Electroplating device of copper plating of graphite powder and technique
An electroplating device and electroplating process technology, applied in the direction of electrolysis process, electrolysis components, etc., can solve the problems of unfavorable copper deposition, low deposition rate, low limit current, etc. Effect
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[0040] Example 1
[0041] The base material is 200 mesh flake graphite, and the specific operation steps are as follows:
[0042] Graphite pretreatment
[0043] A: Degreasing use a muffle furnace to burn and degreasing at high temperature, temperature: 600℃, time: 30min;
[0044] B: Ultrasonic roughening with concentrated nitric acid ultrasonic roughening, temperature: room temperature, time: 20min;
[0045] C: Wash with distilled water until neutral;
[0046] Flow copper plating
[0047] Plating solution preparation and operating conditions: copper sulfate 10g·dm -3 , graphite powder 15g dm -3 , concentrated sulfuric acid 5cm 3 ·dm -3 , glacial acetic acid 0.2cm 3 ·dm -3 , formamide 0.3cm 3 ·dm -3 , the number of bath combinations is 2; the temperature is 60°C; the flow rate of the plating solution is 12dm -3 ·min -1 ;Ultrasonic frequency 20kHz current density 30A·dm -2 ,; time 20min.
[0048] (3) Post-treatment of graphite powder copper plating
[0049] A: Wa...
Example Embodiment
[0052] Example 2
[0053] The base material is 200 mesh flake graphite, and the difference from Example 1 is:
[0054] Flow copper plating
[0055] Plating solution preparation and operating conditions: copper sulfate 10g·dm -3 , graphite powder 15g dm -3 , sodium hypophosphite 5g dm -3 , concentrated sulfuric acid 5cm 3 ·dm -3 , glacial acetic acid 0.2cm 3 ·dm -3 , formamide 0.3cm 3 ·dm -3 ; The number of plating tank combinations is 2; the temperature is 60°C; the flow rate of the plating solution is 12dm -3 ·min -1 ; Ultrasonic frequency 20kHz; Current density 30A·dm -2 ; Time 20min.
[0056] The remaining steps are the same as in Example 1.
[0057] The copper-clad graphite powder composite material prepared in this example has a mass fraction of copper of 60%, and the coating layer is dense and uniform.
Example Embodiment
[0058] Example 3
[0059] The base material is 200 mesh flake graphite, and the difference from Example 1 is:
[0060] Flow copper plating
[0061] Plating solution preparation and operating conditions: copper sulfate 8g·dm -3 , graphite powder 15g dm -3 , sodium hypophosphite 10g dm -3 , concentrated sulfuric acid 5cm 3 ·dm -3 , glacial acetic acid 0.2cm 3 ·dm -3 , formamide 0.3cm 3 ·dm -3 ; The number of plating tank combinations is 2; the temperature is 60°C; the flow rate of the plating solution is 12dm -3 ·min -1 ; Ultrasonic frequency 20kHz; Current density 30A·dm -2 ; Time 20min.
[0062] The remaining steps are the same as in Example 1.
[0063] The copper-clad graphite powder composite material prepared in this example has a mass fraction of copper of 65%, and the coating layer is dense and uniform.
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