A method for manufacturing a high-deflection and high-density flexible printed circuit board

A technology of flexible printing and manufacturing method, applied in the field of circuit board manufacturing

Active Publication Date: 2020-01-03
深圳市合力泰光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0016] The invention provides a method for manufacturing a high-deflection and high-density flexible printed circuit board, which can solve the above problems in the existing technology

Method used

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  • A method for manufacturing a high-deflection and high-density flexible printed circuit board

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Embodiment Construction

[0050] In order to facilitate the understanding of the present invention, the present invention will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. Rather, these embodiments are provided for the purpose of making the disclosure of the present invention more thorough and comprehensive.

[0051] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used in the description of the present invention in this specification are only for the purpose of describing specific embodiments, and are not used to limit the present invention.

[0052] Such as fig...

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Abstract

The invention discloses a manufacturing method for a large-flexure high-density flexible printed circuit board, and the printed circuit board is produced according to the following sequence: drilling;hole blackening; copper plating; film coating; exposure; development; copper reduction; stripping; molding. According to the invention, the copper plating is executed completely, and then the copperreduction is performed locally, thereby reducing the problems in a scheme of the prior art. Moreover, the technical scheme employed in the invention greatly improves the whole technological capability.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for manufacturing a high-deflection and high-density flexible printed circuit board. Background technique [0002] Consumer electronic products are developing in the direction of small and precise. Electronic products are getting smaller and smaller, but with more and more integrated functions and various shapes. Flexible circuit boards are flexible and thin, which can well meet the needs of electronic products. development needs. [0003] Process flow of prior art: [0004] 1. Drilling through holes -----Using laser and mechanical drilling for general-purpose holes; [0005] 2. Black hole ----- deposit a layer of conductive carbon powder on the wall of the hole after drilling; [0006] 3. Dry film lamination ----- covering the original copper surface; [0007] 4. Exposure ----- use the light effect of the dry film to harden the dry film in the area to be p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42H05K3/00
CPCH05K3/00H05K3/42
Inventor 郑国清慎华兵马承义丁澄
Owner 深圳市合力泰光电有限公司
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