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Manufacturing method of hole buried circuit board

A manufacturing method and circuit board technology, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve problems such as board surface warping, circuit board expansion and contraction, and exposed base material, so as to improve production efficiency and reduce The effect of loss of material

Inactive Publication Date: 2018-03-23
SHENZHEN KINWONG ELECTRONICS
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for manufacturing a buried-hole circuit board, which aims to solve the problem of shrinkage of the circuit board, warping of the board surface, and exposure of the base material due to the need to cut and overflow the glue in the production process of the existing buried-hole circuit board. and other quality problems

Method used

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  • Manufacturing method of hole buried circuit board
  • Manufacturing method of hole buried circuit board
  • Manufacturing method of hole buried circuit board

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Embodiment Construction

[0026] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0028] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations or positional relationships are b...

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Abstract

The invention provides a manufacturing method of a hole buried circuit board, and belongs to the technical field of printed circuit boards. Multiple internal lines are transferred, etched and brownedand then laminated to form a multilayer circuit board; the multilayer circuit board is bored in specific positions to form through holes, and coppering and electroplating are carried out on the wallsof the through holes; an external line is transferred after that the through holes are coppered, and resin is filled into the through holes so that resin is plugged into the holes ; after that the holes are plugged with resin, a silkscreen machine places a multilayer circuit board whose holes are plugged on a silkscreen table top to roll the resin; and after that the resin is rolled, the multilayer circuit board is solidified and browned, and the external board is pressed. Thus, the quality problems that the circuit board expands and contracts, the board surface is warped and base materials are exposed due to the fact that spilt glue needs to be peeled in the present manufacturing process of the hole buried circuit board can be solved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, in particular to a method for manufacturing a circuit board with buried holes. Background technique [0002] The process of resin plugging is a technical method invented by people to reduce the design size of PCB and cooperate with the assembly of components. The purpose of resin plugging is to plate the hole wall of the via hole with copper, then fill it with resin, and finally seal it on the surface of the resin. Then copper plating, the effect of this design is that the via holes can be conducted, and there is no dent on the surface of the PCB board, which reduces the board wiring and pattern design area. [0003] During the production process, it is necessary to focus on controlling and paying attention to the fullness of the plug hole and the air bubbles in the hole. The conventional resin plugging methods include screen printing and machine vacuum plugging. Among them, the sc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/42
CPCH05K3/42H05K3/46H05K2203/0139
Inventor 曾向伟焦阳刘新年谢伦魁
Owner SHENZHEN KINWONG ELECTRONICS
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