Microetching composition and method of using the same

一种组合物、微蚀刻的技术，应用在表面浸蚀组合物、化学仪器和方法、印刷电路制造等方向，能够解决零件返工等问题

Inactive Publication Date: 2010-07-14
MACDERMID INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Second, shallow metal etch depths allow defective parts to be reworked

Method used

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  • Microetching composition and method of using the same
  • Microetching composition and method of using the same
  • Microetching composition and method of using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Acetonitrile was tested as an additive to conventional cupric chloride / sodium chloride microetch systems. The modified system has the following composition:

[0049] Copper Chloride 43 g / L

[0050] Sodium Chloride 48 g / L

[0051] Acetonitrile 200 g / L

[0052] Add hydrochloric acid to pH 1.0

[0053] This solution did not produce better results than the conventional solution until higher concentrations of acetonitrile were used. With 200 mL / L of acetonitrile, a matte brown surface was obtained with an etch depth of 170 microinches.

[0054] To reduce the etch depth, the concentration of copper chloride was reduced from 43 g / L to 15 g / L and no sodium chloride was added. Thus, the etch depth was reduced to about 59 microinches. Figure 1A A scanning electron microscope (SEM) picture of the surface is provided in .

[0055] Then 5.3 g / L copper was added to artificially age the solution. Sodium chloride was added to control etch rate and hydrochloric acid was added to...

Embodiment 2

[0058] According to the present invention, also tested the effect of adiponitrile in cupric chloride / sodium chloride microetching system, prepare following solution:

[0059] Copper Chloride 74ml / L (43g / L)

[0060] NaCl 48 g / L

[0061] Adiponitrile 2ml / L

[0062] Add hydrochloric acid to pH 1.0

[0063] resulting in an etch depth of approximately 60 microinches, Figure 2A SEM photographs of this surface are provided in .

[0064] When P-400 (polyethyleneimine, Mn-423) (available from Aldrich Chemical Company) was added to the composition, an etch depth of about 65 microinches was obtained. Figure 2B SEM photographs of this surface are provided in .

[0065] It was observed that a solid formed in the solution after the addition of copper and a layer of yellow solid appeared on the copper surface.

[0066] Dissolve the solids using butyl carbitol and prepare the following solution:

[0067] Copper Chloride 74ml / L

[0068] NH 4 Cl 44 g / L

[0069] Butyl Carbitol 200ml / ...

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Abstract

The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.

Description

[0001] Cross References to Related Applications [0002] This application is a continuation-in-part of Application Serial No. 11 / 316,010, filed December 21,2005. technical field [0003] The present invention relates to a microetching composition useful for treating metal surfaces, such as copper and copper alloy surfaces, during the manufacture of printed circuit boards. Background technique [0004] With the ever-increasing need to save weight and space in electronic devices, printed circuits with one or more circuit inner layers are predominantly used today. [0005] Successful fabrication of multilayer printed circuit boards requires bonding copper and resin layers together. However, direct bonding of copper and resin layers does not always provide sufficient bond strength. Therefore, copper-resin bond strength is generally improved by providing surface roughness to the copper surface, whereby the mechanical bond between the copper and resin layers can be enhanced. Su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K13/00C23F1/00
CPCH05K2203/122H05K3/383C23F1/18
Inventor 凤凯胜尼尔许·卡帕迪亚史蒂芬·A·卡斯塔尔迪
Owner MACDERMID INC
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