The invention discloses a hardware temperature compensation
pressure sensing module based on an LTCC embedded structure and a preparation method, and relates to the technical field of sensors. The module comprises an LTCC substrate body, an embedded main
control unit, a surface sensing unit and an
embedded hardware temperature compensation network, a closed embedded cavity is formed in the LTCC substrate, a vertical
interconnection conductor is arranged in the LTCC substrate, the main
control unit is embedded in the cavity, and the surface sensing unit outputs differential signals containing temperature excursion; the embedded
thermistor and the
partial pressure filter form a temperature reference
signal, and the compensation
resistor is used for zero calibration; the rear-stage
signal conditioning circuit amplifies the differential
signal, superimposes the pressure signal and the temperature reference signal in an analog domain according to
a weighting proportion and performs low-pass filtering, and outputs the pressure signal and the temperature reference signal to a master control analog-to-
digital conversion end after realizing temperature drift offset; embedded
interconnection and hardware temperature compensation are achieved, temperature drift is restrained, heat dissipation shielding is enhanced, and the sampling
utilization rate and
mass production consistency are improved.