76 results about "Polyimide substrate" patented technology

The invention discloses a high-temperature-resistant high-stripping organic silicon pressure-sensitive adhesive and a preparation method thereof, and relates to a pressure-sensitive adhesive and a preparation method thereof. The invention aims to solve the problems of insufficient temperature resistance, low peel strength and poor binding force with a base material of the existing organic silicon pressure-sensitive adhesive. According to the invention, phenyl siloxane rubber, hydroxyl-terminated polysiloxane and methyl vinyl MQ silicon resin are used as basic raw materials, and polysilazane is used as a heat-resistant modifier to carry out heat-resistant modification on the chemical structure of the pressure-sensitive adhesive; a trifunctional allyl silane monomer is added in the film preparation process, so that the crosslinking density of the system is improved, and the heat resistance of the pressure-sensitive adhesive is further improved; the bonding force between the pressure-sensitive adhesive and a polyimide substrate is improved by adding the peroxysilane coupling agent, and the use of a primer in the coating process is omitted; by adding the hydroxyl MQ silicon resin and the phosphate adhesion promoter, the bonding strength of the pressure-sensitive adhesive is improved, and the high-temperature-resistant and high-stripping organic silicon pressure-sensitive adhesive is prepared. According to the invention, the high-temperature-resistant and high-stripping organic silicon pressure-sensitive adhesive can be obtained.

The invention belongs to the technical field of electronic packaging and printed circuit boards, and particularly relates to a method for improving the bending resistance of a flexible circuit board, which comprises the following steps: after plasma pretreatment is carried out on the surface of a polyimide substrate, a three-dimensional nano-column array structure is constructed by depositing gold nanoparticles as a mask and combining reactive ion etching; then removing the mask to obtain a clean polyimide nano structure; and depositing a titanium / copper seed crystal layer through magnetron sputtering, and realizing conformal filling and coating of the copper conductive layer on the nano structure by adopting pulse reverse electroplating to form an adhesive-free mechanical interlocking interface. An adhesive-free three-dimensional mechanical interlocking structure is used for replacing an adhesive layer which is weak in physical performance and prone to fatigue failure, and the structural weak link that a traditional flexible circuit board is layered and cracked first under dynamic bending stress is thoroughly removed.

The invention relates to the technical field of passive resonators, in particular to a multilayer collaborative metamaterial passive resonator for enhancing an MRI (Magnetic Resonance Imaging) radio-frequency field, which comprises a plurality of metamaterial units arranged in parallel, each metamaterial unit comprises a spiral copper wire, a flexible polyimide substrate and an external capacitor, the external capacitance value is determined through working frequencies of different magnetic resonance systems. Compared with the prior art, the structure of the multi-layer collaborative metamaterial passive resonator is designed, and the resonant frequency of the multi-layer collaborative metamaterial passive resonator is matched with the target frequency, so that the multi-layer collaborative metamaterial passive resonator realizes magnetic resonance radio frequency field enhancement in a target detection area, and the signal-to-noise ratio enhancement of a magnetic resonance image is realized.

The invention relates to a polyimide bare chip substrate. In an example, a semiconductor package (100) includes a semiconductor die (106) having a device side including circuitry and a non-device side opposite the device side. The semiconductor package includes a polyimide substrate (102) coupled to the non-device side of the semiconductor die by an adhesive layer (104). The semiconductor package includes a conductive terminal (112) coupled to the polyimide substrate through the adhesive layer, and a bond wire (118) coupled to the device side of the semiconductor die and to the conductive terminal. The semiconductor package includes a molding compound (116) covering the semiconductor die, the polyimide substrate, the bond wires, and at least a portion of the conductive terminals, wherein the conductive terminals extend to an exterior of the molding compound.

The invention relates to the technical field of curved-surface circuit manufacturing, and particularly discloses a curved-surface circuit polyimide substrate surface modification and bonding strength enhancement method, which comprises the following steps of: firstly, designing a microstructure and roughness on the surface of a rigid polyimide substrate; then a microstructure is prepared on the surface of the rigid polyimide base material, and then the rigid polyimide base material is cleaned and activated through ultrasonic and plasma treatment; and finally, preparing a metal film layer on the surface of the activated rigid polyimide substrate. According to the method, the microstructure is prepared on the surface of the rigid polyimide base material, surface modification is carried out, and the metal film layer with high bonding strength is manufactured on the rigid polyimide base material in combination with the chemical deposition process, so that the bonding strength of the metal film layer and the surface of the rigid polyimide base material reaches 30 MPa or above.

