31results about How to "Avoid expansion and contraction" patented technology

The invention discloses a method for once molding an inner-layer line of a multilayer flexible circuit board, and technical problems to be solved are improving the production efficiency and the qualified rate of products. The method for once molding the inner-layer line of the multilayer flexible circuit board comprises the following steps of: pasting a dry film in a whole roll, manufacturing an inner-layer line board of a multilayer board of a flexible circuit board, manufacturing an inner-layer line-board layer, manufacturing an inner-layer line-board combined layer, and manufacturing the inner-layer line of the multilayer flexible circuit board. Compared with the prior art, the processing flows of dry-film pasting, exposing, developing, etching, film removing, microetching and pressing are adopted by the invention to manufacture the inner-layer line board, the inner-layer line-board layer, the inner-layer line-board combined layer and the multilayer flexible circuit board, so that problems of height drop generated between a glued area and a non-glue area after inner-layer soft boards are pressed and expansion and shrinkage of the soft boards caused by pressing an inner-layer covering film for many times are avoided, the quality of the multilayer flexible circuit board is improved, the qualified rate reaches more than 92 percent, the process flow is shortened, and the production rate is improved.

The invention discloses a circuit board buried hole resin hole plugging method. The method comprises the following steps of: providing an electroboardd multilayer board to be subjected to hole plugging, manufacturing an inner layer circuit on the multilayer board, carrying out browning treatment on the multilayer board, performing resin hole plugging on the buried holes in the multilayer board byadopting a screen printer and a screen printing board, conducting leveling treatment on the resin protruding out of the buried hole through a leveling machine, baking the multilayer board by adoptingheating equipment, and laminating the outer layer of the multilayer board. According to the circuit board buried hole resin hole plugging method provided by the invention, through the process technology of resin hole plugging after browning, the trouble of thin board resin board grinding in the prior art is solved, the expansion and shrinkage problems caused by thin board resin hole plugging boardgrinding are avoided, on the other hand, the board explosion problem caused by thin PP pressing glue filling shortage is solved, and good reliability of products is guaranteed.

The invention provides a manufacturing method of a hole buried circuit board, and belongs to the technical field of printed circuit boards. Multiple internal lines are transferred, etched and brownedand then laminated to form a multilayer circuit board; the multilayer circuit board is bored in specific positions to form through holes, and coppering and electroplating are carried out on the wallsof the through holes; an external line is transferred after that the through holes are coppered, and resin is filled into the through holes so that resin is plugged into the holes ; after that the holes are plugged with resin, a silkscreen machine places a multilayer circuit board whose holes are plugged on a silkscreen table top to roll the resin; and after that the resin is rolled, the multilayer circuit board is solidified and browned, and the external board is pressed. Thus, the quality problems that the circuit board expands and contracts, the board surface is warped and base materials are exposed due to the fact that spilt glue needs to be peeled in the present manufacturing process of the hole buried circuit board can be solved.

An electrically heated wooden floor, include a floor body, the two ends of the floor main body are respectively provided with matching tongue and tongue groove, a heating layer is arranged inside thefloor body, The heating layer is provided with a hollow groove, a plurality of vertical isolation ribs are arranged in the hollow groove, reinforcing ribs are arranged crosswise between adjacent isolation ribs, a threading pipe is arranged at the crosswise part of the reinforcing ribs, a carbon fiber heating wire is arranged in the threading pipe, the carbon fiber heating wire is centrally connected with an external temperature controller through a cold lead, and a power supply wire is connected on the temperature controller. The invention has the characteristics of good heating effect, convenient installation, maintenance and good comfort.

