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A combined pressing process of inner thin core board and multi-layer prepreg

A technology of prepreg and inner core board, which is applied in multi-layer circuit manufacturing, printed circuit, electrical components, etc., and can solve problems such as local expansion and contraction, overall slippage of inner core board, difficulty in controlling board thickness uniformity, etc. , to achieve high electrical and mechanical properties, and to ensure the uniformity of plate thickness

Active Publication Date: 2022-02-11
HUIZHOU XINGSHUNHE ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the pressing process, a composite structure of multiple prepregs is set between the inner core boards. Because the number of prepregs is large, the resin of the prepregs flows to the edges of the board during the pressing process, and the pulling of the flow process is likely to cause internal damage. The overall slippage of the core board, the partial expansion and contraction, and the difficulty in controlling the uniformity of the overall board thickness eventually lead to the problem that the electrical and mechanical properties of the multilayer board cannot meet the product design requirements.

Method used

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  • A combined pressing process of inner thin core board and multi-layer prepreg
  • A combined pressing process of inner thin core board and multi-layer prepreg
  • A combined pressing process of inner thin core board and multi-layer prepreg

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The pressing board is a process that uses high temperature and high pressure to cure the prepreg (pp) by heat, and then bond one or more inner layer etched core boards and copper foils into a multi-layer board. It is a means of the whole, but when 6 layers of prepregs are placed between the inner core boards for lamination, during the lamination process, due to the large flow of glue of the 6 layers of prepregs, partial layer deviation will occur due to the pulling of the flow glue, Expansion and shrinkage lead to poor thickness uniformity of the final multilayer board, difficulty in accurately controlling the thickness, and poor electrical and mechanical properties of the obtained multilayer board.

[0034] In order to solve the above technical problems, this embodiment provides a combined pressing process of the inner thin core board and multi-layer prepreg, such as figure 1 shown, including the following steps:

[0035] S100, stack the copper foil layer, the first o...

Embodiment 2

[0062] Referring to Embodiment 1, when laminating and heating the multilayer board assembly, in steps S300-S500, this embodiment provides another set of process parameters for pressure, heating temperature, and heating time, as shown in Table 4 .

[0063]

[0064] Compared with Example 1, the heating temperature and pressure parameters of each step are roughly the same, the difference is the duration of each step, the temperature at which the prepreg turns into a glass state is 150°C, and the temperature from 80°C to 180°C will affect the transformation of the prepreg into glass The speed of the state can be calculated from the parameter table in Table 4. Through the pressing process carried out by this set of parameters, the heating rate of the middle layer multilayer board assembly is 1.68°C / min from 80°C to 175°C, and the outer layer multilayer board assembly is 1.68°C / min. The temperature rise rate of the component is 1.47°C / min, which is relatively fast compared with E...

Embodiment 3

[0066] Referring to Example 1, when laminating and heating the multilayer board assembly, in steps S300-S500, this example provides another set of process parameters for pressure, heating temperature, and heating time, as shown in Table 5 .

[0067]

[0068] Compared with Example 1, the high pressure in step S400 is reduced, the heating temperature is similar, and the time is shortened. The temperature at which the prepreg turns into a glass state is 150°C, and the temperature from 80°C to 180°C will affect the rate at which the prepreg turns into a glass state, as shown in the table It can be calculated from the parameter table of 5 that the pressing process carried out by this set of parameters, the heating rate of the middle layer multilayer board assembly is 1.42°C / min from 80°C to 175°C, and the heating rate of the outer layer multilayer board assembly is 1.37°C / min, compared with Example 1, the heating rate is faster, and the pressure and heating temperature affect th...

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Abstract

The invention relates to the technical field of printed circuit board pressing boards, in particular to a combined pressing board process of inner thin core boards and multi-layer prepregs. The pressing process of this application can effectively control the proper amount of glue flow of the prepreg when pressing the plate, which can not only ensure that the gap between the inner layer lines is completely filled and the air is removed, but also can avoid when the inner layer thin core board presses the multi-layer prepreg. Excessive flow of glue will cause problems such as layer deviation, expansion and contraction, and difficulty in controlling the uniformity of plate thickness. At the same time, it will avoid the problem of plate thickness caused by too small flow of glue. The core board and copper foil can be completely bonded, and then solidified to form a whole multi-layer board to ensure that there is no delamination and explosion. The etching inspection board surface has no texture, no white spots, no glue shortage, no bubbles, etc., to achieve accurate The control ultimately ensures that the multilayer board has good electrical and mechanical properties.

Description

technical field [0001] The invention relates to the technical field of printed circuit board pressing boards, in particular to a combined pressing board process of inner thin core boards and multi-layer prepregs. Background technique [0002] In the process of making printed circuit boards, the pressing process is to use the epoxy resin on the prepreg after high temperature and high pressure to be heated from the semi-cured state-melt-cure in a vacuum environment to fill the gap between the lines and place a piece or A process in which several core boards etched on the inner layer and copper foil on the outer layer are tightly bonded into a multi-layer board. The prepreg is completely cured by high temperature and pressure to combine the layers of the multi-layer board to ensure the electrical properties of the multi-layer board. Mechanical behavior. [0003] However, in the pressing process, a composite structure of multiple prepregs is set between the inner core boards. B...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/4611H05K2203/061H05K2203/068
Inventor 张裕伟吴志良姜辉包光先
Owner HUIZHOU XINGSHUNHE ELECTRONICS CO LTD
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