The invention relates to a method for non-destructively testing a connection point (10) in a component
assembly, comprising a base layer (14), at least one cover layer (16), and a connection element (12a, 12b) with a head (18a, 18b) and a shaft (22a, 22b). The connection point (10) is formed between the shaft (22a, 22b) of the connection element (12a, 12b) and the base layer (14), and the cover layer (16) has a
thermal conductivity which is greater than that of the base layer (14) and the connection element (12a, 12b). The test is carried out by means of a thermal imaging camera (34) and an
inductor (36) which is arranged on the component
assembly side opposite the thermal imaging camera (34). The
inductor (36) is inductively excited by means of a pulse via an
active surface of the base layer (14) at an excitation time. Furthermore: • at a first detection time, a
reference image of the connection point (10) is captured by the thermal imaging camera (34), the head (18a, 18) being imaged in said
reference image as a
head surface area (20a, 20b); • at a second detection time (44), a test image which is analogous to the
reference image is captured, said second detection time (44) occurring after the first detection time and a specified duration after the excitation time; • an analysis region (42) is defined in the test image and / or in the reference image, wherein the analysis region (42) at least partly comprises the
head surface (20a, 20b), and the analysis region (42) is divided into sub-regions, in particular pixels, said sub-regions being assigned a temperature value; • a temperature change value is formed using a rule on the basis of the temperature values of the corresponding sub-regions of the reference and test image; • on the basis of the temperature change value, an "OK" value is formed if the temperature change lies in a pre-defined temperature interval with at least one lower boundary; and • the connection point (10) is classified in that the sum of the sub-regions with an "OK" value is compared with a reference interval with at least one specified lower interval boundary. The connection point (10) is classified as an "OK" connection if the sum lies in the reference interval, otherwise the connection point (10) is classified as a "not OK" connection.