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888 results about "High complexity" patented technology

The complexity of a physical system or a dynamical process expresses the degree to which components engage in organized structured interactions. High complexity is achieved in systems that exhibit a mixture of order and disorder (randomness and regularity) and that have a high capacity to generate emergent phenomena.

Method, apparatus, system, storage medium, and electronic device for securely accessing block chain

The present disclosure proposes a method, an apparatus, a system, a storage medium, and an electronic device for securely accessing a block chain. The method comprises: preparing a new node accessingthe blockchain network to obtain endorsement data obtained by the trusted node preset in the block chain network using the private key to sign the target node public key, and performing signature verification on the endorsement data, if the signature After the verification is passed, it is determined that the identity authentication of the target node is successful, and the target node queries thepermission right of the new node's public key corresponding to the account address in the permission preset by the block chain network, and determines the new permission according to the checked permission. Whether the identity authentication of the node is successful. Therefore, the two-way authentication of the new node and the target node of the present disclosure directly utilizes the publicand private keys of the node of the block chain network node, and does not require a centralized third party to participate in the digital certificate, thereby avoiding the high complexity brought bythe digital certificate issuance. Secure access between nodes in the block chain network.
Owner:CLOUDMINDS SHANGHAI ROBOTICS CO LTD

Manufacturing method of high-speed PCB and PCB

The invention provides a manufacturing method of a high-speed PCB and the PCB. The manufacturing method includes the following steps that 1, lamination is carried out after a normal inner layer graph is manufactured; 2, copper reduction is carried out to achieve the size of 6 micrometers to 8 micrometers after lamination is completed; 3, +4.5 mil copper etching windowing is carried out on a deep micropore region and a first-order blind hole region overall; 4, laser drilling is carried out to complete deep micropore and first-order blind hole machining; 5, through holes needing resin hole plugging are mechanically drilled for the first time; 6, the interiors of the holes are metalized for the first time; 7, the through holes are back-drilled for the first time; 8, vacuum hole plugging is carried out; 9, the holes are covered with dry films, single side +5 mil dry film covering is carried out on deep micropores, first-order blind holes and the first through holes; 10, chemical copper reduction and ceramic grinding plate copper reduction are carried out to achieve the size of 20 micrometers to 25 micrometers; 11, second through holes are mechanically drilled; 12, the interiors of the holes are metalized for the second time, and POFV blocking is carried out; 13, the second through holes are back-drilled, and connection type functional holes are machined; 14, an outer layer graph is transferred, and a fine line graph is etched; 15, solder resisting and surface treatment are completed. The high-complexity high-speed PCB can be manufactured, the manufacturing period is short, and the cost is low.
Owner:DONGGUAN SHENGYI ELECTRONICS
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