130 results about "Polyimide substrate" patented technology

The invention relates to a fluoride-free polyimide-based film and a preparation method thereof. The method comprises the following steps: S1, preparing a polyamide acid solution; s2, fluorine-free organic silicon serving as a modifier is added into the polyamide acid solution and dispersed, a blended spinning solution is formed, and the solubility parameter difference value of the fluorine-free organic silicon and polyamide acid is 2.0 (MPa) 1 / 2 or below; s3, carrying out electrostatic spinning on the blended spinning solution to form a polyamide acid-based nanofiber layer; and S4, carrying out thermal imidization on the polyamide acid-based nanofiber layer to obtain the fluoride-free polyimide-based film. The film has a structure formed by three-dimensional cross-linking and winding of polyimide-based nanofibers, and the polyimide-based nanofibers are composed of a polyimide base material and fluorine-free organic silicon dispersed in the polyimide base material. The method does not involve fluorine-containing raw materials, and is environment-friendly and high in process compatibility. The film provided by the invention has excellent waterproofness, air permeability and mechanical properties at the same time.

The invention discloses a high-temperature-resistant high-stripping organic silicon pressure-sensitive adhesive and a preparation method thereof, and relates to a pressure-sensitive adhesive and a preparation method thereof. The invention aims to solve the problems of insufficient temperature resistance, low peel strength and poor binding force with a base material of the existing organic silicon pressure-sensitive adhesive. According to the invention, phenyl siloxane rubber, hydroxyl-terminated polysiloxane and methyl vinyl MQ silicon resin are used as basic raw materials, and polysilazane is used as a heat-resistant modifier to carry out heat-resistant modification on the chemical structure of the pressure-sensitive adhesive; a trifunctional allyl silane monomer is added in the film preparation process, so that the crosslinking density of the system is improved, and the heat resistance of the pressure-sensitive adhesive is further improved; the bonding force between the pressure-sensitive adhesive and a polyimide substrate is improved by adding the peroxysilane coupling agent, and the use of a primer in the coating process is omitted; by adding the hydroxyl MQ silicon resin and the phosphate adhesion promoter, the bonding strength of the pressure-sensitive adhesive is improved, and the high-temperature-resistant and high-stripping organic silicon pressure-sensitive adhesive is prepared. According to the invention, the high-temperature-resistant and high-stripping organic silicon pressure-sensitive adhesive can be obtained.

The invention discloses a miniaturized low-profile flexible ocean galvanic couple type pH sensor and a preparation method thereof, and aims to solve the problems of large profile thickness and insufficient reliability of the conventional flexible pH sensor. A working electrode system and a reference electrode system in the miniaturized low-profile flexible ocean galvanic couple pH sensor are arranged on a flexible polyimide substrate, and the working electrode system comprises an iridium oxide working electrode, a first metal conduction circuit layer and a first metal bonding pad; the iridium oxide working electrode is connected with the first metal bonding pad through the first metal conduction circuit layer, the reference electrode system comprises a reference electrode, a second metal conduction circuit layer and a second metal bonding pad, and the reference electrode is connected with the second metal bonding pad through the second metal conduction circuit layer. The pH response performance is remarkably improved by utilizing the nanocrystalline iridium oxide sensing layer, the sensitivity reaches 72.76 mV / pH, and 16.84 s quick response is realized in a 3m / s high-flow-speed marine environment.

