Device capable of thermally cooling while electrically insulating
a multi-layer device and thermal insulation technology, applied in the direction of semiconductor/solid-state device details, lighting and heating apparatus, other domestic objects, etc., can solve the problems of increasing the need for thermal dissipation and electrical insulation, and losing operational efficiency
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example 1
[0191]Example 1 illustrates the use of a Kapton® 200 CR polyimide film and a formulated ethylene vinyl acetate (EVA) copolymer adhesive. A 50 micron (2 mil) Kapton® 200 CR film is coated with an aqueous dispersion of tetrafluoroethylene hexafluoropropylene which is subsequently dried and cured to a fluoropolymer film of about 2.5 micron (0.1 mil) thickness. Two of these fluoropolymer coated polyimide films are subsequently laminated together with the fluoropolymer layers facing each other to yield a multilayer film of about 105 microns (4.2 mil) total thickness. Onto this composite film, BixCure, a formulated ethylene vinyl acetate (EVA) copolymer is extrusion coated to a thickness of about 25 microns (1 mil) to 75 microns (3 mil). Bonding results between the adhesive and the polyimide film are shown in table 1. This adhesive coated polyimide film was subsequently laminated to an aluminum plate and the EVA copolymer layer cured to yield an electrically insulating, thermally conducti...
example 2
[0192]Example 2 illustrates the use of a Kapton® 200 CR polyimide film and Elvaloy 4170 adhesive.
[0193]The sample is prepared in a similar manner to example 1.
[0194]Results are shown in tables 1 and 2.
example 3
[0195]Example 3 illustrates the use of a Kapton® 200 CR polyimide film and Nucrel 0910 adhesive.
[0196]The sample is prepared in a similar manner to example 1.
[0197]Results are shown in tables 1 and 2.
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