Manufacturing method of high-speed PCB and PCB

Abstract

The invention provides a manufacturing method of a high-speed PCB and the PCB. The manufacturing method includes the following steps that 1, lamination is carried out after a normal inner layer graph is manufactured; 2, copper reduction is carried out to achieve the size of 6 micrometers to 8 micrometers after lamination is completed; 3, +4.5 mil copper etching windowing is carried out on a deep micropore region and a first-order blind hole region overall; 4, laser drilling is carried out to complete deep micropore and first-order blind hole machining; 5, through holes needing resin hole plugging are mechanically drilled for the first time; 6, the interiors of the holes are metalized for the first time; 7, the through holes are back-drilled for the first time; 8, vacuum hole plugging is carried out; 9, the holes are covered with dry films, single side +5 mil dry film covering is carried out on deep micropores, first-order blind holes and the first through holes; 10, chemical copper reduction and ceramic grinding plate copper reduction are carried out to achieve the size of 20 micrometers to 25 micrometers; 11, second through holes are mechanically drilled; 12, the interiors of the holes are metalized for the second time, and POFV blocking is carried out; 13, the second through holes are back-drilled, and connection type functional holes are machined; 14, an outer layer graph is transferred, and a fine line graph is etched; 15, solder resisting and surface treatment are completed. The high-complexity high-speed PCB can be manufactured, the manufacturing period is short, and the cost is low.

Description

technical field [0001] The invention relates to a manufacturing method of a circuit board, in particular to a manufacturing method of a high-speed PCB and the PCB. Background technique [0002] With the rapid development of high-density integrated circuit technology and microelectronics technology, the volume of electronic products has become lighter, thinner and smaller, with highly dense functions and stronger performance. At present, in order to meet the high-speed and high-density requirements of products, the PCB design combines deep micro-holes, blind holes, back drilling, POFV (Plating Over Filled Via, need to plug holes), dense lines and other processes together. High aspect ratio through blind hole electroplating process capability, high aspect ratio through, blind hole, back drilling, resin plug hole control, circuit accuracy control ability, surface treatment compatibility, etc. all pose great challenges. The existing conventional Equipment and process methods ar...

AI Technical Summary

Problems solved by technology

At present, in order to meet the high-speed and high-density requirements of products, PCB design combines deep microvias, blind vias, back drilling, POFV (Platating Over Filled Via, plugged holes), dense lines and other processes together. The electroplating process capability of high-thickness-diameter ratio through-blind holes, the control of high-thickness-diameter ratio through-holes, blind holes, back-drilled holes, and resin plugged holes, the ability to control line accuracy, and the compatibility of surface treatment all pose great challenges. The existing conventional Equipment and process methods are difficult to realize the production of this high-speed PCB. It is necessary to use more advanced equipment resources (laser drilling, pulse plating, vacuum resin plug machine) and develop new process methods in key processes to achieve high-speed PCB production.

The existing technology is difficult to realize the production of high-speed PCB, the quality is difficult to guarantee, and the production cycle is long, and the cost is relatively high

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