Copper surface micro-etching roughening solution and preparation method thereof

Abstract

The invention relates to a copper surface micro-etching roughening solution, which comprises the following components and their mass concentrations: 5-50 g / L of divalent copper ions from a copper ion source, 20-150 g / L of organic acids, and chlorine from a chloride ion source Ion 3~105g / L, water-soluble polymer 0.0005~2g / L and pyridine derivative 0.001g / L~10g / L, solvent is water; organic acid is formic acid, acetic acid, malic acid, citric acid, tartaric acid, ethyl At least one of diaminetetraacetic acid, iminodisuccinic acid, monochloroacetic acid, dichloroacetic acid and trichloroacetic acid; the water-soluble polymer is a polymer containing imidazole or ammonium salt structure in its molecular chain. The copper surface roughening solution can form uniform roughening on the copper surface without being affected by the crystal structure of the copper surface, and can effectively improve the adhesion of the solder resist coating coated thereon in subsequent processes.

Description

technical field [0001] The invention relates to a copper surface microetching roughening liquid, in particular to a copper surface microetching roughening liquid for PCB and a preparation method thereof. Background technique [0002] With the development of electronic products (such as mobile phones) in the direction of light, thin, fast and small, the promoter printed circuit board (PCB) continues to develop in the direction of high precision, high integration and thinness. The advancement of PCB technology has put forward higher requirements for printed circuit boards and their auxiliary materials, mainly reflected in low roughness, low resistivity, high physical properties and reliability. The key performance and reliability of PCB are mainly reflected in the bonding reliability between the conductor copper layer and the dielectric polymer material, and maintain effective reliability even in harsh environments. The bonding of the copper layer and the dielectric polymer m...

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Problems solved by technology

For example, the type of electroplating additives, current density, current distribution, electroplating equipment and electroplating process in the pattern electroplating process will cause the crystal structure of the copper surface to become smaller, or the crystal structure of the copper surface is not uniform, and then use the existing microetching The liquid roughening treatment will make it difficult to form roughening or uniform roughening on the copper surface. The reflection after printing the solder resist ink is the color difference on the PCB surface.

At present, the general treatment method of the manufacturer is to recrystallize the crystals on the copper surface through high-temperature baking, so that it becomes a crystal structure that can be treated with a roughening solution. However, in many cases, high-temperature baking takes a long time, and often Baking cannot effectively solve such problems, which seriously affects normal production

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