Thick copper plate for different types of circuit boards and production method for circuit board

Abstract

The invention discloses a thick copper plate for different types of circuit boards and a production method for the circuit board. The thick copper plate is of a square structure, and a thick copper plate unit and a connecting area are arranged on the thick copper plate; a gong side and a connecting position are arranged at the outer side of each thick copper plate unit, and each thick copper plate unit is connected to a connecting part through the connecting position; a plurality of locating holes are arranged in the connecting area and are located on a frame of the thick copper plate. The invention also discloses a production method for the circuit board. According to the thick copper plate for different types of circuit boards and the production method for the circuit board, the utilization rate of the board and the production efficiency of the circuit board are effectively improved, the production cost is saved, the waste of the production raw materials is reduced and the fast batch production is realized; meanwhile, the circuit board is directly formed in the thick copper plate and then composing and laminating are carried out without taking an FR4 substrate as a lag, so that the expansion problem of materials of the copper plate and the FR4 substrate after laminating is avoided, the use of the FR4 substrate is reduced, the production process and the production time are reduced, an effect of coating the FR4 substrate on the copper plate is better realized, and the circuit board is protected.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, and in particular relates to a thick copper plate of different types of circuit boards and a method for manufacturing the circuit board. Background technique [0002] With the continuous development of the circuit board industry, circuit boards for various purposes also appear. In recent years, due to the increasing international and domestic attention to environmental protection issues and the adjustment of national strategies, the rapid development of the new energy electric vehicle and electric vehicle industry has been promoted and the application in the new energy electric vehicle and electric vehicle industry for Circuit board technology for high-current and high-voltage battery protection has also grown rapidly. [0003] Since the power battery protection circuit board needs to carry large current and high voltage, ordinary circuit boards can no longer meet this requireme...

AI Technical Summary

Problems solved by technology

In the traditional circuit board processing, in order to achieve the basic edge-wrapping effect of FR4, it is necessary to open a common FR4 substrate in advance, hollow out the FR4 substrate according to the shape of the copper board, and then cut out the shape of the copper board separately, and finally the completed The copper plate is embedded into the FR4 substrate for lamination. This method can only be produced by a single circuit board, and multiple circuit boards cannot be typed and combined. The production efficiency is low and the process is long, and each board needs to waste a common FR4 substrate. Sheet metal increases production costs, and the expansion and contraction of copper plates and FR4 substrates is not easy to control

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