The invention discloses an anti-static rigid-flex PCB and a processing technology thereof, and belongs to the technical field of PCB preparation. The processing technology of the anti-static rigid-flex PCB comprises the following steps: step 1, preparing polyimide base material particles and epoxy resin base material particles; 2, preparing a polyimide copper-clad plate and an epoxy resin copper-clad plate; and 3, cutting the polyimide copper-clad plate and the epoxy resin copper-clad plate, roughening the surface of a copper foil, coating a photoresist, pre-drying, exposing, developing, etching, removing a film, laminating, performing vacuum lamination, drilling, depositing copper, electroplating, manufacturing an outer circuit, performing resistance welding, performing surface treatment, forming and cutting to obtain the anti-static rigid-flex PCB. The PCB prepared according to the method has excellent antistatic performance.

According to the plug-in type interface between the flexible sensor and the mobile detector provided by the invention, the trapezoidal bulge structure with specific three-dimensional geometric parameters is constructed at the tail end of the polyimide substrate, and mechanical self-locking in the plug-in process is realized through the matching of the self-locking plate at the tail part of the patch and the limiting groove of the connector; therefore, the connection stability and the anti-seismic property are effectively improved. The structure does not need an additional clamping or fixing device, is suitable for a high-density and ultra-thin wearable sensing system, has the advantages of being small in size, high in self-locking force, capable of being repeatedly plugged and unplugged, simplified in manufacturing process and the like, can remarkably reduce the contact failure risk caused by mechanical vibration, and meets the development requirements of high-reliability flexible electronic products in the future. The pluggable interface between the flexible sensor and the mobile detector is arranged between the flexible sensor and the wearable mobile detector, and is suitable for a non-invasive continuous blood glucose monitoring and wearable medical electronic system.

The application discloses a kind of polyimide composite film drying device and production system, polyimide composite film drying device includes for the polyimide substrate film surface coating emulsion formed by polyimide composite film passing and carrying out microwave heating drying microwave heating area and for the polyimide composite film after microwave heating drying passing and carrying out infrared heating drying infrared heating area, the microwave heating area and infrared heating area are sequentially arranged and mutually communicated, and polyimide composite film sequentially passes the microwave heating area and infrared heating area along vertical direction.The application further discloses a kind of production system with above-mentioned polyimide composite film drying device.The application can be used to dry PI / PTFE composite film, and drying efficiency is high, drying effect is good, can guarantee the quality of final composite film product.

The invention discloses a manufacturing method of a large-area and light-weight flying screen. The manufacturing method specifically comprises the following steps: step 1, manufacturing a copper-clad plate; step 2, carrying out dry circuit etching on the copper-clad plate; step 3, packaging the copper-clad plate; step 4, adhering the packaged copper-clad plate and the polyimide substrate by using an adhesive; step 5, performing hole digging treatment on the copper-clad plate to obtain a square grid structure; and step 6, planting electronic components on the circuit etched in the step 2, and arranging control chips of the electronic components at the four vertexes of the grid structure obtained in the step 5. The flying screen manufactured by the method has the characteristics of large area, light weight and consistent color display.

The surface activation method of the polyimide substrate comprises the following steps: providing an activating agent which is a nitrogen-containing weak base solution; coating the activating agent on the surface of a polyimide substrate, and reacting for a preset time at a preset temperature; and washing and drying the polyimide substrate. The method is simple and effective, the polyimide substrate is subjected to surface activation, functional groups on the surface of the polyimide substrate react to achieve surface activation, and when the polyimide substrate is applied to coating preparation and adhesives, the coating adhesion and wear resistance of the polyimide substrate can be effectively improved.

The invention discloses a high-temperature-aging-resistant electronic adhesive tape as well as a preparation method and application thereof, and aims to solve the technical problem that the high temperature resistance and adhesion stability of the conventional electronic adhesive tape are unbalanced. The electronic adhesive tape is prepared by taking modified polyimide as a base material and matching with a special glue solution through coating, drying and curing, the modified polyimide base material is prepared by ultraviolet ozone activation, silanization treatment and silica sol coating compounding, and the glue solution is prepared by compounding organic silicon modified acrylate resin, a compound fluorinated modifier, nano aluminum oxide, a cross-linking agent and a mixed solvent. The electronic adhesive tape has the advantages of high heat resistance limit, lasting adhesion at high temperature, excellent peel strength and no adhesive residue after high-temperature aging, good mechanical property and insulativity, and can be widely applied to insulation, fixation and protection of electronic and electrical equipment and electronic components.

