The invention relates to an encapsulation structure of a
fingerprint identification sensor and an encapsulation method thereof, and belongs to the technical field of
semiconductor encapsulation. The encapsulation structure of the
fingerprint identification sensor is characterized in that a groove is formed in the edge position of the top of a
silicon substrate body, a sensor
chip is arranged at the top of the
silicon substrate body, and comprises a sensing element and
chip electrodes arranged around the sensing element, an
insulation layer I covers the surface of the
silicon substrate body and an uncovered face of the groove, an
insulation layer II covers the
insulation layer I from the top down until an upper corner area I, a re-wiring
metal layer enables
electrode signals to drop to the bottom of the groove, a
metal lead wire is connected with the re-wiring
metal layer and a substrate, a
dielectric layer is filled in an opening of the insulation layer I, a plastic seal layer seals all uncovered surface space of the silicon substrate body on the substrate, and a metal film layer is arranged on the surface of the plastic seal layer. The encapsulation structure of the
fingerprint identification sensor can improve product insulating performance and reliability. The encapsulation method of the encapsulation structure of the fingerprint identification sensor uses a
wafer level technology, is simple in encapsulation process, improves production efficiency, and conforms to a development trend of encapsulation industry.