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Mold and method for improving warping of ultrathin plastic package body product

A plastic packaging, warping technology, applied in the direction of electric solid device, semiconductor device, semiconductor/solid device manufacturing, etc., to achieve the effect of improving the warpage of the substrate

Inactive Publication Date: 2019-11-22
JCET GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a mold and method for improving the warpage of ultra-thin plastic package products in view of the above-mentioned prior art. pressure, can effectively improve the problem of substrate warpage

Method used

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  • Mold and method for improving warping of ultrathin plastic package body product
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  • Mold and method for improving warping of ultrathin plastic package body product

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Embodiment Construction

[0033] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0034] see figure 1 , the invention relates to a mold for improving the warping of ultra-thin plastic package products, which includes an upper mold and a lower mold, the upper mold includes an encapsulation cavity 1, and the encapsulation cavity 1 includes a bottom surface and a side surface, so The side surface of the encapsulation cavity 1 is an inclined surface, and the bottom surface of the encapsulation cavity 1 is provided with slots 2 around the sides.

[0035] The present invention relates to a method for improving the warping of ultra-thin plastic package products, which comprises the following steps:

[0036] Step 1. Design the bottom surface of the mold cavity on the encapsulation mold as a grooved structure around it, such as figure 1 shown;

[0037] Step 2. Install the upper mold of the encapsulation mold with grooves around i...

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Abstract

The invention relates to a mold and a method for improving warping of an ultrathin plastic package body product. The method comprises the following steps: step 1, designing an upper mold of an encapsulation mold into a peripheral slotted structure; step 2, mounting the upper mold of the peripheral slotted encapsulation mold at the position of an upper die of an encapsulation machine table; step 3,after the plastic package of the substrate is completed, forming a circle of reinforced step-shaped plastic package body around the whole substrate plastic package body; step 4, designing a pressingplate with a special-shaped structure according to the step-shaped plastic package body; step 5, overlapping the plurality of warped substrates in the same direction; step 6, pressing the special-shaped pressing plate in the middle of the plastic package body; and step 7, during post-curing, using the special-shaped pressing plate for pressurizing, and concentrating acting force in the middle of the plastic package body, so that the substrate and the plastic package body are subjected to reverse deformation. According to the invention, the structure of the plastic package body is changed through die design, and the specially designed special-shaped pressing plate is adopted for back pressing during post-curing, so that the problem of warping of the substrate can be effectively improved.

Description

technical field [0001] The invention relates to a mold and a method for improving the warping of ultra-thin plastic packaging products, belonging to the technical field of semiconductor packaging. Background technique [0002] When the size of the substrate is large, and it is a product block, and combined with an ultra-thin plastic package (below 0.25mm), since the proportion of the plastic package in the product decreases sharply, the proportion of chips, components, substrates and other factors increases. The warping of the substrate is relatively large, basically showing a warping face, and the pressure block is applied during post-curing, and the effect of improving the warping of the substrate is not obvious, resulting in cutting difficulties and directly affecting product quality. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a mold and method for improving the warpage of ultra-thin plastic package produ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56
CPCH01L21/565H01L2224/48091H01L2224/97H01L2924/181H01L2924/3511H01L2924/00012H01L2924/00014
Inventor 孙科敏杨维军陈燕
Owner JCET GROUP CO LTD
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