HDI board with mechanical back drilling structure and manufacturing method thereof

Abstract

The invention further provides a high density interconnect (HDI) plate with a mechanic back drilling structure and a manufacturing method thereof. The method comprises that: S1: a first copper foil layer, a first core plate, a second core plate and a sixth copper foil layer are correspondingly subjected to laminating together; S2: the first copper foil layer is subjected to mechanic back drilling processing with the drilling depth reaching a third copper foil layer, and the first copper foil layer, the second copper foil layer and the third copper foil layer are correspondingly connected; S3: the sixth copper foil layer is subjected to the mechanic back drilling processing with the drilling depth reaching a fourth copper foil layer, and the sixth copper foil layer, a fifth copper foil layer and the fourth copper foil layer are correspondingly connected. By adopting a manufacturing way that two core plates are firstly subjected to the laminating one time and then are subjected to the mechanic back drilling processing one time, the production cycle of the HDI plate is greatly shortened, the production cost is reduced, at the same time, the problem of panel expansion caused by multiple times of laminating, laser drillings and abrasive belt grindings is avoided, and the counterpoint accuracy between layers is guaranteed. Compared with the prior art, the HDI plate has the advantages of simple manufacturing process, high production efficiency, low cost and the like.

Description

Technical field: [0001] The invention belongs to the technical field of printed circuit board production, and in particular relates to an HDI board with a mechanical back-drilling structure and a production method thereof. Background technique: [0002] HDI circuit board, also known as high-density interconnection board, is a circuit board with relatively high circuit distribution density using micro-blind buried hole technology, which can reduce the production cost of multi-layer PCB boards, increase circuit density, high reliability, and power Good performance and other advantages. [0003] At present, HDI circuit boards mainly use laser drilling, and its production process is: first lamination → first blind hole window making → first laser drilling → first hole filling electroplating → first abrasive belt grinding Board → the first inner layer pattern → the second pressing → the second blind hole window making → the second laser drilling → the second hole filling electro...

AI Technical Summary

Problems solved by technology

[0009] For this reason, the object of the present invention is to provide a HDI board with a mechanical back-drilling structure and a manufacturing method thereof, so as to solve the problem of multiple pressing and multiple laser drilling problems in the current laser drilling HDI board production process. The problems of layer deviation, complex production process, low production efficiency and high production cost

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