Surface gold plating method of diamond and copper composite material

A composite material and gold-plated surface technology, which is applied in the field of metal composite surface treatment, can solve the problems of high-quality surface modification of diamond-copper composite materials, such as difficulty, and achieve the effects of good appearance quality, stable activation solution, and enhanced interface bonding force

Inactive Publication Date: 2014-12-10
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems such as the difficulty of high-quality surface modification of diamond-copper composit

Method used

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  • Surface gold plating method of diamond and copper composite material

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Experimental program
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Effect test

Embodiment 1

[0043] The specific technical solutions are as follows:

[0044] (1) Degreasing and degreasing

[0045] The test piece of the diamond-copper composite material was ultrasonically cleaned in 30° C. of acetone solution for 10 minutes, taken out, and brushed 3 to 5 times on the surface of the test piece with a soft fine-bristled brush until the surface of the test piece was free of black oil stains and scales. Rinse with water;

[0046] (2) Alkaline degreasing

[0047] Soak the test piece in the first degreasing solution at a temperature of 70°C for 8 minutes, rinse with water, and then perform electrolytic degreasing in the second degreasing solution at a temperature of 60°C for 5 minutes; take out the water and rinse. The composition of the first degreasing solution and the second degreasing solution is the same, consisting of 30 g / L of sodium hydroxide, 20 g / L of sodium phosphate, 10 g / L of sodium bicarbonate, and 1 g / L of water glass (Na 2 SiO 3 ), 1 mL / L sodium dodecyl sul...

Embodiment 2

[0066] The specific technical solutions are as follows:

[0067] (1) Degreasing and degreasing

[0068] The test piece of the diamond-copper composite material was ultrasonically cleaned in 30° C. of acetone solution for 20 minutes, taken out, and brushed 3 to 5 times on the surface of the test piece with a soft fine brush until the surface of the test piece was free of black oil stains and scales. Rinse with water;

[0069] (2) Alkaline degreasing

[0070] Soak the test piece in the first degreasing solution at a temperature of 75°C for 9 minutes, rinse it with water, and then perform electrolytic degreasing in the second degreasing solution at a temperature of 70°C for 3 minutes; take out the water and rinse it. The composition of the first degreasing solution and the second degreasing solution is the same, consisting of 40 g / L of sodium hydroxide, 25 g / L of sodium phosphate, 15 g / L of sodium bicarbonate, and 2 g / L of water glass (Na 2 SiO 3 ), 3 mL / L sodium dodecyl sulf...

Embodiment 3

[0088] The specific technical solutions are as follows:

[0089] (1) Degreasing and degreasing

[0090] Clean the test piece of diamond-copper composite material ultrasonically for 30 minutes in an acetone solution at 40°C, take it out, brush the surface of the test piece with a soft fine brush for 3 to 5 times, until there is no black oil stain or scale on the surface of the test piece, and then rinse with water;

[0091] (2) Alkaline degreasing

[0092] Soak the test piece in the first degreasing solution at a temperature of 85°C for 10 minutes, rinse it with water, and then perform electrolytic degreasing in the second degreasing solution at a temperature of 80°C for 4 minutes; take out the water and rinse it. The composition of the first degreasing solution and the second degreasing solution is the same, consisting of 50 g / L of sodium hydroxide, 30 g / L of sodium phosphate, 15 g / L of sodium bicarbonate, and 5 g / L of water glass (Na 2 SiO 3 ), 5 mL / L sodium dodecyl sulfa...

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Abstract

The invention relates to a surface gold plating method of a diamond and copper composite material. The method specifically comprises the following steps: degreasing and deoiling the diamond and copper composite material; carrying out alkaline deoiling; micro-etching; acid-activating; sensitization activating; acidic chemical nickel-plating; vacuum annealing treatment; alkaline chemical plating; electro nickelling; and electrogilding to form a gold material layer which is 2-3 mu m thick on the surface of the diamond and copper composite material. By adopting a sensitive-active two-step method, a palladium salt center with catalytic activity is formed on the surface of a diamond and copper composite material test piece. Good solid solution diffusion is formed between an acidic chemical nickel-plating layer and a substrate is formed by means of a vacuum thermal treatment method, so that the interface bonding force is enhanced. The adhesive force is enhanced between the surface plating layers of the diamond and copper composite material by means of a method of three-step nickel plating to form multiple layers of combined nickel, so that the stress of the plating layer is released. By plating gold with cyanogen gold salt as an electroplating gold salt formula, the obtained plating layer is excellent in appearance quality and excellent in weldability.

Description

technical field [0001] The invention belongs to the technical field of surface treatment of metal composite materials, and in particular relates to a gold-plating method on the surface of diamond-copper composite materials. Background technique [0002] Diamond-copper composite material not only has good thermal conductivity and electrical conductivity of copper matrix, but also can give full play to the high thermal conductivity and low thermal expansion performance of diamond particles. It is an ideal high thermal conductivity and low expansion electronic packaging material. The thermal conductivity of the diamond / copper composite material is about 3 to 4 times that of the aluminum-silicon (Si / Al) composite material, and more than 2 times that of the aluminum-silicon-carbon (SiC / Al) composite material, ensuring the packaging The device has excellent thermal dissipation performance. The thermal expansion coefficient of the diamond / copper composite material can be adjusted ...

Claims

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Application Information

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IPC IPC(8): C25D3/48C25D3/12C25D5/54C23C18/32C23C18/28C23F17/00
Inventor 刘东光胡江华周明智张先锋卢海燕吴晓霞
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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