The invention relates to the technical field of sensors, in particular to a CIOD-based noninvasive blood glucose detection sensor and method.The sensor comprises a multi-layer structure and comprises a first flexible polyimide substrate tightly attached to the skin, a temperature control assembly, a second flexible polyimide substrate and a glucose detection patch; the temperature control assembly comprises a temperature sensor and a heating wire and is used for thermally activating the skin; the glucose detection patch comprises three electrode areas filled with perfluorinated sulfonic acid resin, wherein the first electrode area comprises a first sodium ion working electrode, a shared electrode and a detection working electrode; the second electrode region contains a sodium ion reference electrode; the third electrode area comprises a second sodium ion working electrode and an auxiliary electrode; the electrodes are connected through insulating coating wires; the shared electrode and the auxiliary electrode form an interstitial fluid extraction electrode pair, and the detection working electrode and the shared electrode form a glucose detector to detect a hydrogen peroxide signal generated by glucose oxidation; the first sodium ion working electrode, the second sodium ion working electrode and the sodium ion reference electrode form a sodium ion differential detector to calibrate a glucose signal. According to the novel noninvasive blood glucose detection sensor provided by the invention, efficient, noninvasive and portable blood glucose monitoring can be realized by combining thermal activation and differential self-calibration.

The invention belongs to the technical field of multifunctional battery system monitoring, and discloses a battery system state monitoring curved surface sensing array conformal integration method and a battery system state monitoring curved surface sensing array conformal integration system. A polyimide substrate is prepared on the surface of a battery system by using a plasma surface texturing treatment process, a sensing array is integrated on the curved surface of the battery system, and parameters of the multifunctional battery system are monitored; parameter data are transmitted to a data acquisition module, and the data acquisition module takes a microcontroller and a high-speed analog-to-digital converter as a core to realize high-precision and high-speed digital conversion of sensing data; advanced processing, analysis and visualization are carried out on the converted data, and real-time monitoring, historical data playback and complex data analysis of the data are achieved; the method and the system adapt to surface curvatures of different battery systems, realize comprehensive monitoring of the multifunctional battery system, are not limited by the shape of the battery system, and have high integration level and stability.

The invention belongs to the technical field of electronic packaging and printed circuit boards, and particularly relates to a method for improving the bending resistance of a flexible circuit board, which comprises the following steps: after plasma pretreatment is carried out on the surface of a polyimide substrate, a three-dimensional nano-column array structure is constructed by depositing gold nanoparticles as a mask and combining reactive ion etching; then removing the mask to obtain a clean polyimide nano structure; and depositing a titanium / copper seed crystal layer through magnetron sputtering, and realizing conformal filling and coating of the copper conductive layer on the nano structure by adopting pulse reverse electroplating to form an adhesive-free mechanical interlocking interface. An adhesive-free three-dimensional mechanical interlocking structure is used for replacing an adhesive layer which is weak in physical performance and prone to fatigue failure, and the structural weak link that a traditional flexible circuit board is layered and cracked first under dynamic bending stress is thoroughly removed.

The invention relates to the technical field of passive resonators, in particular to a multilayer collaborative metamaterial passive resonator for enhancing an MRI (Magnetic Resonance Imaging) radio-frequency field, which comprises a plurality of metamaterial units arranged in parallel, each metamaterial unit comprises a spiral copper wire, a flexible polyimide substrate and an external capacitor, the external capacitance value is determined through working frequencies of different magnetic resonance systems. Compared with the prior art, the structure of the multi-layer collaborative metamaterial passive resonator is designed, and the resonant frequency of the multi-layer collaborative metamaterial passive resonator is matched with the target frequency, so that the multi-layer collaborative metamaterial passive resonator realizes magnetic resonance radio frequency field enhancement in a target detection area, and the signal-to-noise ratio enhancement of a magnetic resonance image is realized.

The invention provides a seed treatment method based on a graphene composite coating and a far infrared drying method, and relates to the technical field of seed treatment. Comprising the following steps: taking carboxyl-modified graphene nanosheets, a natural polymer base material, a bioactive component and a bonding enhancer, preparing a graphene composite coating through ultrasonic dispersion, and coating seeds with the graphene composite coating on a fluidized bed to obtain coated seeds; a graphene far infrared heating film structure is prepared, the graphene far infrared heating film structure comprises a polyimide substrate layer, a graphene conductive ink printed circuit heating layer and a silica gel packaging layer, and the graphene far infrared heating film structure is used for drying the coated seeds in a far infrared gradient mode. The integrity rate of the coating layer reaches 99.5%, the graphene far-infrared heating film structure is combined and utilized to perform far-infrared gradient drying on the coated seeds, and the surface temperature standard deviation of the dried coated seeds is smaller than or equal to 1.5 DEG C.

