Manufacture method of high density interconnection board

Abstract

The present invention discloses a manufacture method of a high density interconnection board. The method comprises the steps of (S1) inner layer core plate cutting, first time inner layer core plate line graphic manufacture, and inner layer core plate lamination, (S2) inner layer core plate browning, drilling a surface layer blind hole by laser, and removing a browned layer, (S3) making an inner layer blind hole at a surface layer to a layer to be conducted, and carrying out metal processing on the surface layer blind hole and the inner layer blind hole, (S4) entire plate hole filling and plating, filling the blind hole and plating copper at the inner wall of the inner layer blind hole, and then carrying out inner layer hole plating such that surface layer blind hole and inner layer blind hole copper thickness satisfies a product requirement, (S5) inner layer blind hole filling by resin, grinding plate by an inner layer abrasive belt, and making a secondary inner layer circuit, and (S6) carrying out lamination and outer layer processing. According to the method, the processes of drilling a laser positioning hole, blind hole window opening, and copper reduction ara saved, at the same time the full plate plating mechanism can be realized by the surface layer blind hole and the inner layer blind hole, the manufacture processes are simplified, and the production quality of the blind holes are improved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and in particular relates to a method for manufacturing a high-density interconnection board. Background technique [0002] With the continuous development of electronic products in the direction of light, thin, short, small and complex functions, the printed circuit board industry is also developing in the direction of higher quality and denser layout, and high-density interconnection boards emerge as the times require , high-density interconnection board is a high-precision, thin line, small aperture, ultra-thin printed board, which introduces blind buried holes in conventional circuit boards, fine line width and line spacing, and can manufacture conventional multilayer boards Thin, multi-layer, stable circuit boards that cannot be achieved by technology, which have the following advantages, which can reduce printed circuit board (PCB) cost, increase circuit density, ha...

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is that the high-density interconnection board laminated multiple times in the prior art has the problem of uneven thickness of copper plating on the outer layer of blind holes, and the method of opening the outer layer window is used to solve the above problem. Production process Complexity and high production cost; thus, a method for manufacturing high-density interconnection boards that reduces production costs and improves the quality of blind hole production is proposed