The invention discloses a flexible integrated three-component fluxgate sensor chip. The flexible integrated three-component fluxgate sensor chip comprises an insulating ceramic cubic base and three micro electro mechanical system single-axis fluxgate sensor chips, the three micro electro mechanical system single-axis fluxgate sensor chips are arranged on the same polyimide substrate in a flexible integration mode and are respectively bonded and fixed on three mutually orthogonal adjacent side surfaces of the insulating ceramic cubic base through a polyimide-ceramic bonding technology; therefore, the miniaturized and fully-integrated three-component fluxgate sensor is formed. And the magnetic sensitive directions of the three micro electro mechanical system single-axis fluxgate sensor chips are respectively along three orthogonal directions of the insulating ceramic cubic base so as to realize detection of three components x, y and z of a magnetic field. Space positioning of three components is guaranteed by means of integrated design of the flexible integrated three-component fluxgate sensor chip, synchronous bonding and fixing of the three-component chip on the cubic base are achieved by means of bendability of the flexible substrate, and the three-component detection capacity of a magnetic field is obtained.

The invention discloses a flexible magnetic structure based on an electrofluid jet printing technology and a preparation method and application of the flexible magnetic structure. The preparation method comprises the steps that magnetic ink obtained after ultrasonic treatment is loaded into a needle head of electrofluid jet printing equipment, and a polyimide substrate obtained after UV treatment is placed on a sample table of the electrofluid jet printing equipment; the preparation method comprises the following steps: preparing a magnetic structure on a polyimide substrate according to a pre-designed layout through jet printing, and carrying out vacuum drying treatment on a magnetic structure sample after jet printing is completed to obtain the flexible magnetic structure based on the electrofluid jet printing technology, according to the preparation method, high-precision, rapid and low-cost preparation of the patterned magnetic structure on the flexible substrate can be realized by utilizing an electrofluid jet printing technology, the preparation process flow is simple, the patterned flexible magnetic structure can be customized and processed according to actual requirements, diversified application requirements are met, and the product flexibility is high.

The application discloses a kind of laser-induced graphene immune rapid low-cost remote medical detection platform, it is related to biomedical detection technical field, the platform includes following component part: sensor array module: using CO2 laser engraving technology is formed on polyimide substrate and contains 4 graphene working electrode, 1 Ag / AgCl reference electrode and 1 graphene counter electrode patterned structure, through 1-pyrene butyric acid functionalization after specific antibody is fixed and is blocked with bovine serum albumin;The application greatly reduces the detection cost by using laser engraving graphene electrode preparation process, at the same time, by constructing the sensor array module comprising four graphene working electrode, a plurality of antibodies can be specifically fixed, the simultaneous detection of SARS-CoV-2 nucleocapsid protein, spike protein specific IgM / IgG antibody and C-reactive protein and other multiplex biomarkers is realized, sample detection cycle can be controlled within 10 minutes, greatly improve detection efficiency.

The invention discloses a high-stability antistatic polyimide adhesive tape and a preparation method thereof, and belongs to the technical field of polyimide adhesive tapes. The preparation method comprises the following steps: cleaning a polyimide film; coating an ionic liquid solution with a specific concentration on the surface and drying to form an ionic liquid interface layer; then anti-static slurry is coated, and preliminary drying is carried out; carrying out interface fusion leveling treatment on the wet coating, namely, carrying out uniform pressure through a silica gel uniform pressure roller at a certain pressure and roller speed; and finally, performing segmented high-temperature curing to obtain a finished product. Wherein the ionic liquid is 1-hexyl-3-methylimidazolium tetrafluoroborate, and the ionic liquid is 1-hexyl-3-methylimidazole tetrafluoroborate. Through the synergistic effect of ionic liquid molecule anchoring and an interface fusion leveling process, the interface bonding force and stability between the anti-static coating and the polyimide base material are greatly enhanced, the problems that a traditional coating is easy to peel off and the anti-static performance is degraded are effectively solved, and the prepared adhesive tape has lasting and stable anti-static performance.

