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Method for preparing hierarchical and grading gold finger plate using method of selecting wet film

A technology of finger board and golden finger, which is applied in the field of printed circuit board production, can solve the problems of low precision, high signal distortion rate, and difficult operation, etc., and achieve the effect of easy production process, low signal distortion rate and high precision

Active Publication Date: 2009-01-28
DONGGUAN SHENGYI ELECTRONICS
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AI Technical Summary

Problems solved by technology

[0003] At this stage, there are mainly several methods for grading and segmenting gold fingers in the industry, such as the inner layer lead method and the secondary drilling method (removing the middle lead wire). These methods are not easy to operate, have poor operability, low precision, and High signal distortion rate

Method used

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  • Method for preparing hierarchical and grading gold finger plate using method of selecting wet film

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Embodiment Construction

[0017] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0018] Such as figure 1 As shown, the present invention adopts the selective wet film method to make the method for graded and segmented gold finger boards, comprising the following steps:

[0019] Step 1: Soldering, soldering the gold finger board; the soldering acts as an insulation to prevent short circuits during the welding process.

[0020] Step 2: Select the wet film, and use the selected wet film to protect the grading and segmenting positions of the gold finger board; the grading and segmenting positions of the gold finger are the power supply leads of the gold finger. The position is protected by a selective wet film to avoid gold-plated power supply leads that are not easily removed when the gold finger is electroplated. The selective wet film uses light-cured ink, which has the characteristics of small scalability and good precision. Through silk screen ...

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Abstract

The invention relates to a method for manufacturing a sectional and segmented gold fingerplate by a selective wet membrane method, comprising the following: a step of resistance welding, in which the gold fingerplate is subjected to resistance welding; a step of selecting a wet membrane, in which the wet membrane is selected to protect the sectional and segmented position of the gold fingerplate; a step of microetching, in which the copper surface of the gold fingerplate is microetched; a step of plating a gold finger, in which the gold fingers except the sectional and segmented position is gilded; a step of removing the selective wet membrane; and a step of etching for the second time, in which an attach tape is adopted to protect the copper surface of the gold fingerplate, and the sectional and segmented positions of the gold finger are etched. The method manufactures the sectional and segmented gold fingerplate by the selective wet membrane method, is used for removing plating lead wires, has easily controlled production process, and has low distortion rate of the signal and high accuracy when a client uses the method on a core network.

Description

technical field [0001] The invention relates to the field of printed circuit board production, in particular to a method for producing graded and segmented golden finger boards by using a selective wet film method. Background technique [0002] Printed circuit board (PCB) is an important electronic component and a provider of electrical connections for electronic components. To connect two PCBs to each other, it is usually done by using an edge connector. This kind of edge connector is called a gold finger in the industry. Usually, when connecting, insert the gold finger of one of the PCBs into the slot on the other PCB. Generally, it is an expansion slot (Slot). In a computer, for example, a display card, a sound card, a memory card, etc., are connected to the main board by golden fingers. [0003] At this stage, there are mainly several methods for grading and segmenting gold fingers in the industry, such as the inner layer lead method and the secondary drilling method (r...

Claims

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Application Information

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IPC IPC(8): H05K3/40
Inventor 袁继旺邢玉伟
Owner DONGGUAN SHENGYI ELECTRONICS
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