The invention relates to the technical field of printed circuit plate pressing plates, in particular to a combined plate pressing process of an inner-layer thin core plate and multi-layer prepregs. By means of the plate pressing process, the appropriate glue flowing amount of the prepregs during plate pressing can be effectively controlled, it can be guaranteed that gaps between inner-layer lines are completely filled, air is exhausted, the problems of layer deviation, expansion and shrinkage, and difficult control over plate thickness uniformity and the like caused by pulling due to too large glue flowing when the inner-layer thin core plate is pressed into the multi-layer prepregs can be solved. Meanwhile, the problem of plate thickness caused by too small flowing glue is avoided, and the thickness uniformity of the plate is ensured by controlling the proper flowing glue amount, so that each inner-layer core plate and the copper foil can be completely bonded and further cured to form a whole multi-layer plate, the phenomena of no layering and plate explosion, no texture exposure, no white points, no glue shortage, no bubbles and the like on the plate surface through etching inspection are ensured, accurate control is achieved, and finally it is guaranteed that the multi-layer plate has good electrical performance and mechanical performance.

The invention provides an electric hoist which can prevent a rope from being disengaged from a rope groove. The electric hoist comprises a speed reducer located on one side, a lifting motor located on the other side, and a winding drum located between the speed reducer and the lifting motor. A rope guiding device stretching across the winding drum is erected on a shell of the speed reducer and a shell of the lifting motor. The rope guiding device comprises a connecting shaft and a rope guiding disc connected with the connecting shaft in a sliding mode. The two ends of the connecting shaft are connected with the shell of the speed reducer and the shell of the lifting motor respectively. A through connecting hole used for being in sliding connection with the connecting shaft is formed in the center of the rope guiding disc. The periphery of the rope guiding disc is composed of an arc flange formed along the circumferential surface of the rope guiding disc and an arc groove connected with the arc flange and formed along the circumferential surface of the rope guiding disc. The arc flange can be embedded in the rope groove of the winding drum. The arc groove can be matched with the rope groove of the winding drum, so that the rope wound on the winding drum is surrounded.

The invention relates to the field of circuit board manufacture and specifically an interlayer interconnection technology. A technical solution of the interlayer interconnection technology comprises the following steps: a copper surface is subjected to coarsening operation, gold protrusions are manufactured on the copper surface which needs to be interconnected via a wire bonding device, the gold protrusions range from 50 um to 70 um in height, the copper surface is covered with an adhesive layer which is 25 um is thickness, another copper face is hot-pressed on the copper surface in an aligned manner at a temperature of 140 DEG C incessantly for 4 hours, and interlayer connection can be accomplished. The beneficial effects of the interlayer interconnection technology are that procedural complexity in technologies of the prior art can be overcome, a problem that great effects are exerted on product swelling and shrinking by wet manufacture processes can be solved, a dry manufacture process solution is adopted in the interlayer interconnection technology, only simple steps are needed, and a problem of product swelling and shrinking can be prevented.

The invention discloses a pressure electromagnetic valve, which comprises an electromagnetic valve body, a valve body, a fixing upper cover, a sealing gasket and a fixing lower cover. A plurality of installation holes are formed in two side surfaces of the electromagnetic valve body and two side surfaces of the fixing upper cover; the electromagnetic valve body is arranged in the fixing upper cover and fixed through screws; the valve body penetrates through the electromagnetic valve body; a reset spring is arranged at the upper part of the valve body; the sealing gasket is arranged between thefixing upper cover and the fixing lower cover; the fixing upper cover and the fixing lower cover are fixed through screws; the fixing lower cover comprises a fixing lower cover body, a liquid/air inlet channel and a liquid/air outlet channel; the liquid/air inlet channel and the liquid/air outlet channel are fixedly connected with the fixing lower cover body; a holding cavity is arranged in the fixing lower cover body; a liquid/air outlet of the liquid/air inlet channel stretches into the holding cavity; and the liquid/air inlet channel and the liquid/air outlet channel communicate through the holding cavity. According to the pressure electromagnetic valve provided by the invention, an application field and an application range of the pressure electromagnetic valve are greatly enlarged, and the service life of the pressure electromagnetic valve is prolonged.

