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Device capable of thermally cooling while electrically insulating

a multi-layer device and thermal insulation technology, applied in the direction of semiconductor/solid-state device details, lighting and heating apparatus, other domestic objects, etc., can solve the problems of increasing the need for thermal dissipation and electrical insulation, and losing operational efficiency

Inactive Publication Date: 2009-09-17
EI DU PONT DE NEMOURS & CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Integrated circuits are increasingly being manufactured at smaller feature dimensions and higher densities, resulting in an increased need for thermal dissipation and electrical insulation.
Similarly, thermal dissipation and electrical insulation are also important for photovoltaic systems, which tend to require a highly (electrically) insulated environment for collecting and distributing electrical current and also tend to lose operational efficiency with increasing temperature.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0191]Example 1 illustrates the use of a Kapton® 200 CR polyimide film and a formulated ethylene vinyl acetate (EVA) copolymer adhesive. A 50 micron (2 mil) Kapton® 200 CR film is coated with an aqueous dispersion of tetrafluoroethylene hexafluoropropylene which is subsequently dried and cured to a fluoropolymer film of about 2.5 micron (0.1 mil) thickness. Two of these fluoropolymer coated polyimide films are subsequently laminated together with the fluoropolymer layers facing each other to yield a multilayer film of about 105 microns (4.2 mil) total thickness. Onto this composite film, BixCure, a formulated ethylene vinyl acetate (EVA) copolymer is extrusion coated to a thickness of about 25 microns (1 mil) to 75 microns (3 mil). Bonding results between the adhesive and the polyimide film are shown in table 1. This adhesive coated polyimide film was subsequently laminated to an aluminum plate and the EVA copolymer layer cured to yield an electrically insulating, thermally conducti...

example 2

[0192]Example 2 illustrates the use of a Kapton® 200 CR polyimide film and Elvaloy 4170 adhesive.

[0193]The sample is prepared in a similar manner to example 1.

[0194]Results are shown in tables 1 and 2.

example 3

[0195]Example 3 illustrates the use of a Kapton® 200 CR polyimide film and Nucrel 0910 adhesive.

[0196]The sample is prepared in a similar manner to example 1.

[0197]Results are shown in tables 1 and 2.

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PUM

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Abstract

The present disclosure relates to a device for thermally cooling while electrically insulating. The device contains a first adhesive layer, polyimide substrate, a second adhesive layer and a heat sink. The first adhesive layer and the second adhesive layer are a vinyl or acrylic polymer. The polyimide substrate has at least two polyimide layers. The polyimide layers are derived from at least one aromatic dianhydride and at least one aromatic diamine. The adhesive layers and the polyimide layers may contain thermally conductive fillers, light absorbing pigments or mixtures of both.

Description

FIELD OF DISCLOSURE[0001]The present disclosure relates generally to multilayer device for thermal dissipation and electrical insulation. More specifically, the device comprises a filled polyimide film that can be bonded to a metal heat sink on one side and to an electronic component on the other, thereby electrically insulating the electronic component while also conducting heat away from the circuit.BACKGROUND OF THE DISCLOSURE[0002]In the field of electronic components, including photovoltaic cells, both heat dissipation and electrical insulation are becoming increasingly important. Integrated circuits are increasingly being manufactured at smaller feature dimensions and higher densities, resulting in an increased need for thermal dissipation and electrical insulation. Similarly, thermal dissipation and electrical insulation are also important for photovoltaic systems, which tend to require a highly (electrically) insulated environment for collecting and distributing electrical c...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28F7/00
CPCB32B7/12H01L31/054B32B27/28H01L23/3737H01L24/30H01L24/33H01L31/048H01L31/052H01L2224/73253H01L2924/01004H01L2924/01013H01L2924/0103H01L2924/01033H01L2924/01047H01L2924/01082H01L2924/14H01L2924/19041H01L2924/19042H01L2924/19043Y02E10/52H01L2924/01005H01L2924/01006H01L2924/01023H01L2924/01024H01L2924/01074B32B15/08B32B15/20B32B27/08B32B27/16B32B27/18B32B27/20B32B27/281B32B27/30B32B27/304B32B27/306B32B27/308B32B27/322B32B2255/10B32B2255/26B32B2264/10B32B2264/102B32B2307/206B32B2307/30B32B2307/302B32B2307/306B32B2307/71B32B2307/714B32B2457/12H01L31/0481Y02E10/50
Inventor AUMAN, BRIAN C.HAEGER, CARLLACOURT, PHILIP ROLANDMCALEES, MARK ELLIOTTMERRITT, STANLEY DUANEPREJEAN, GEORGE WYATTTATE, HARLAND LEE
Owner EI DU PONT DE NEMOURS & CO
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