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Interlayer interconnection technology

A technology of interlayer interconnection and process, applied in the direction of circuit lamination, electrical connection formation of printed components, electrical components, etc., can solve the problems of complex process and product expansion and contraction, and achieve the effect of simple steps and avoiding expansion and contraction

Inactive Publication Date: 2016-12-21
山东蓝色电子科技有限公司
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Problems solved by technology

[0006] The problem with the current technology is: the process is complicated, and the wet process has a great impact on the expansion and contraction of the product

Method used

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  • Interlayer interconnection technology

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Embodiment Construction

[0015] combined with figure 1 , to further describe the present invention:

[0016] An interlayer interconnection process mentioned in the present invention adopts the following steps:

[0017] a. It is to roughen the copper surface;

[0018] b. Use wire bonding equipment to make gold bumps on the copper surface that needs to be interconnected. The height of the gold bumps is 50~70um;

[0019] c. It is the covering glue layer, the glue thickness is 25um; the adhesive glue layer used can be any one of epoxy resin glue, acrylic glue or liquid crystal polymer glue.

[0020] d. The copper on the other side is thermally bonded to its opposite position at a temperature of 140 degrees for 4 hours to complete the interlayer interconnection.

[0021] The invention has the advantages of solving the problems in the prior art that the process is complicated and that the wet process has a great influence on the expansion and contraction of the product. The dry process is adopted in the ...

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Abstract

The invention relates to the field of circuit board manufacture and specifically an interlayer interconnection technology. A technical solution of the interlayer interconnection technology comprises the following steps: a copper surface is subjected to coarsening operation, gold protrusions are manufactured on the copper surface which needs to be interconnected via a wire bonding device, the gold protrusions range from 50 um to 70 um in height, the copper surface is covered with an adhesive layer which is 25 um is thickness, another copper face is hot-pressed on the copper surface in an aligned manner at a temperature of 140 DEG C incessantly for 4 hours, and interlayer connection can be accomplished. The beneficial effects of the interlayer interconnection technology are that procedural complexity in technologies of the prior art can be overcome, a problem that great effects are exerted on product swelling and shrinking by wet manufacture processes can be solved, a dry manufacture process solution is adopted in the interlayer interconnection technology, only simple steps are needed, and a problem of product swelling and shrinking can be prevented.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to an interlayer interconnection process. Background technique [0002] With the development of science and technology, various electronic products have brought more and more convenience to people's daily life, and most of these products have the characteristics of light weight and thin thickness. Therefore, multilayer interconnected circuit boards Become the development focus of major electronic product manufacturers. The Chinese patent literature patent number is CN200710039305.3, which announces a method for manufacturing a printed circuit board. The technical solution adopted is a method for forming lines and realizing interlayer interconnection based on electroplating hole filling and semi-additive methods. The process of interlayer interconnection is still realized in the traditional way: drilling -> electroplating. [0003] Chinese patent 201310270208.0 announc...

Claims

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Application Information

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IPC IPC(8): H05K3/40
CPCH05K3/4007H05K2203/06
Inventor 王健孙彬
Owner 山东蓝色电子科技有限公司
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