Combined plate pressing process of inner-layer thin core plate and multi-layer prepregs

Abstract

The invention relates to the technical field of printed circuit plate pressing plates, in particular to a combined plate pressing process of an inner-layer thin core plate and multi-layer prepregs. By means of the plate pressing process, the appropriate glue flowing amount of the prepregs during plate pressing can be effectively controlled, it can be guaranteed that gaps between inner-layer lines are completely filled, air is exhausted, the problems of layer deviation, expansion and shrinkage, and difficult control over plate thickness uniformity and the like caused by pulling due to too large glue flowing when the inner-layer thin core plate is pressed into the multi-layer prepregs can be solved. Meanwhile, the problem of plate thickness caused by too small flowing glue is avoided, and the thickness uniformity of the plate is ensured by controlling the proper flowing glue amount, so that each inner-layer core plate and the copper foil can be completely bonded and further cured to form a whole multi-layer plate, the phenomena of no layering and plate explosion, no texture exposure, no white points, no glue shortage, no bubbles and the like on the plate surface through etching inspection are ensured, accurate control is achieved, and finally it is guaranteed that the multi-layer plate has good electrical performance and mechanical performance.

Description

technical field [0001] The invention relates to the technical field of printed circuit board pressing boards, in particular to a combined pressing board process of inner thin core boards and multi-layer prepregs. Background technique [0002] In the process of making printed circuit boards, the pressing process is to use the epoxy resin on the prepreg after high temperature and high pressure to be heated from the semi-cured state-melt-cure in a vacuum environment to fill the gap between the lines and place a piece or A process in which several core boards etched on the inner layer and copper foil on the outer layer are tightly bonded into a multi-layer board. The prepreg is completely cured by high temperature and pressure to combine the layers of the multi-layer board to ensure the electrical properties of the multi-layer board. Mechanical behavior. [0003] However, in the pressing process, a composite structure of multiple prepregs is set between the inner core boards. B...

AI Technical Summary

Problems solved by technology

[0003] However, in the pressing process, a composite structure of multiple prepregs is set between the inner core boards. Because the number of prepregs is large, the resin of the prepregs flows to the edges of the board during the pressing process, and the pulling of the flow process is likely to cause internal damage. The overall slippage of the core board, the partial expansion and contraction, and the difficulty in controlling the uniformity of the overall board thickness eventually lead to the problem that the electrical and mechanical properties of the multilayer board cannot meet the product design requirements.

Images