Anti-friction composite material having: (A) polyimide substrate and (B) a coating layer containing a binder resin and a solid lubricant.

A low-noise room-temperature resistance NO2 sensor based on MoBT x / ZnO composite material and a preparation method thereof belong to the technical field of gas sensors. The sensor is composed of a polyimide substrate with a gold-nickel double-layer composite interdigital electrode and a MoBT x / ZnO composite material sensitive electrode prepared on the interdigital electrode and the substrate. The MoBT x MBene material is used as a matrix, two-dimensional ZnO is in-situ grown on the MoBT x sheet layer surface through a hydrothermal reaction, the MoBT x sheet layer is closely adhered to the ZnO sheet layer in a large area and forms a lattice coupling, thereby constructing a two-dimensional heterostructure which is continuous, penetrative and has rich edge active sites. The structure can increase the effective heterojunction interface area, enhance the interface modulation effect and significantly enhance the dissipation of disturbance energy. The structure is used as a sensitive material, thereby preparing a high-performance gas sensor. Experiments show that the sensor based on MoBT x / ZnO can inhibit the sensor noise from the root, has high selectivity, high response and low detection limit for NO2 at room temperature.

The invention discloses a miniaturized low-profile flexible ocean galvanic couple type pH sensor and a preparation method thereof, and aims to solve the problems of large profile thickness and insufficient reliability of the conventional flexible pH sensor. A working electrode system and a reference electrode system in the miniaturized low-profile flexible ocean galvanic couple pH sensor are arranged on a flexible polyimide substrate, and the working electrode system comprises an iridium oxide working electrode, a first metal conduction circuit layer and a first metal bonding pad; the iridium oxide working electrode is connected with the first metal bonding pad through the first metal conduction circuit layer, the reference electrode system comprises a reference electrode, a second metal conduction circuit layer and a second metal bonding pad, and the reference electrode is connected with the second metal bonding pad through the second metal conduction circuit layer. The pH response performance is remarkably improved by utilizing the nanocrystalline iridium oxide sensing layer, the sensitivity reaches 72.76 mV / pH, and 16.84 s quick response is realized in a high-flow-velocity marine environment of 3 m / s.

According to an example embodiment of the disclosure, a display device includes a display panel divided into a display area and a non-display area and including a substrate, a transistor disposed above the substrate and disposed in the display area, a flexible film disposed on a side surface of the non-display area and connected to the substrate, and a conductive layer disposed below the substrate and applied with a low potential power voltage from the flexible film to improve edge aging due to polarization by canceling positive charges in a polyimide substrate.

The invention relates to the technical field of flexible device manufacturing, in particular to a filling method of a polyimide vertical through hole and a preparation method of a flexible probe. The filling method provided by the invention comprises the following steps: placing a polyimide substrate with a vertical through hole in a sodium hydroxide solution for ring-opening reaction to obtain a first intermediate; placing the first intermediate in a seed layer solution for ion exchange to obtain a second intermediate; the second intermediate is placed in a solution containing thiourea and sodium borohydride for a reduction reaction, a seed layer is formed on the hole wall of the vertical through hole, and a third intermediate is obtained; placing the third intermediate in a chemical plating solution for metal filling; ultrasonic waves are applied in the metal filling process. The filling method is simple, the cost is low, and the coating is uniform.

This invention discloses a method and apparatus for detecting delamination defects in ceramic matrix composites using a flexible microwave resonator. The apparatus includes a flexible microwave resonator, a vector network analyzer, a two-dimensional scanning platform, and a data processing unit. The flexible microwave resonator consists of a polyimide substrate, a top-opening resonant ring, and a bottom coplanar waveguide feeding structure, conformally attached to the surface to be tested due to its flexibility. The method acquires S11 curves at various points by scanning, extracts the resonant frequency as a feature value, and finds that the resonant frequency offset has a monotonically changing relationship with the depth of the delamination defect. By constructing a resonant frequency distribution image, high-sensitivity localization, imaging, and quantitative depth inversion of delamination defects in ceramic matrix composites are achieved. This invention solves the problems of rigid sensors being unable to adapt to curved surface detection and low sensitivity for small defects, and is suitable for non-destructive testing of complex components such as aero-engine blades.

