Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing process of fine circuits of printed circuit board

A technology of printed circuit boards and fine lines, applied in the field of PCB manufacturing, can solve the problems of high hidden dangers of printed circuit board quality, increased production costs, and high product defect rate, and achieve high yield, stable quality, and high operability Effect

Active Publication Date: 2011-02-16
HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
View PDF3 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the thinness of the copper foil, it is difficult to control the parameters and human operation specifications during lamination. During the lamination process, the copper foil is prone to wrinkling and other undesirable phenomena, which has a great hidden danger to the quality of the printed circuit board. The high defect rate of products leads to an increase in the production cost of the enterprise

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] In order to facilitate the understanding of those skilled in the art, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0016] The basic flow of the manufacturing process of the fine circuit in the present invention is as follows: inner layer pattern making, AOI scanning→copper foil pressing→micro-etching copper reduction→drilling→electroplating, outer pattern transfer→pattern electroplating and etching.

[0017] The inner layer graphics are generally produced according to the original data provided by the customer, and at the same time, a layer of photosensitive material is coated on the surface of the PCB, and the circuit graphics on the film are transferred to the PCB through exposure, and then developed , etching, and stripping to obtain the inner layer circuit.

[0018] The AOI scanning is to use AOI (automatic optical inspection machine) to detect the quality of inner layer graphic production. Using t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the field of printed circuit board (PCB) manufacturing, in particular to a manufacturing process of fine circuits of a printed circuit board. The process comprises the following steps of: 1) manufacturing internal patterns, and performing AOI scanning; 2) laminating a copper foil; 3) microetching the printed circuit board to reduce copper; 4) drilling; 5) electroplating and transferring external patterns; and 6) electroplating and etching the patterns, wherein mixed liquid medicine of which H2SO4 and H2O2 serve as active ingredients is adopted to perform microetching in step 3). Compared with the prior art, the manufacturing process has a simple process flow and high operability. The final printed circuit finished board has high yield and stable quality and is suitable for mass production.

Description

technical field [0001] The invention relates to the field of PCB manufacturing, in particular to a fine circuit manufacturing process of a printed circuit board. Background technique [0002] The miniaturization of electronic products has brought a series of challenges to the component manufacturing and printed board processing industry. The smaller the product, the greater the integration of components is required. For component manufacturers, the solution is to greatly increase the number of pins per unit area. IC component packaging is changing from QFP, TCP (tapecarrier package) to BGA, CSP change. Correspondingly, the line width / line spacing on the printed circuit board is becoming finer and finer, and its processing technology is also constantly changing to meet its thinner, denser, and smaller requirements, so as to adapt to the miniaturization and multi-function of electronic products need. [0003] In the manufacturing process of printed circuit boards, line widt...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/06H05K3/00
Inventor 赵志平周刚
Owner HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com