Microetching and roughening liquid for copper surface and preparation method thereof

A technology of copper surface and roughening solution, which is applied in the field of micro-etching roughening solution for copper surface of PCB and its preparation, can solve the problems such as the crystal structure of copper surface becomes smaller, it is difficult to form roughening of copper surface, and the color difference of PCB surface, etc. To achieve the effect of improving adhesion, good treatment effect and small difference

Active Publication Date: 2020-04-17
KUNSHAN CITY BANMING ELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the type of electroplating additives, current density, current distribution, electroplating equipment and electroplating process in the pattern electroplating process will cause the crystal structure of the copper surface to become smaller, or the crystal structure of the copper surface is not uniform, and then use the existing microetching The liquid roughening treatment will make it difficult to form roughening or uniform roughening on the copper surface. The ref...

Method used

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  • Microetching and roughening liquid for copper surface and preparation method thereof
  • Microetching and roughening liquid for copper surface and preparation method thereof
  • Microetching and roughening liquid for copper surface and preparation method thereof

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preparation example Construction

[0043] A preparation method of copper surface micro-etching roughening solution, the steps are as follows:

[0044] Step 1: Weigh the copper ion source, organic acid and chloride ion source of the formula, add them in deionized water and stir to dissolve;

[0045] Step 2: Weigh the water-soluble polymer and pyridine derivative in the formula amount in the solution prepared in step 1, and stir evenly;

[0046] Step 3: Dilute the solution obtained in Step 2 to 1L with deionized water, and stir evenly to obtain the coarsening solution;

[0047] Wherein, the water-soluble polymer is self-made vinylimidazole and acrylamide copolymer, vinylimidazole and diallyl quaternary ammonium salt copolymer, vinylimidazole and vinylpyrrolidone copolymer, or vinylimidazole and formazan Acryloyloxyethyltrimethylammonium chloride copolymer.

[0048] One, embodiment and preparation method thereof

Embodiment 1

[0050] 1) Including the following components and their mass concentrations:

[0051] Malic acid 20g / L;

[0052] Divalent copper ion 5g / L, from copper bromide;

[0053] Chloride ion 5g / L, from potassium chloride;

[0054] Self-made water-soluble polymer (I) 0.0005g / L, polymer (I) adopts vinylimidazole and acrylamide copolymer, the mass content of vinylimidazole is 30%, and the mass content of acrylamide monomer is 70%;

[0055] 2-picoline 0.001g / L;

[0056] The balance of deionized water;

[0057] 2) Preparation method:

[0058] Step 1: Weigh the copper ion source, organic acid and chloride ion source of the formula, add them in deionized water and stir to dissolve;

[0059] Step 2: Weigh the water-soluble polymer and pyridine derivative in the formula amount in the solution prepared in step 1, and stir evenly;

[0060] Step 3: Dilute the solution obtained in Step 2 to 1 L with deionized water, and stir evenly to obtain the coarsening solution.

Embodiment 2

[0062] 1) Including the following components and their mass concentrations:

[0063] Citric acid 25g / L;

[0064] Divalent copper ion 10g / L, from copper formate;

[0065] Chloride ion 10g / L, from ferric chloride;

[0066] Self-made water-soluble polymer (II) 0.001g / L, polymer (II) adopts vinylimidazole and diallyl quaternary ammonium salt copolymer, vinylimidazole mass content 40%, diallyl quaternary ammonium salt monomer Mass content 60%;

[0067] Niacin 0.005g / L;

[0068] The balance of deionized water;

[0069] 2) The preparation method is the same as in Example 1;

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Abstract

The invention relates to a microetching and roughening liquid for a copper surface. The microetching and roughening liquid comprises the following components by mass concentration: 5-50 g/L bivalent copper ions from a copper ion source, 20-150 g/L organic acid, 3-105 g/L chloride ions from a chloride ion source, a 0.0005-2 g/L water-soluble polymer and a 0.001-10 g/L pyridine derivative; a solventis water; the organic acid is at least one of formic acid, acetic acid, malic acid, citric acid, tartaric acid, edetic acid, iminodisuccinic acid, monochloro acetic acid, dichloroacetic acid and trichloroacetic acid; and the water-soluble polymer is a polymer of which a molecular chain contains a Imidazole or ammonium salt structure. The microetching and roughening liquid can form uniform roughening on the copper surface, is not affected by the crystal structure of the copper surface, and in the follow-up processes, can effectively increase the adhesive force of a solder-resist coating with which the copper surface is coated.

Description

technical field [0001] The invention relates to a copper surface microetching roughening liquid, in particular to a copper surface microetching roughening liquid for PCB and a preparation method thereof. Background technique [0002] With the development of electronic products (such as mobile phones) in the direction of light, thin, fast and small, the promoter printed circuit board (PCB) continues to develop in the direction of high precision, high integration and thinness. The advancement of PCB technology has put forward higher requirements for printed circuit boards and their auxiliary materials, mainly reflected in low roughness, low resistivity, high physical properties and reliability. The key performance and reliability of PCB are mainly reflected in the bonding reliability between the conductor copper layer and the dielectric polymer material, and maintain effective reliability even in harsh environments. The bonding of the copper layer and the dielectric polymer m...

Claims

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Application Information

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IPC IPC(8): C23F1/18
CPCC23F1/18
Inventor 陈修宁王立中黄京华李晨庆黄志齐王淑萍刘亮亮
Owner KUNSHAN CITY BANMING ELECTRONICS SCI & TECH
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