The invention discloses a high-temperature-resistant glue-blocking release film and a production method thereof, and the method comprises the following steps: carrying out ultraviolet ozone treatment on a polyimide base material, immersing the polyimide base material into sol containing a structure-directing agent P123, and carrying out hydrothermal treatment at 150-180 DEG C by a Czochralski method to form a horizontal orientation mesoporous titanium dioxide anchoring layer; preparing a composite release coating formed by mixing a fluorocarbon shape memory polymer solution and a surface-modified high-temperature-resistant polymer microsphere dispersion liquid; and coating an anchoring layer with the composite material, carrying out ultraviolet curing, and then carrying out thermal shaping treatment at 130-135 DEG C. The prepared release film comprises a base material layer, an anchoring layer and a dynamic crosslinking release layer, after the release film is subjected to hot pressing at 180 DEG C and 150 bar, the stripping force between the release film and epoxy resin is 5-20 gf / in, the residual quantity of silicon is lower than 1 ppm, the stripping force fluctuation does not exceed + / -15% after 10 times of hot pressing circulation, no coating falls off or cracks exist, and the release film has the advantages of high adhesive force, high adhesive force and the like. And the industrial problem that high-precision glue blocking and clean release are difficult to take into account in the manufacturing process of the high-end flexible circuit board is perfectly solved.

The invention relates to the technical field of brazing, and discloses a solder mask adhesive tape and a preparation method and application thereof.The solder mask adhesive tape is composed of a polyimide base material and a solder mask layer, and the solder mask layer comprises the following components of 2-ethylhexyl acrylate, 2-ethylhexyl acrylate, 2-ethylhexyl acrylate, 2-ethylhexyl acrylate, 2-ethylhexyl acrylate, 2-ethylhexyl acrylate and 2-ethylhexyl acrylate; acrylic acid; acrylic acid-2-hydroxyethyl ester; a furan methacrylate; a maleimide; the catalyst is 2, 2, 4, 6-trimethylbenzoyl-diphenyl phosphine oxide; a perfluoropolyether-based surfactant; a core-shell nano solder resist; a bifunctional quantum dot additive; and perfluoropolyether glue or polytetrafluoroethylene-based paint. Through reversible bonding reconstruction of a dynamic covalent cross-linked network, gradient thermal expansion matching of a core-shell nano solder resist and a free radical capture synergistic mechanism of a quantum dot bifunctional interface, a gradient curing process and a high-pressure homogenization-electric field directional dispersion technology are combined; the problems of self-repairing vacancy, thermal stress concentration and interface layering failure of the solder resist material under extreme working conditions are solved, the thermal shock resistance is improved, and the service life is prolonged.

The invention provides a flexible solar wing substrate structure and a preparation process, and belongs to the technical field of spacecraft power supply subsystems. The flexible solar wing substrate structure comprises a polyimide film layer, a flexible circuit board and at least one flexible substrate reinforcing layer made of a fiber reinforced polymer matrix composite material. The components are integrally formed through co-curing, and the flexible circuit board is embedded in the polyimide base material and has the functions of flexibility and circuit communication; the edge of the substrate is pre-bent to form a flexible hinge with a round rod, so that the folding reliability is improved; and a co-cured fiber composite reinforcing sheet can be selectively arranged to enhance the structural strength. The structure is light in weight, thin in thickness and suitable for a large-interval cold and hot circulation space environment, the manufacturing process is remarkably simplified, the size and the mass are reduced, the folding service life of the spacecraft solar wing is prolonged, and the structural stability is enhanced.

The invention relates to a flexible brain-computer interface with high mechanical stability and a preparation method, and belongs to the field of bioelectronics. The interface comprises a flexible polyimide substrate; the composite metal microelectrode layer is formed on the flexible polyimide substrate through a vacuum evaporation process, the composite metal microelectrode layer comprises a chromium layer serving as a transition bonding layer and a gold layer serving as a conductive functional layer, the chromium layer is in direct contact with the flexible polyimide substrate so as to enhance the interface bonding strength, and the gold layer covers the chromium layer; and the photosensitive polyimide packaging layer is formed by patterning through a photoetching process and covers the composite metal microelectrode layer and part of the flexible polyimide substrate, and the photosensitive polyimide packaging layer is provided with a window which exposes part of a gold layer in the composite metal microelectrode layer to serve as an electrode contact site and an electrode bonding pad. The core problems that the interface bonding force between the existing titanium-based metal microelectrode and the flexible substrate is weak, and the mechanical-electrical stability is difficult to cooperate under long-term implantation are solved.

