Copper-reducing micro-etching agent and preparation method thereof

A technology of micro-etching agent and corrosion inhibitor, which is applied to the removal of conductive materials by chemical/electrolytic methods, the manufacture of printed circuits, and printed circuits. The effect of slowing down the speed and maintaining the complete shape

Pending Publication Date: 2020-03-24
SHENZHEN BANMING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at the problem that larger cracks are prone to appear at the orifice after the copper layer is thinned by the copper reduction ...

Method used

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  • Copper-reducing micro-etching agent and preparation method thereof
  • Copper-reducing micro-etching agent and preparation method thereof
  • Copper-reducing micro-etching agent and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-13

[0040] Examples 1-13 and Comparative Examples 1-13 respectively provide a copper-reducing microetch agent and a preparation method of the copper-reducing microetch agent. The copper microcorrosion agent of each embodiment and comparative example, solvent is pure water, and in the volume of 1L, the content of solute is as shown in table 1, and wherein, stabilizing agent is p-hydroxybenzenesulfonic acid, and corrosion inhibitor is polyethylene sulfonic acid. Amine, N-containing heterocyclic compound is 1-hydroxyethyl-2-oleyl imidazoline.

[0041] The content (g) of solute in the copper-reducing microetch agent of every 1L volume of table 1

[0042] h 2 SO 4

Embodiment 14

[0044] This comparative example is compared with Example 5, and the difference is that the N-containing heterocyclic compound used in this comparative example is 2-methylimidazole, that is, the 1-hydroxyethyl group in Example 5 is replaced by 2-methylimidazole -2-oleyl imidazoline, all the other components are completely consistent with that of Example 5, and the preparation method is also the same as that of Example 5.

Embodiment 15

[0046] This comparative example is compared with Example 5, and the difference is that the N-containing heterocyclic compound used in this comparative example is benzotriazole, that is, the 1-hydroxyethyl group in Example 5 is replaced by benzotriazole -2-oleyl imidazoline, all the other components are completely consistent with that of Example 5, and the preparation method is also the same as that of Example 5.

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PUM

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Abstract

The invention relates to the technical field of metal etching, in particular to a copper-reducing micro-etching agent with excellent isotropic etching performance and a preparation method of the copper-reducing micro-etching agent. According to the invention, a proper amount of the corrosion inhibitor and the N-containing heterocyclic compound are added into a sulfuric acid-hydrogen peroxide etchant system, the copper etching speed of the copper reduction micro-etching agent can be reduced, isotropy of etching is increased. Effective adsorption is carried out at a place with high current density through an N-containing heterocyclic compound. The copper-reducing micro-etching agent is good for deposition of metal ions in places with lower current density, so that the concave parts of the plate surface are leveled, the copper-reducing micro-etching agent has the comprehensive effect of reducing gaps between resin and hole walls at hole openings, the complete morphology is basically maintained, and the smooth proceeding of subsequent processes in the circuit board production is guaranteed.

Description

technical field [0001] The invention relates to the technical field of metal etching, in particular to a copper-reducing microetch agent with excellent isotropic etching, and a preparation method of the copper-reducing microetch agent. Background technique [0002] Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. With the development of electronic products in the direction of lighter, smaller and thinner, PCB is also required to develop in the direction of higher density and miniaturization. The high-density and miniaturized printed circuit board requires more miniaturization of the PCB circuit, and the miniaturization of the circuit is closely related to the thickness of the surface copper. The thicker the copper thickness, the more difficult it is to achieve a more refined circuit. [0003] In the current technology, for the production of PCB fine lines, the copper layer on the surface of the ...

Claims

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Application Information

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IPC IPC(8): H05K3/06
CPCH05K3/067
Inventor 李晨庆赫意王扩军
Owner SHENZHEN BANMING SCI & TECH CO LTD
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