Flexible circuit board manufacturing method

Abstract

The invention provides a flexible circuit board manufacturing method. The flexible circuit board manufacturing method at least comprises the following steps that 1, a first circuit board to be bonded and a second circuit board to be bonded are provided, wherein the first circuit board to be bonded and the second circuit board to be bonded respectively comprise a polyimide substrate and a copper line, each polyimide substrate is provided with a plurality of through holes, each copper line is formed on one face of the corresponding substrate, and the copper lines cover the through holes to serve as bonding pads; 2, the bonding pads, needing to be bonded, on the first circuit board to be bonded and the second circuit board to be bonded are stretched, and bonding pad convex points are formed on the to-be-bonded faces of the bonding pads; 3, the first circuit board to be bonded and the second circuit board to be bonded are stacked, so that the bonding pad convex points make contact to form junction points; 4, pulse voltage is exerted on the two ends of the jointed bonding pads so that welding current can be generated, and the junction points are at a high temperature instantaneously and in a molten state, so that the jointed bonding pads are welded in a fusion mode. The bonding pads are welded in the fusion mode in a pulse voltage spot welding mode, the flexible circuit board holes can be communicated and connected, the process is simple and efficient, and meanwhile good economic benefits and social benefits are obtained.

Description

technical field [0001] The invention belongs to the field of printed circuits and relates to a method for manufacturing a flexible circuit board. Background technique [0002] The key process for the development of flexible circuit boards (Printed Circuit Board, hereinafter referred to as FPC) to multi-layer is "hole penetration". Drilling → chemical method or plasma process to remove dander and residual scum in the "hole" → copper plating (PTH) or black hole → copper plating → pressing photosensitive film → exposure → subsequent processing. [0003] The industry has been discussing for more than ten years: printed circuit board hole metallization technology is one of the keys to printed circuit board manufacturing technology. For a long time, people have been using electroless copper (PTH) method, but the PTH solution contains harmful ecological Various environmental chemical substances such as carcinogenic formaldehyde are complex and costly to treat wastewater; in additi...

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Problems solved by technology

[0008] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a method for manufacturing a flexible circuit board, which is used to solve the problem of complicated hole penetration process and large environmental pollution when making a flexible circuit board in the prior art. Frequent heating of the base material leads to the problem of hole offset

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