Electroplating copper plughole process of circuit board
A circuit board and process technology, which is applied in the field of circuit board manufacturing process, can solve the problem that electroplating is difficult to meet the technical requirements of electroplated copper through holes, etc., and achieve the effect of meeting the electrical high current connection requirements, stable quality, and reducing production costs
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[0011] The present invention is described in further detail below:
[0012] The electroplating copper plugging process of the circuit board includes the following steps:
[0013] A. Making the inner layer circuit of the substrate: process the plate covered with copper layer into the required size with a cutting machine, and arrange the inner layer circuit on the surface of the cut board, so that the circuit connection of the circuit board meets the design requirements , and then laminate and press the multiple boards with the inner layer circuit, so that the inner layer boards of more than two boards are closely bonded together to form a multi-layer board with inner layer circuits, and then on the multi-layer board Drill through holes for connecting electronic components.
[0014] B. Electroplating on the surface of the sinking copper board: Place the multi-layer board with through holes in the sinking copper potion for chemical copper sinking, so that the hole wall of the th...
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