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Method for opening window on polyimide base material of flexible printed circuit board and its etching fluid

A printed circuit board and polyimide technology, applied in the field of materials, can solve problems such as impossibility, high requirements for operators, and production limitations of flexible circuit boards, etc., and achieve the effect of easy preparation, economical raw materials, and meeting precision requirements

Inactive Publication Date: 2007-04-25
UNIV OF ELECTRONICS SCI & TECH OF CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] For developing flexible printed board enterprises, choosing plasma etching and laser ablation is not ideal, the initial investment and maintenance costs are too high, and the requirements for operators are also high
However, the use of mechanical punching can only be used in some single-sided or double-sided flexible circuit boards that do not require high precision, but it cannot complete the production of small, high-density flexible circuit boards with high added value. Restrict the company's production and development

Method used

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  • Method for opening window on polyimide base material of flexible printed circuit board and its etching fluid
  • Method for opening window on polyimide base material of flexible printed circuit board and its etching fluid
  • Method for opening window on polyimide base material of flexible printed circuit board and its etching fluid

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0061] Preparation of etchant

[0062] Weigh 106Kg of KOH and 6Kg of NaOH, add pure water to 200L, stir to dissolve. Since the dissolution of alkali in water is an exothermic reaction, when the mixed alkali is completely dissolved, the solution temperature is about 100 degrees Celsius, properly heated and stabilized to 110 degrees Celsius.

[0063] Add additive 1, such as 5 kg of benzotriazole (BTA) and additive 2, such as 2 kg of mercaptobenzothiazole (MBT), and stir to dissolve them completely. Then add penetrant, such as potassium salt of alkylphenol polyoxyethylene phosphate 800mg.

[0064] After the etchant is prepared, process the 4342w / A type FPC board according to the method of opening a window on the polyimide base material of the flexible printed circuit board according to the present invention, wherein the engraved The etching time is controlled at about 3 minutes and 30 seconds, and finally the engraved windows are neat, without side erosion or erosion, and the p...

specific Embodiment approach 2

[0065] Weigh 106Kg of KOH and 7.5Kg of NaOH, add pure water to 200L, stir to dissolve. Since the dissolution of alkali in water is an exothermic reaction, when the mixed alkali is completely dissolved, the solution temperature is about 100 degrees Celsius, properly heated and stabilized to 110 degrees Celsius.

[0066] Add additive 1, such as benzotriazole (BTA) 7kg, stir to make it dissolve completely. Then add penetrant, such as potassium salt of alkylphenol polyoxyethylene phosphate 800mg.

[0067] After the etchant is prepared, process the 4342w / A type FPC board according to the method of opening a window on the polyimide base material of the flexible printed circuit board according to the present invention, wherein the engraved The etching time is controlled at about 3 minutes, and finally the engraved windows are neat, without side etching and erosion, and the precision meets the design requirements.

specific Embodiment approach 3

[0068] Weigh 116Kg of KOH and 7.5Kg of NaOH, add pure water to 200L, stir to dissolve. Since the dissolution of alkali in water is an exothermic reaction, when the mixed alkali is completely dissolved, the solution temperature is about 100 degrees Celsius, properly heated and stabilized to 110 degrees Celsius.

[0069] Add additive 1, such as 5 kg of benzotriazole (BTA) and additive 2, such as 4.5 kg of mercaptobenzothiazole (MBT), and stir to dissolve them completely.

[0070] After the etchant is prepared, process the 4342w / A type FPC board according to the method of opening a window on the polyimide base material of the flexible printed circuit board according to the present invention, wherein the engraved The etching time is controlled at about 3 minutes and 10 seconds, and finally the engraved window is neat, but there is a little side etching and erosion, and the precision meets the design requirements.

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Abstract

The invention relates to a method for opening window on the polyimide substrate of flexible printed circuit board. Wherein, it comprises that pretreatment (removing oil, washing and drying), chemical etching pretreatment (plastering film, exposure, and developing), chemical etching, and etching following treatment (washing, removing film, washing and drying). The etching liquid is the mixed solution of caustic potash and caustic soda, while it can be added with azimido-benzene (BTA) and derivate additive 1 or / and mercaptobenzothiazole (MBT) and derivate additive 2, and micro penetrant. The invention has low cost and high accuracy.

Description

technical field [0001] The invention relates to a method for opening a window on a polyimide base material of a flexible printed circuit board and an etching solution thereof, which belong to the technical field of materials, and in particular relate to the processing technology of a flexible printed circuit board. Background technique [0002] A flexible printed circuit board is usually a printed circuit board based on polyimide (PI), and a flexible printed circuit board usually has a three-layer (single-sided) or five-layer (double-sided) structure. As shown in Figures 1 and 2, 1 is the PI substrate layer, 2 is the copper foil layer (circuit layer), and 3 is the acrylic adhesive layer; now there are also flexible printed circuits without acrylic adhesive layers Board, this flexible printed circuit board is a two-layer (single-sided) or three-layer (double-sided) structure. The thickness of the entire circuit board is about a few tenths of a millimeter. Usually, there is ...

Claims

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Application Information

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IPC IPC(8): H05K3/06H05K3/26H05K3/00
Inventor 何为汪洋王慧秀袁正希何波刘美才吴志强
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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