The invention relates to a polyimide bare chip substrate. In an example, a semiconductor package (100) includes a semiconductor die (106) having a device side including circuitry and a non-device side opposite the device side. The semiconductor package includes a polyimide substrate (102) coupled to the non-device side of the semiconductor die by an adhesive layer (104). The semiconductor package includes a conductive terminal (112) coupled to the polyimide substrate through the adhesive layer, and a bond wire (118) coupled to the device side of the semiconductor die and to the conductive terminal. The semiconductor package includes a molding compound (116) covering the semiconductor die, the polyimide substrate, the bond wires, and at least a portion of the conductive terminals, wherein the conductive terminals extend to an exterior of the molding compound.

The invention relates to the technical field of curved-surface circuit manufacturing, and particularly discloses a curved-surface circuit polyimide substrate surface modification and bonding strength enhancement method, which comprises the following steps of: firstly, designing a microstructure and roughness on the surface of a rigid polyimide substrate; then a microstructure is prepared on the surface of the rigid polyimide base material, and then the rigid polyimide base material is cleaned and activated through ultrasonic and plasma treatment; and finally, preparing a metal film layer on the surface of the activated rigid polyimide substrate. According to the method, the microstructure is prepared on the surface of the rigid polyimide base material, surface modification is carried out, and the metal film layer with high bonding strength is manufactured on the rigid polyimide base material in combination with the chemical deposition process, so that the bonding strength of the metal film layer and the surface of the rigid polyimide base material reaches 30 MPa or above.

The application discloses a dynamic adjustable beam deflection device based on micro-mechanics and a preparation method thereof, relates to the technical field of electromagnetic wave beam deflection, and comprises a plurality of beam deflection components arranged in a matrix, wherein the beam deflection component is composed of a metasurface layer and a silicon wafer layer, the metasurface layer is arranged at the bottom of the silicon wafer layer, the metasurface layer comprises a polyimide substrate arranged at the bottom of the silicon wafer layer, a backplate gold is arranged on one side of the polyimide substrate, a cross structure is arranged in the polyimide substrate, and a gold resonance layer structure frame is arranged on the side of the polyimide substrate away from the backplate gold. The device has the advantages of simple structure, simple preparation process, high beam regulation and control efficiency, fast working state switching speed of the device, simple switching mode, fast beam regulation and control opening and closing through simple operation, strong expandability in the future, and good application prospect in the field of beam regulation and control.

The present invention provides a flexible copper foil substrate comprising: a polyimide base material; the nickel-copper alloy layer is formed on at least one surface of the polyimide base material through chemical plating, the nickel-copper alloy layer at least comprises nickel, copper and phosphorus, the content of the copper is larger than 30 wt% of the nickel-copper alloy layer, the content of the phosphorus is smaller than 5 wt% of the nickel-copper alloy layer, and the thickness of the nickel-copper alloy layer is smaller than 10 micrometers. The corrosion potential of the nickel-copper alloy layer in a 0.02 vol% sulfuric acid solution is greater than-20 mV; and the copper layer is formed on one surface, far away from the polyimide base material, of the nickel-copper alloy layer, and is compounded with the nickel-copper alloy layer to form a metal conductive layer. Moreover, the flexible copper foil substrate has an electrochemical corrosion resistant effect and sufficient peel strength, and is beneficial to manufacturing a flexible circuit board.

Disclosed is a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes: a polyimide substrate in which a fluorine layer is provided on at least one surface; a tie layer provided on the polyimide substrate on which the fluorine layer is provided; and a copper layer provided on the tie layer, wherein the tie layer includes at least one selected from the group consisting of Group 4, Group 6, Group 13, and Group 14 metal elements of the periodic table, and a metal-oxygen (M-O) bond dissociation energy of the metal elements is greater than or equal to 400 kJ / mol.

