Manufacturing method of resistance copper foil

A manufacturing method and technology of copper foil, applied in liquid chemical plating, metal material coating process, coating and other directions, to achieve the effect of reducing production cost, high bonding force and improving production efficiency

Active Publication Date: 2015-12-23
AKM ELECTRONICS INDAL PANYU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, there is still no effective method, which only allows the corresponding resistive material layer to be well plated on one side of the copper foil through an electroless plating process.

Method used

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  • Manufacturing method of resistance copper foil
  • Manufacturing method of resistance copper foil
  • Manufacturing method of resistance copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] In this example, if Figure 2-Figure 6 As shown, the preparation method of resistance copper foil generally includes the following steps:

[0048] S1. The starting end of the first rolled copper foil 21 and the starting end of the second rolled copper foil 22 are superimposed on each other, and the rough surface of the first rolled copper foil 21 and the second rolled copper foil 22 are used as exposed surfaces, Then the first rolled copper foil 21 and the second rolled copper foil 22 are introduced into the roll-to-roll adhesive device, and the edge of the exposed surface of the first rolled copper foil 21 is bonded to the second rolled copper foil in a pasting manner through the sealing tape 1. The edges of the exposed surfaces of the two rolls of copper foil 22 are correspondingly connected. Similarly, the tail of the first roll of copper foil 21 and the tail of the second roll of copper foil 22 are superimposed on each other, and the first roll of copper foil 22 is ...

Embodiment 2

[0055] The difference between this embodiment and Embodiment 1 is that the manufacturing method of the resistance copper foil described in this embodiment has the following changes:

[0056] In step S3, the plating solution of the alkaline electroless nickel plating that described electroless plating is applied is composed of nickel sulfate 25g / L, sodium hypophosphite 35g / L, sodium pyrophosphate 70g / L, ammonium chloride 50g / L, ammoniacal liquor 40g / L;

[0057] Based on the above changes, the thickness of the nickel-phosphorus alloy 3 plated on the resistance copper foil obtained by the method of this embodiment is about 0.4 μm, and the P content is 13%.

Embodiment 3

[0059] The difference between this embodiment and Embodiment 2 is that the manufacturing method of the resistance copper foil described in this embodiment has the following changes:

[0060] In step S3, the temperature of the electroless plating is 45°C, and the pH value of the alkaline electroless nickel plating solution is 8-9.

[0061] Based on the above changes, the phosphorus content of the nickel-phosphorus alloy 3 plated on the resistive copper foil obtained by the method of this embodiment is 12%.

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Abstract

The invention relates to a manufacturing method of resistance copper foil. The manufacturing method comprises the following steps: two pure copper foil is overlapped, the overlapped surfaces of the two pure copper foil are sealed through sticking with a sealing tape, the exposed surfaces are pretreated through chemical plating, and are plated with resistance material layers through chemical plating, and the sealing tape is cut to obtain the resistance copper foil; especially, the pure copper foil is made of electrolytic copper which is 1 / 2 oz or 1 / 3 oz in thickness, and 1-2 [mu]m in copper teeth size; the rough surfaces of the pure copper foil are the exposed surfaces; the chemical plating pretreating process includes oil removing, acid pickling, microetching, presoaking and activating, wherein the activating time is 2-3 minutes; a medium-low-temperature alkaline chemical nickel-plating process is adopted in chemical plating, and a plating solution comprises 20-30 g / L nickel sulfate, 20-40 g / L sodium hypophosphite, 50-80 g / L sodium pyrophosphate, 30-60 g / L ammonium chloride, and 30-60 g / L ammonium hydroxide; and the chemical plating temperature is 25-50 DEG C, and the deposition time is 1-10 minutes. The manufacturing method maintains the characteristics of low chemical plating cost and simplicity in operation, and above all, only a single side of the copper foil can be plated with the resistance material layer through chemical plating according to the manufacturing method, and plating is good in uniformity and high in adhesion strength.

Description

technical field [0001] The invention relates to the technical field of embedded resistors for PCB, in particular to a method for manufacturing resistor copper foil. Background technique [0002] With the development of electronic products toward miniaturization and multi-function, traditional discrete components have been difficult to meet the application requirements of advanced products. Embedded passive component technology can highly integrate components and effectively improve product performance and reliability, so it has attracted more and more attention. Among all kinds of passive components, resistors are used in the largest amount, so the development of embedded resistors is of great significance. [0003] In the current market, Ohmega, Ticer and other companies have commercialized resistive copper foil materials, among which Ohmega manufactures resistive copper foil through electroplating process, and Ticer uses vacuum sputtering process. For the use of chemical...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/36
Inventor 王锋伟崔成强张仕通王靖
Owner AKM ELECTRONICS INDAL PANYU
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