In a semiconductor device, a first lead frame (310) and a second lead frame (320) are fixed to a metal conductor base (100) by an organic insulating film (600) made of a polyimide-based material. The organic insulating film satisfies the following relationship: t press1 > t cast1 > t press2 > t cast1 where t press1 is the thickness of a portion of the organic insulating film sandwiched between the metal conductor base and the first lead frame, t press2 is the thickness of a portion of the organic insulating film sandwiched between the metal conductor base and the second lead frame, and t cast1 is the thickness of a portion of the organic insulating film not sandwiched between the metal conductor base and the first lead frame and not sandwiched between the metal conductor base and the second lead frame.

A technology using laser thin-film electrode structure processes in a gas detection chip is provided. Different from traditional chemical etching or long pulse laser processing methods, a manufacturing method of the gas detection chip uses an ultrafast laser process to manufacture thin-film composite structures in gas detection development, and employs a multi-scale composite structure made of flexible materials (e.g., polyimide substrates) for gas detection. The gas detection chip prepared by the manufacturing method meets the demand for portable micro gas detection.

The utility model discloses a kind of three-dimensional combined sealing structures of heterogeneous chip based on die attach film, it is related to the field of semiconductor packaging technology, including middle layer substrate, the double-sided integration RDL layer of middle layer substrate, and the position of middle layer substrate corresponding RDL layer is formed LCV copper via by laser drilling;The upper of middle layer substrate is respectively provided with display drive IC and touch sensor IC, and display drive IC and touch sensor IC are formed with micro copper column bump on the side close to middle layer substrate, the utility model, by adopting flexible polyimide substrate as the interlayer of carrier, double-sided rewiring, form micro via array by laser drilling, inner wall fills nano copper paste, LCV copper via is formed by low-temperature sintering;Upper chip is flip-chip soldered on die attach film circuit by micro copper column bump, interconnection is realized by the wiring on die attach film, and NCF is filled in the gap between upper chip and interlayer;Lower substrate pad is directly interconnected with die attach film circuit by LCV copper via.

The invention discloses a flexible strain sensor for measuring deformation of an oil and gas transmission pipeline and a measuring method, and belongs to the technical field of pipeline structure health monitoring. The flexible strain sensor comprises a flexible printed circuit board, four strain gauges, two thermistors and a flat cable connector, the FPC is made of polyimide base materials, the four strain gauge preformed holes are arranged at equal intervals in the circumferential direction, the two thermistor preformed holes are located in the middle and symmetrically distributed, and all the sensors are electrically connected with the FPC through laser welding. The thermistor measures the temperature in real time, and temperature compensation is achieved through a polynomial algorithm. The FPC can integrate an MEMS accelerometer, an acoustic emission sensor and an ASIC chip, and cooperates with an edge AI terminal to realize local anomaly detection and data compression. The flexible strain sensor is adhered in an anticorrosive coating on the outer wall of a pipeline, does not influence the anticorrosive effect, is convenient to mount, can be connected with a static strain gauge through a flat cable connector, and can also be matched with a wireless acquisition module to realize remote intelligent monitoring.

The application provides a laser-induced graphene smart honeycomb structure material and a preparation method, a smart sandwich honeycomb structure material and application, and belongs to the technical field of smart honeycomb structure materials.The application comprises the following steps: laser-induced double-sided polyimide substrates are obtained, the laser-induced double-sided polyimide substrates comprise a first graphene layer, a polyimide layer and a second graphene layer which are arranged in a stack; at least two layers of the laser-induced graphene substrates and a plurality of thermoplastic core strip glues are assembled, and then sequentially subjected to hot pressing, stretching, glue dipping and curing to obtain the laser-induced graphene smart honeycomb structure material; and a plurality of the thermoplastic core strip glues are arranged in parallel between the two adjacent layers of the laser-induced graphene substrates.The application combines laser-induced technology and honeycomb manufacturing technology to realize in-situ integrated manufacturing of the laser-induced graphene smart honeycomb structure material, and has the advantages of simple operation, low cost, high efficiency and mild preparation conditions, and is convenient for realizing the regulation of structure, size and function.