Method of forming micro-pore structures or trench structures on surface of silicon wafer substrate

Abstract

A method of forming micro-pore structures or trench structures on a surface of a silicon wafer substrate comprises (A) forming at least a noble-metal alloy particle on the surface of the silicon wafer substrate; and (B) then followed by employing a chemical wet etching on the surface of the silicon wafer substrate. During the processes, noble-metal alloy particle is used to catalyze the oxidation of the silicon wafer substrate surface in contact therewith, and an etchant is used to simultaneous etch the silicon dioxide to result in local micro-etching at the surface of the silicon wafer substrate, thereby forming micro-pore structures or trench structures on the surface of the silicon wafer substrate. Surface reflectivity of the silicon chip substrate can be effectively reduced. The method increases the power conversion efficiency of the solar cells and reduces the manufacturing costs so as to increase the production benefits of the solar cells.

Description

technical field [0001] The invention relates to a method for forming a microporous structure or a groove structure on the surface of a silicon chip substrate, especially a chemical etching method for forming a microporous structure or a groove structure on the surface of a silicon chip substrate through noble metal alloy particles. Background technique [0002] In recent years, the price of international energy (especially oil) has been rising day by day, and the demand for energy has also become increasingly tense. Renewable energy is a green energy that does not harm the environment, among which solar cells are a very promising clean energy that can generate electricity directly from sunlight. A solar cell is an energy-converting photoelectric component that converts light energy into electrical energy after being irradiated by sunlight. However, at present, the production cost of solar cells must be effectively reduced before they can be widely accepted as the main sourc...

AI Technical Summary

Problems solved by technology

However, before the chemical etching step in the above-mentioned prior art, high-priced precious metal elements (such as silver elements) must be deposited, and the manufacturing cost is relatively high.

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