Rigid-flex board for protecting inner layer window opening area and manufacturing method thereof
A technology of rigid-flex board and production method, applied in the field of rigid-flex board, can solve the problems of short circuit of rigid-flex board and the production efficiency of explosion board, and achieve the effect of saving production cost, avoiding internal stress and reducing the risk of board explosion
A technology of rigid-flex board and production method, applied in the field of rigid-flex board, can solve the problems of short circuit of rigid-flex board and the production efficiency of explosion board, and achieve the effect of saving production cost, avoiding internal stress and reducing the risk of board explosion
CN103384444BActive Publication Date: 2016-04-20BOMIN ELECTRONICS CO LTD +1
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[0027] refer to figure 1 and figure 2 As shown, a rigid-flexible board for protecting the window opening area of the inner layer of the present invention includes a flexible board 1 and rigid boards 2 arranged on the upper and lower sides of the flexible board 1, and the window opening area on the flexible board 1 There are soldering pads or gold fingers 1a inside; between the flexible board 1 and the rigid board 2 on the upper and lower sides of the flexible board 1, a flexible board cover film 3 and a pure rubber film 4 are respectively arranged in sequence from the inside to the outside, The cover film 3 of the flexible board is provided with a cover film window 3a adapted to the pad or golden finger 1a, and the pure rubber film 4 is provided with a pure rubber film window 4a adapted to the window area; A covering film protective layer 5 is provided between the pure rubber film 4 and the rigid board 2; several slits 2a are arranged at intervals along the outer contour o...
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The invention discloses a rigid-flex printed circuit board capable of protecting an inner layer windowing area and a production method thereof and belongs to the technical field of rigid-flex printed circuit boards. The rigid-flex printed circuit board is characterized by comprising a flex board and rigid boards arranged on the upper lateral surface and the lower lateral surface of the flex board, and pads or golden fingers are arranged in a windowing area disposed on the flex board. Flex board cover films and pure adhesive films are sequentially arranged between the flex board and the rigid boards arranged on the upper lateral surface and the lower lateral surface of the flex board from inside to outside, cover film windows adaptive to the pads or the golden fingers are arranged on the flex board cover films, pure adhesive film windows adaptive to the windowing area are arranged on the pure adhesive films, and cover film protection layers are arranged between the pure adhesive films and the rigid boards. A plurality of cutting joints are arranged on the rigid boards at intervals along the outer contour of the windowing area. The rigid-flex printed circuit board is reasonable in structure, high in production efficiency and good in use effect and is used for producing printed circuit board products.
Description
technical field [0001] The present invention relates to a rigid-flexible combination board, and more specifically relates to a rigid-flexible combination board for protecting the window opening area of an inner layer. The present invention also relates to a manufacturing method of the above-mentioned rigid-flex board. Background technique [0002] With the rapid development of electronic products towards high density and miniaturization, Rigid-flex Printed Circuit Board (Rigid-flex Printed circuit Board) is a printed circuit board combined with a rigid board on different areas of a flexible board, achieving rigidity in the rigid-flex area. The electrical performance connection of the board and the flexible board, because it has the characteristics of small size, movable, and can meet the needs of three-dimensional packaging, and can significantly reduce the size and space of electronic packaging, in aviation, computers, digital cameras, mobile phones, etc. Electronic devi...
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Patent Timeline
20 Apr 2016
Publication
CN103384444B
- IPC
- H05K1/11; H05K1/02; H05K3/00
- Inventors
- 冯立; 刘振华