The invention provides a manufacturing method of a high-speed PCB and the PCB. The manufacturing method includes the following steps that 1, lamination is carried out after a normal inner layer graph is manufactured; 2,
copper reduction is carried out to achieve the size of 6 micrometers to 8 micrometers after lamination is completed; 3, +4.5 mil
copper etching windowing is carried out on a deep micropore region and a first-order
blind hole region overall; 4,
laser drilling is carried out to complete deep micropore and first-order
blind hole machining; 5, through holes needing resin hole plugging are mechanically drilled for the first time; 6, the interiors of the holes are metalized for the first time; 7, the through holes are back-drilled for the first time; 8, vacuum hole plugging is carried out; 9, the holes are covered with dry films, single side +5 mil dry film covering is carried out on deep micropores, first-order blind holes and the first through holes; 10, chemical
copper reduction and
ceramic grinding plate
copper reduction are carried out to achieve the size of 20 micrometers to 25 micrometers; 11, second through holes are mechanically drilled; 12, the interiors of the holes are metalized for the second time, and POFV blocking is carried out; 13, the second through holes are back-drilled, and
connection type functional holes are machined; 14, an outer layer graph is transferred, and a
fine line graph is etched; 15, solder resisting and surface treatment are completed. The high-complexity high-speed PCB can be manufactured, the manufacturing period is short, and the cost is low.