Method for manufacturing resin plug hole of thin PCB

Abstract

The invention discloses a manufacturing method of a thin PCB resin plug hole. The manufacturing method comprises the following steps of firstly, performing resin plug hole on a PCB by using a double-sided jig and an air guide cushion plate; after hole plugging is completed, the PCB and the double-sided jig being baked together; after baking is completed, the double-sided jig being polished; afterpolishing is completed, laser being used for ablating resin in the hole; the double-sided fixture is removed, and the method enter the subsequent production process. The concept of the laminated boardis creatively provided, the rigid jigs are additionally arranged on the two faces of the PCB to form the laminated board, due to the fact that the rigidity of the laminated board is large, resin on the surface of the laminated board can be removed through mechanical polishing, the resin on the surface of the laminated board is made to be located on the same plane, and then laser ablation is conducted; According to the method, problems of large expansion and shrinkage of the board, hole sinking, board surface pits and the like during resin grinding of the PCB made of the traditional PTFE material can be effectively avoided.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, and in particular relates to a method for manufacturing resin plug holes of thin PCB boards. Background technique [0002] Due to the strong momentum of miniaturization and multi-functionalization of electronic products, PCB, the "mother of electronic products", has also changed accordingly. Specifically, the thickness of the substrate used is continuously reduced, thereby reducing the size of the PCB and achieving multi-functional requirements, which poses challenges to subsequent component soldering. Specifically, the reduction in the size of the PCB leads to denser PCB wiring. The original ample soldering space is insufficient, and many in-panel structures appear. Solder is easy to flow into the back through the hole, which may lead to missing solder and short circuit. In order to solve this problem, the PCB must be plugged. [0003] The traditional plugging process is: plugging-bakin...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a thin PCB (thickness ≤ 0.5mm, the thinnest can be up to 0.1mm) resin plug hole processing method to solve various quality problems that are prone to occur in traditional grinding methods, such as plate size deformation, hole sunken mouth, etc.