The chemical formula of the lead-free flexible perovskite material is # imgabs0 #, a is larger than or equal to 0.1 and smaller than or equal to 0.3, and b is larger than or equal to 0.2 and smaller than or equal to 0.4. X is at least two of I, Br and Cl, and the proportion of Br is less than or equal to 30 mol%; the material is in gradient distribution of Sn and Bi in the thickness direction of the film, the Bi concentration on the surface is 10-15% higher than that in the interior, and the thickness of the gradient transition layer is 50-100 nm. The invention also discloses a preparation method of the perovskite material, a slit on a polyimide substrate is coated with a precursor solution containing # imgabs 1 # and # imgabs 2 #, and gradient distribution of Sn and Bi is realized by controlling the concentration and annealing temperature of the precursor solution. Meanwhile, the invention further discloses application of the perovskite thin film in a photovoltaic charging mobile phone shell, and the perovskite thin film shows excellent photoelectric conversion efficiency and stability and has good light transmittance and bending performance.

The present application relates to the field of optical technology, more particularly to a visible to mid-infrared super-wideband absorber and a preparation method thereof, the method comprising the following steps: self-assembling polystyrene microspheres on a polyimide substrate to form a monolayer hexagonal close-packed structure substrate, and then forming a nano-cone array substrate through ion etching; placing a copper substrate into a coating chamber and introducing argon, and sputtering to obtain a reflection layer; placing a zirconium substrate into the coating chamber and introducing argon and oxygen, and sputtering to obtain a first metal absorption film layer; continuously introducing argon and oxygen, and sputtering to obtain a second metal absorption film layer; continuously introducing argon and oxygen, and sputtering to obtain a third metal absorption film layer; placing an aluminum oxide substrate into the coating chamber, and then introducing argon, and sputtering to obtain a dielectric antireflection layer, thereby forming the absorber. The present application can have extremely high absorption in the visible light and near-infrared regions, and has good angle tolerance, polarization insensitivity, bending resistance and heat resistance.

The invention discloses an anti-static rigid-flex PCB and a processing technology thereof, and belongs to the technical field of PCB preparation. The processing technology of the anti-static rigid-flex PCB comprises the following steps: step 1, preparing polyimide base material particles and epoxy resin base material particles; 2, preparing a polyimide copper-clad plate and an epoxy resin copper-clad plate; and 3, cutting the polyimide copper-clad plate and the epoxy resin copper-clad plate, roughening the surface of a copper foil, coating a photoresist, pre-drying, exposing, developing, etching, removing a film, laminating, performing vacuum lamination, drilling, depositing copper, electroplating, manufacturing an outer circuit, performing resistance welding, performing surface treatment, forming and cutting to obtain the anti-static rigid-flex PCB. The PCB prepared according to the method has excellent antistatic performance.

The invention relates to the technical field of deposition processes, in particular to a photovoltaic cell multi-junction laminated structure deposition process which comprises the following steps: generating an amorphous silicon nitride transition layer with the thickness of 50nm on the surface of a flexible polyimide substrate through plasma enhanced chemical vapor deposition; alGaAs / GaAs gradient alloy layers are alternately grown in combination with MBE and PLD, the Al content is 0-30%, the layer thickness of each layer is 10 nm, and five levels are achieved in total; a p-type GaInP layer is grown through MOCVD (Metal Organic Chemical Vapor Deposition), the thickness is 300nm, and the SiH4 / DEZn flow ratio is dynamically adjusted through a mass flow controller to realize longitudinal doping gradient. Through technical collaboration and cross-scale regulation and control, flexible substrate pretreatment, an amorphous transition layer, a gradient buffer layer and strain compensation design are adopted, dynamic adaptation of crystal lattices and thermal expansion coefficients is achieved, in-situ spectral feedback and dynamic doping are introduced, current matching and spectral response are optimized, a nano-structure and interface atomic-scale stitching are combined, and the thermal expansion coefficient of the crystal lattices is improved. Compared with a traditional scheme, the solar cell has the advantages of high efficiency, flexibility and low cost.

