Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Fabrication method for rigid-flex printed combination board of covering membrane window

A production method and technology of cover film, which are applied in the directions of printed circuit manufacturing, printed circuit, and assembling printed circuit with electrical components, can solve the problem of easy generation of wrinkles and blistering, poor bonding force between cover film and flexible board, and pressing Control difficulty and other problems to achieve the effect of reducing difficulty, high yield of finished products, and ensuring reliability

Inactive Publication Date: 2014-11-05
东莞市五株电子科技有限公司
View PDF3 Cites 27 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem mainly solved by the present invention is that in the existing rigid-flex printed board manufacturing method, the flexible board, the cover film and the hard board are laminated at one time, and the bonding force between the cover film and the soft board is not good, which is prone to wrinkles and Bubble phenomenon, and it is necessary to add a suitable gasket to the soft board to ensure that the soft board is under pressure. At the same time, the gasket needs to have good conformality, and the pressing control is difficult

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Fabrication method for rigid-flex printed combination board of covering membrane window
  • Fabrication method for rigid-flex printed combination board of covering membrane window
  • Fabrication method for rigid-flex printed combination board of covering membrane window

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0042] The embodiment of the present invention discloses a method for manufacturing a rigid-flex printed board with a cover film opening a window. Please refer to figure 1 As shown in the schematic diagram of the process flow, the manufacturing method of the rigid-flex printed board with the window opening of the cover film includes a flexible board processing process, a rigid board processing process, and a post-processing of the flexible and hard board.

[0043] First, the soft board processing process includes the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a fabrication method for a rigid-flex printed combination board of a covering membrane window. The fabrication method comprises the steps of soft board treatment, hard board treatment and treatment after a soft board and a hard board are combined, wherein the step of soft board treatment comprising surface roughening, in which the surface of the soft board is roughened; lamination for a first time, in which a covering membrane is pressed onto the surface of the soft board; soft board appearance, in which the appearance of the soft board is subjected to shaping; and soft board roughening, in which the soft board after being subjected to shaping is roughened; the step of hard board treatment comprises inner layer etching; mechanical groove carving for the first time, in which grooves are carved on the part of a flexible region of the hard board; and blackening, in which the surface roughness of copper foils at an inner layer is enhanced; and the step of treatment after the soft board and the hard board are combined comprises lamination for a second time, in which the roughened soft board and the blackened hard board are laminated to form the soft and hard combination board. Lamination is performed for twice in the fabrication method, the lamination reliability and the fabrication yield can be improved, and plasma treatment is adopted prior to copper deposition, the reliability of a hole wall can be ensured.

Description

technical field [0001] The invention relates to a manufacturing process of a printed circuit board (PCB), in particular to a manufacturing method of a rigid-flex printed combined board with a cover film opening a window. Background technique [0002] In some specific fields, it is difficult for ordinary rigid PCBs to meet the special assembly requirements of products. Rigid-flex boards are being used more and more widely due to their excellent three-dimensional flexibility. Rigid-flex printed board refers to a printed board containing one or more rigid areas and one or more flexible areas, which is composed of rigid boards and flexible boards laminated together in an orderly manner, and formed with metallized holes Electrical connections. [0003] With the development of electronic products in the direction of high density, miniaturization, and high reliability, rigid-flexible printed circuit boards are especially suitable for today's electronic products for light, Require...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/00H05K3/36
Inventor 孟昭光
Owner 东莞市五株电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products