Circuit board manufacturing method adopting resin plugging

Abstract

The invention relates to a circuit board manufacturing method adopting resin plugging. The method includes the following steps of: step one, rough shape cutting; step two, brownification and copper reduction; step three, hole drilling; and step 4, electroless plating copper / board plating: hole walls are metallized by using chemical deposition, and hole copper and a copper layer on a copper clad layer are thickened by 2 to 3 microns through adopting a whole-board electroplating method; step five, hole plating and dry film attachment: a photosensitive dry film is attached onto a board processed in the step four; step six, hole plating: copper electroplating thickening is performed on the board which has been subjected to hole plating and dry film attachment through adopting an electroplating method; step seven, resin plugging; step eight, board baking: resin is baked optimally and cured through high temperature; and step nine, adhesive residue removing: the resin and the dry film are eroded by using chemical solutions, while, the chemical solutions do not react with the copper. According to the circuit board manufacturing method adopting resin plugging of the invention, the resin is applied to the hole plated board, and hole plugging and curing can be carried out, and then, the resin on the surface of the board can be removed through a chemical adhesive removing method, and polishing is not required, and the copper thickness of the surface of the board is only 10 microns. With the circuit board manufacturing method adopting resin plugging of the invention adopted, a fine circuit board of which the minimum line width and line spacing can be 2.5mil can be produced.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for manufacturing a circuit board resin plug hole. Background technique [0002] With the development trend of lightness, thinness, miniaturization and multi-function of 3 / 4G products such as mobile phones and digital cameras in the future, for HDI (HDI definition: where the PCB has non-mechanical drilling, the aperture is ≤0.15mm (6mil), the hole ring ≤0.25mm (10mil), and the contact density is 130 points / inch2, and the wiring density is above 117inch / inch2 (line width and line spacing 4 / 4MIL), which are called HDI PCBs) and continuously put forward higher requirements. [0003] Due to the lightness, thinness and miniaturization of electronic products, the reduction in the size of electronic components in the packaging form is also extremely obvious, prompting the high density of circuit boards to be simultaneously increased. There are two main directions of ...

AI Technical Summary

Problems solved by technology

[0006] The invention provides a method for manufacturing circuit board resin plug holes to solve the problem in the prior art that fine circuit boards with line width and line spacing less than 3 mils cannot be produced