According to the plug-in type interface between the flexible sensor and the mobile detector provided by the invention, the trapezoidal bulge structure with specific three-dimensional geometric parameters is constructed at the tail end of the polyimide substrate, and mechanical self-locking in the plug-in process is realized through the matching of the self-locking plate at the tail part of the patch and the limiting groove of the connector; therefore, the connection stability and the anti-seismic property are effectively improved. The structure does not need an additional clamping or fixing device, is suitable for a high-density and ultra-thin wearable sensing system, has the advantages of being small in size, high in self-locking force, capable of being repeatedly plugged and unplugged, simplified in manufacturing process and the like, can remarkably reduce the contact failure risk caused by mechanical vibration, and meets the development requirements of high-reliability flexible electronic products in the future. The pluggable interface between the flexible sensor and the mobile detector is arranged between the flexible sensor and the wearable mobile detector, and is suitable for a non-invasive continuous blood glucose monitoring and wearable medical electronic system.

The utility model belongs to the technical field of flexible circuit boards, in particular to a flexible circuit board structure used in a high-temperature environment, which comprises a polyimide substrate layer 1, a copper foil layer 2, a covering layer and a protective layer 6, the copper foil layer 2 is a rolled copper foil layer 2 so as to have better bending resistance, an anti-oxidation layer 3 is covered on the copper foil layer 2, and the anti-oxidation layer 3 is covered on the protective layer 6. The covering layer comprises a first covering layer 4 and a second covering layer 5, the first covering layer 4 and the second covering layer 5 are PI films, the surfaces of the PI films are coated with epoxy adhesive films, and one side of the outer surface of the second covering layer 5 is provided with a protective layer 6 which is used for protecting the FPC from being influenced by the external environment. And the high temperature resistance is excellent, and the copper foil layer 2 is not easily influenced by the external environment.

To provide a flexible copper clad substrate that has electrochemical corrosion resistance and sufficient peel strength.SOLUTION: Provides a flexible copper clad substrate, which includes a polyimide substrate; a nickel-copper alloy layer; and a copper layer. The nickel-copper alloy layer is formed on at least one side of the polyimide substrate by electroless plating and comprises at least nickel, copper and phosphorus. A content of the copper is more than 30 wt.% of the nickel-copper alloy layer, a content of the phosphorus is less than 5 wt.% of the nickel-copper alloy layer, and a corrosion potential of the nickel-copper alloy layer in a 0.02 vol.% sulfuric acid solution is greater than -20 mV. The copper layer is formed on the side of the nickel-copper alloy layer remote from the polyimide substrate and is combined with the nickel-copper alloy layer to form a metal conductive layer. In addition, the flexible copper clad substrate has electrochemical corrosion resistance and sufficient peel strength, facilitating the production of flexible printed circuit boards.SELECTED DRAWING: Figure 1

The application discloses a kind of polyimide composite film drying device and production system, polyimide composite film drying device includes for the polyimide substrate film surface coating emulsion formed by polyimide composite film passing and carrying out microwave heating drying microwave heating area and for the polyimide composite film after microwave heating drying passing and carrying out infrared heating drying infrared heating area, the microwave heating area and infrared heating area are sequentially arranged and mutually communicated, and polyimide composite film sequentially passes the microwave heating area and infrared heating area along vertical direction.The application further discloses a kind of production system with above-mentioned polyimide composite film drying device.The application can be used to dry PI / PTFE composite film, and drying efficiency is high, drying effect is good, can guarantee the quality of final composite film product.

