Method for once molding inner-layer line of multilayer flexible circuit board

Abstract

The invention discloses a method for once molding an inner-layer line of a multilayer flexible circuit board, and technical problems to be solved are improving the production efficiency and the qualified rate of products. The method for once molding the inner-layer line of the multilayer flexible circuit board comprises the following steps of: pasting a dry film in a whole roll, manufacturing an inner-layer line board of a multilayer board of a flexible circuit board, manufacturing an inner-layer line-board layer, manufacturing an inner-layer line-board combined layer, and manufacturing the inner-layer line of the multilayer flexible circuit board. Compared with the prior art, the processing flows of dry-film pasting, exposing, developing, etching, film removing, microetching and pressing are adopted by the invention to manufacture the inner-layer line board, the inner-layer line-board layer, the inner-layer line-board combined layer and the multilayer flexible circuit board, so that problems of height drop generated between a glued area and a non-glue area after inner-layer soft boards are pressed and expansion and shrinkage of the soft boards caused by pressing an inner-layer covering film for many times are avoided, the quality of the multilayer flexible circuit board is improved, the qualified rate reaches more than 92 percent, the process flow is shortened, and the production rate is improved.

Description

technical field [0001] The invention relates to a manufacturing process of a circuit board, in particular to a manufacturing process of a flexible circuit board. Background technique [0002] In the existing technology for producing flexible circuit boards, the commonly used production process for the inner layer circuit of four to eight layer boards is: the inner layer base material is stacked layer by layer and then pressed and solidified, and then the inner layer circuit is made. This method leads to After lamination of the soft board, the height of the glued area and the non-adhesive area are obvious, and the dry film of the inner soft board is not solid, and the soft board is expanded and shrunk after repeated pressing of the inner cover film, which eventually leads to The qualified rate of products is relatively low, and the production process flow of the prior art is long and the productivity is low. Contents of the invention [0003] The purpose of the present inv...

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Problems solved by technology

[0002] In the existing technology for producing flexible circuit boards, the commonly used production process for the inner layer circuit of four to eight layer boards is: the inner layer base material is stacked layer by layer and then pressed and solidified, and then the inner layer circuit is made. This method leads to After lamination of the soft board, the height of the glued area and the non-adhesive area are obvious, and the dry film of the inner soft board is not solid, and the soft board is expanded and shrunk after repeated pressing of the inner cover film, which eventually leads to The qualified rate of the product is low, and the production process of the prior art is long and the productivity is low

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