Manufacturing method for large-flexure high-density flexible printed circuit board

A technology of flexible printing and manufacturing method, applied in the field of circuit board manufacturing

Active Publication Date: 2018-09-11
深圳市合力泰光电有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0016] The invention provides a method for manufacturing a high-deflection and high-density flexible printed circuit board, which can solve the above problems in the existing technology

Method used

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  • Manufacturing method for large-flexure high-density flexible printed circuit board

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Embodiment Construction

[0051] In order to facilitate the understanding of the present invention, the present invention will be described in more detail below with reference to the drawings and specific embodiments. The drawings show preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0052] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terms used in the specification of the present invention in this specification are only for the purpose of describing specific embodiments, and are not used to limit the present invention.

[0053] Such as figure 1...

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Abstract

The invention discloses a manufacturing method for a large-flexure high-density flexible printed circuit board, and the printed circuit board is produced according to the following sequence: drilling;hole blackening; copper plating; film coating; exposure; development; copper reduction; stripping; molding. According to the invention, the copper plating is executed completely, and then the copperreduction is performed locally, thereby reducing the problems in a scheme of the prior art. Moreover, the technical scheme employed in the invention greatly improves the whole technological capability.

Description

Technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for manufacturing a high-flex and high-density flexible printed circuit board. Background technique [0002] Consumer electronic products are developing in the direction of small and sophisticated. Electronic products are getting smaller and smaller, but they have more and more integrated functions and a variety of shapes. Flexible circuit boards are flexible and thin, which can well satisfy electronic products. The need for development. [0003] The technological process of the existing technology: [0004] 1. Drilling through holes-----Using laser and mechanical drilling to guide general holes; [0005] 2. Black hole-----to deposit a layer of conductive carbon powder on the hole wall after drilling; [0006] 3. Dry film lamination-----cover the original copper surface; [0007] 4. Exposure-----The use of dry film light to harden the dry film of the area that needs to be...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42H05K3/00
CPCH05K3/00H05K3/42
Inventor 郑国清慎华兵马承义丁澄
Owner 深圳市合力泰光电有限公司
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