Microetching processing method used before copper deposition of printed circuit board

A printed circuit board and micro-etching treatment technology, which is applied in the secondary treatment of printed circuits, the improvement of metal adhesion of insulating substrates, etc., can solve the pressure of increasing production costs and sewage treatment, aggravating the degree of environmental impact, and affecting production efficiency and other problems, to achieve the effect of reducing the depth of micro-etching, reducing the consumption of copper raw materials, and reducing processing costs

Inactive Publication Date: 2011-01-05
BOMIN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the micro-etch depth of the commonly used micro-etching potion is controlled at 0.8-2.0 microns, so because the micro-etch depth is too large, a large amount of metal copper is wasted, and at the same time, it directly affects production efficiency, increases production costs and the pressure of sewage treatment , aggravating the impact of the environment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] Ingredients of microetching solution: 100 liters of deionized water, 2 kg of sulfuric acid, Cu 2+ 0.3 kg, 4 kg of sodium persulfate, Cu in it 2+ Obtained using copper sulfate, the same below.

[0014] Printed circuit board treatment process: The printed circuit board that needs to be immersed in copper will undergo conventional pretreatment, that is, deburring, inserting the board, whole hole and two-stage water washing, and then put it into the microetching bath filled with the above microetching solution. The micro-etching treatment is carried out in the tank, the micro-etching treatment temperature is 25-30°C, and the treatment time is 85-95 seconds; then electroless copper plating is carried out after conventional treatment. The conventional treatment is two-stage washing, pre-dipping, activation, two-stage One-stage washing, accelerated and two-stage washing, and then transferred to the next process after two-stage washing.

Embodiment 2

[0016] Ingredients of microetching solution: 100 liters of deionized water, 4 kg of sulfuric acid, Cu 2+ 2.5 kg, 6 kg of sodium persulfate.

[0017] The processing procedure of the printed circuit board is the same as that of the first embodiment.

Embodiment 3

[0019] Ingredients of microetching solution: 100 liters of deionized water, 3 kg of sulfuric acid, Cu 2+ 1.5 kg, 5 kg of sodium persulfate.

[0020] The processing procedure of the printed circuit board is the same as that of the first embodiment.

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PUM

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Abstract

The invention discloses a microetching processing method used before the copper deposition of a printed circuit board, belongs to the technical field of processing of the printed circuit board and aims to provide circuit board processing technology with long using period of microetching solution, low consumption of metal copper and small sewage quantity. The key point of the technical scheme is that: after being subjected to the conventional preprocessing, the printed circuit board which needs to be subjected to the copper deposition is put into a microetching solution tank to be subjected to microetching processing, wherein the microetching depth of a copper layer of the printed circuit board during the microetching processing is controlled in the range of 0.2 to 0.5 micron. The microetching processing method is used for the microetching processing of the printed circuit board.

Description

technical field [0001] The invention relates to a processing method of a printed circuit board, more specifically, it relates to a micro-etching treatment method of the printed circuit board before sinking copper. Background technique [0002] The chemical copper plating process of printed circuit boards is generally: deburring, inserting the board, whole hole, two-stage washing, micro-etching, two-stage washing, pre-soaking, activation, two-stage washing, acceleration, two-stage washing, Electroless copper plating, two-stage water washing, and plate removal are transferred to the next process. Among them, microetching is one of the most important links in the pretreatment process of electroless copper plating. Its function is to uniformly roughen the surface of the copper clad laminate to ensure that the surface layer of the copper clad laminate and the chemical copper layer have a good bonding force during electroless copper plating to meet the product electrical requireme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/18H05K3/38
Inventor 邓宏喜李云萍
Owner BOMIN ELECTRONICS CO LTD
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