The application provides a two-dimensional black phosphorus flexible infrared detector based on a photothermal effect and a preparation method thereof, and belongs to the technical field of infrared detection. The two-dimensional black phosphorus flexible infrared detector based on the photothermal effect comprises an infrared detector substrate, a source electrode, a drain electrode and a packaging layer. The infrared detector substrate comprises a polyimide substrate, a gate electrode layer, a gate oxide layer and a black phosphorus layer which are stacked in sequence. The source electrode and the drain electrode are located on the surface of the black phosphorus layer. The packaging layer is located on the side of the black phosphorus layer of the infrared detector substrate, covers the infrared detector substrate and exposes the source electrode and the drain electrode. In the application, the polyimide substrate is high in flexibility and low in thermal conductivity. When the substrate is irradiated by infrared light, the temperature of the substrate is increased, the thermal effect is enhanced, the scattering of photons is enhanced, the mobility of carriers is reduced, the negative photoconductance generated thereby is reduced, the current of the black phosphorus transistor in the on state is reduced, and the light response rate of the infrared detector is significantly improved.

The utility model discloses a low-resistance circuit board, which comprises an assembly mechanism, the assembly mechanism comprises a substrate, the upper side of the substrate is fixedly connected with a first conducting layer, the upper side of the first conducting layer is fixedly connected with an insulating layer, the upper side of the insulating layer is fixedly connected with a second conducting layer, and the upper side of the second conducting layer is fixedly connected with a solder mask layer. According to the utility model, through the arrangement of the assembly mechanism, the substrate is made of a polyimide material and has good insulation performance and thermal stability, mechanical support is provided for the whole circuit board, the first conductive layer and the second conductive layer are both made of a copper foil material, and copper has good conductivity and is a common material for manufacturing a conductive circuit of the circuit board; the copper foil with the ounce thickness can provide a lower resistance path, the loss of current in the transmission process is reduced, the insulating layer made of a polyester film material is arranged between the first conducting layer and the second conducting layer, the two conducting layers are prevented from being electrically connected in series, and normal operation of a circuit is ensured.

The invention provides a resin composition and a preparation method and application thereof.The resin composition comprises epoxidized rubber, a styrene thermoplastic elastomer and a curing agent, the curing agent comprises one or more of a ketimine curing agent and an aldimine curing agent, the resin composition has insulativity, and when the resin composition is suitable for a glass base material or a polyimide base material, the resin composition can be used for curing a glass substrate or a polyimide substrate. Good water resistance and moisture resistance are realized.

The invention discloses a flexible AMOLED display panel based on a COE technology and a preparation method of the flexible AMOLED display panel. Carrying out cutting, annealing treatment and plasma cleaning on the flexible polyimide substrate; photoresist is spin-coated on the substrate, and exposure, development and etching are carried out to form a drive circuit pattern; depositing an indium tin oxide layer and a protective layer through a CVD process; sequentially evaporating red light, green light and blue light emitting materials to form multiple OLED light emitting layers, and adding a hole transport layer and an electron blocking layer between every two layers; inorganic packaging layers are deposited through an atomic layer deposition technology, organic packaging layers are alternately deposited, and a multi-layer packaging structure is constructed; depositing a color film layer and a black matrix on the outer surface of the packaging layer; and finally, coating an optical transparent adhesive and attaching a transparent protective film. According to the flexible AMOLED display panel, by introducing the COE technology and optimizing the packaging structure, the effects of reducing the thickness of the panel, improving the light transmittance, reducing the power consumption and enhancing the display performance are achieved, and the reliability and applicability of the flexible AMOLED display panel are remarkably improved.