The invention discloses a manufacturing method of a thin PCB resin plug hole. The manufacturing method comprises the following steps of firstly, performing resin plug hole on a PCB by using a double-sided jig and an air guide cushion plate; after hole plugging is completed, the PCB and the double-sided jig being baked together; after baking is completed, the double-sided jig being polished; afterpolishing is completed, laser being used for ablating resin in the hole; the double-sided fixture is removed, and the method enter the subsequent production process. The concept of the laminated boardis creatively provided, the rigid jigs are additionally arranged on the two faces of the PCB to form the laminated board, due to the fact that the rigidity of the laminated board is large, resin on the surface of the laminated board can be removed through mechanical polishing, the resin on the surface of the laminated board is made to be located on the same plane, and then laser ablation is conducted; According to the method, problems of large expansion and shrinkage of the board, hole sinking, board surface pits and the like during resin grinding of the PCB made of the traditional PTFE material can be effectively avoided.

The invention discloses a binding board thick frame printing process, and particularly relates to the technical field of circuit board printing, the binding board thick frame printing process comprises the following steps: S1, blanking, specifically, cutting a substrate into a required shape to prepare a binding board; s2, plate surface cleaning, specifically, putting the binding board into water,and cleaning the binding board in an ultrasonic cleaning mode; s3, baking, specifically, bakingthe cleaned binding board, and drying water; s4, silk screen skip printing, specifically, printing a required circuit diagram on the binding board through silk screen skip printing lead-free solder paste; and S5, coating, specifically, coating the binding board with a circuit diagram protection film, and preparing for corrosion. According to the circuit board printing process, printing is conducted on the binding board, board explosion and expansion and contraction are avoided through cleaning and drying, corrosion is achieved through spraying of spray heads, control is easy, lateral corrosion is small, the binding board can be effectively protected through hot air leveling, flaws are avoided when the high-precision circuit board is produced, the product reliability is high, and the production cost can be controlled at the normal level.

The invention provides a flexible circuit board manufacturing method. The flexible circuit board manufacturing method at least comprises the following steps that 1, a first circuit board to be bonded and a second circuit board to be bonded are provided, wherein the first circuit board to be bonded and the second circuit board to be bonded respectively comprise a polyimide substrate and a copper line, each polyimide substrate is provided with a plurality of through holes, each copper line is formed on one face of the corresponding substrate, and the copper lines cover the through holes to serve as bonding pads; 2, the bonding pads, needing to be bonded, on the first circuit board to be bonded and the second circuit board to be bonded are stretched, and bonding pad convex points are formed on the to-be-bonded faces of the bonding pads; 3, the first circuit board to be bonded and the second circuit board to be bonded are stacked, so that the bonding pad convex points make contact to form junction points; 4, pulse voltage is exerted on the two ends of the jointed bonding pads so that welding current can be generated, and the junction points are at a high temperature instantaneously and in a molten state, so that the jointed bonding pads are welded in a fusion mode. The bonding pads are welded in the fusion mode in a pulse voltage spot welding mode, the flexible circuit board holes can be communicated and connected, the process is simple and efficient, and meanwhile good economic benefits and social benefits are obtained.

The invention relates to a mold and a method for improving warping of an ultrathin plastic package body product. The method comprises the following steps: step 1, designing an upper mold of an encapsulation mold into a peripheral slotted structure; step 2, mounting the upper mold of the peripheral slotted encapsulation mold at the position of an upper die of an encapsulation machine table; step 3,after the plastic package of the substrate is completed, forming a circle of reinforced step-shaped plastic package body around the whole substrate plastic package body; step 4, designing a pressingplate with a special-shaped structure according to the step-shaped plastic package body; step 5, overlapping the plurality of warped substrates in the same direction; step 6, pressing the special-shaped pressing plate in the middle of the plastic package body; and step 7, during post-curing, using the special-shaped pressing plate for pressurizing, and concentrating acting force in the middle of the plastic package body, so that the substrate and the plastic package body are subjected to reverse deformation. According to the invention, the structure of the plastic package body is changed through die design, and the specially designed special-shaped pressing plate is adopted for back pressing during post-curing, so that the problem of warping of the substrate can be effectively improved.