Circular treatment equipment for recovery of copper from microetching liquid and special eddy flow electrolysis unit thereof

Abstract

The invention discloses circular treatment equipment for recovery of copper from microetching liquid and a special eddy flow electrolysis unit thereof. The equipment comprises a mainframe and modularized eddy flow electrolysis units, wherein, the eddy flow electrolysis units have inlets for microetching liquid to flow in and outlets for microetching liquid to flow out, the inlet and outlet of each eddy flow electrolysis unit are respectively in parallel with or in series with a main inlet and a main outlet of the mainframe through pipelines and the main inlet and the main outlet communicate with an inlet and outlet of a microetching groove; a cathode and an anode are provided in the cylinder of the main body of the eddy flow electrolysis unit and communicate with a cathode and an anode in the mainframe; the anode is located in the inner wall of the cylinder of the main body and the cathode made of metal column is located at the center of the cylinder; deflector holes are provided in the cylinder of the main body; microetching liquid enters from the inlet at the upper part of the main body and passes through the deflector holes to form rotary liquid flow which flows out through the outlet at the upper part of the main body. According to the invention, microetching liquid discharged from the microetching groove is rich in copper ions, and when copper in the discharged microetching liquid is extracted by the eddy flow electrolysis units of the circular treatment equipment, the treated microetching liquid can be allowed to enter into the microetching groove again for utilization, thereby achieving the effect of cyclic utilization, reducing cost and abating pollution to environment.

Description

Technical field: [0001] The invention relates to the technical field of copper recovery equipment in microetching solution, in particular to a recycling treatment device for copper recovery in microetching solution and a special swirl electrolysis device thereof. Background technique: [0002] Copper-clad laminate is a plate-shaped material made by impregnating the reinforcing material with resin or glass fiber, covering one or both sides with copper foil, and hot pressing. It is called copper-clad laminate. It is the basic material for making PCB (printed circuit board). Copper clad laminate is the basic material of the electronics industry. It is mainly used for processing and manufacturing printed circuit boards (PCBs), and is widely used in electronic products such as televisions, radios, computers, computers, and mobile communications. [0003] In the process of circuit board manufacturing, it is often necessary to micro-etch the copper surface of the circuit board to ...

AI Technical Summary

Problems solved by technology

But there is a problem: the waste liquid produced after micro-etching contains a large amount of copper ions, if the waste liquid is discharged directly, it will cause great pollution to the environment, and at the same time, a large amount of copper in the waste liquid is also wasted

Its production efficiency is low, the structure of the electrolysis device is complex, and in the case of low copper ion concentration, the electrolytic copper is easy to form powder, and the material structure is poor

In order to improve the production speed of electrolysis and the compactness of copper after electrolysis, it is necessary to improve the electrolysis device more precisely, which will inevitably increase the production cost

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