A flexible, high-temperature resistant oil film pressure sensor based on a bionic crack beam membrane structure, the sensor comprising an upper flexible sensitive film based on microcracks and a lower cavity support membrane bonded together; the upper flexible sensitive film based on microcracks comprises a polyimide substrate, a grid-like microgroove is etched on the lower surface of the polyimide substrate, the grid-like microgroove is embedded in a low-dimensional conductive material to form a conductive network, and the conductive network has distributed microcracks; electrodes are evaporated on the lower surface of the polyimide substrate; a cavity is provided on the upper surface of the lower cavity support membrane, and a secondary support structure is provided inside the cavity; the manufacturing process comprises first preparing an upper polyimide substrate and a lower cavity support structure, evaporating electrodes, filling low-dimensional conductive materials, pre-stretching to induce cracks, and bonding the upper polyimide substrate and the lower cavity support membrane; the sensor of the present invention is flexible and can be fitted inside the bearing of large equipment to detect the continuous distribution state of oil film pressure in situ, has the advantages of high temperature resistance and high frequency response, and has a simple manufacturing process.

The invention discloses a manufacturing method of a large-area and light-weight flying screen. The manufacturing method specifically comprises the following steps: step 1, manufacturing a copper-clad plate; step 2, carrying out dry circuit etching on the copper-clad plate; step 3, packaging the copper-clad plate; step 4, adhering the packaged copper-clad plate and the polyimide substrate by using an adhesive; step 5, performing hole digging treatment on the copper-clad plate to obtain a square grid structure; and step 6, planting electronic components on the circuit etched in the step 2, and arranging control chips of the electronic components at the four vertexes of the grid structure obtained in the step 5. The flying screen manufactured by the method has the characteristics of large area, light weight and consistent color display.

The surface activation method of the polyimide substrate comprises the following steps: providing an activating agent which is a nitrogen-containing weak base solution; coating the activating agent on the surface of a polyimide substrate, and reacting for a preset time at a preset temperature; and washing and drying the polyimide substrate. The method is simple and effective, the polyimide substrate is subjected to surface activation, functional groups on the surface of the polyimide substrate react to achieve surface activation, and when the polyimide substrate is applied to coating preparation and adhesives, the coating adhesion and wear resistance of the polyimide substrate can be effectively improved.

The invention discloses a high-temperature-aging-resistant electronic adhesive tape as well as a preparation method and application thereof, and aims to solve the technical problem that the high temperature resistance and adhesion stability of the conventional electronic adhesive tape are unbalanced. The electronic adhesive tape is prepared by taking modified polyimide as a base material and matching with a special glue solution through coating, drying and curing, the modified polyimide base material is prepared by ultraviolet ozone activation, silanization treatment and silica sol coating compounding, and the glue solution is prepared by compounding organic silicon modified acrylate resin, a compound fluorinated modifier, nano aluminum oxide, a cross-linking agent and a mixed solvent. The electronic adhesive tape has the advantages of high heat resistance limit, lasting adhesion at high temperature, excellent peel strength and no adhesive residue after high-temperature aging, good mechanical property and insulativity, and can be widely applied to insulation, fixation and protection of electronic and electrical equipment and electronic components.

The invention discloses a flexible integrated three-component fluxgate sensor chip. The flexible integrated three-component fluxgate sensor chip comprises an insulating ceramic cubic base and three micro electro mechanical system single-axis fluxgate sensor chips, the three micro electro mechanical system single-axis fluxgate sensor chips are arranged on the same polyimide substrate in a flexible integration mode and are respectively bonded and fixed on three mutually orthogonal adjacent side surfaces of the insulating ceramic cubic base through a polyimide-ceramic bonding technology; therefore, the miniaturized and fully-integrated three-component fluxgate sensor is formed. And the magnetic sensitive directions of the three micro electro mechanical system single-axis fluxgate sensor chips are respectively along three orthogonal directions of the insulating ceramic cubic base so as to realize detection of three components x, y and z of a magnetic field. Space positioning of three components is guaranteed by means of integrated design of the flexible integrated three-component fluxgate sensor chip, synchronous bonding and fixing of the three-component chip on the cubic base are achieved by means of bendability of the flexible substrate, and the three-component detection capacity of a magnetic field is obtained.