing common microetching solutions. Prepare an acidic microetching solution according to the ingredients shown in Table 1. At a temperature of 35°C, immerse in a 0.5OZ double-sided copper-clad board for 60 seconds, take it out and immerse it in 5% dilute sulfuric acid for 10 seconds, then rinse with water, and dry it with hot air. Paste DuPont's 930 dry film by dry method on the micro-etched double-sided board, and then use spacing / line width 400 / 15μm, 400 / 20μm, 400 / 25μm, 400 / 30μm, 400 / 35μm, 400 / 40μm, 400 / 45μm, 400 / 50μm, 400 / 55μm, 400 / 60...
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