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Electroplating copper plughole process of circuit board

A circuit board and process technology, which is applied in the field of circuit board manufacturing process, can solve the problem that electroplating is difficult to meet the technical requirements of electroplated copper through holes, etc., and achieve the effect of meeting the electrical high current connection requirements, stable quality, and reducing production costs

Active Publication Date: 2012-07-18
广东兴达鸿业电子有限公司
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

However, traditional electroplating is difficult to meet the technical requirements of electroplating copper through holes

Method used

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Embodiment Construction

[0011] The present invention is described in further detail below:

[0012] The electroplating copper plugging process of the circuit board includes the following steps:

[0013] A. Making the inner layer circuit of the substrate: process the plate covered with copper layer into the required size with a cutting machine, and arrange the inner layer circuit on the surface of the cut board, so that the circuit connection of the circuit board meets the design requirements , and then laminate and press the multiple boards with the inner layer circuit, so that the inner layer boards of more than two boards are closely bonded together to form a multi-layer board with inner layer circuits, and then on the multi-layer board Drill through holes for connecting electronic components.

[0014] B. Electroplating on the surface of the sinking copper board: Place the multi-layer board with through holes in the sinking copper potion for chemical copper sinking, so that the hole wall of the th...

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Abstract

The invention discloses an electroplating copper plughole process of a circuit board. The process comprises the following steps of: manufacturing a substrate inner layer circuit: arranging an inner layer circuit on a material plate coated with a copper layer, overlapping a plurality of plates and laminating, and drilling a through hole on the multi-layer plate; electroplating the surface of a copper deposition plate: arranging the multi-layer plate in the copper deposition liquid to plate a conductive thin copper layer on the wall of the hole and the external surface of the multi-layer plate;transferring a special plating hole pattern, i.e., transferring the photographic plate image to the multi-layer plate; electroplating the through hole: electroplating the multi-layer plate to fill the through hole with the plated copper; reducing copper and etching: the through hole plated with copper partially exposing out of the plate surface, removing copper exposing out of the plate surface; arranging outer layer circuit: carrying out the arrangement of the outer layer circuit of the multi-layer plate; electroplating pattern; reducing film and etching: removing the dry film and etching; and printing green oil on the naked copper plate and work character, and baking to produce the finished plate.

Description

【Technical field】 [0001] The invention relates to a manufacturing process of a circuit board, in particular to an electroplating copper plug hole process of the circuit board. 【Background technique】 [0002] With the rapid development of electronic technology, electronic products tend to be multi-functional and miniaturized. This promotes the development of printed circuit boards as the basis for electronic components to be multi-layered, laminated, and high-density. The second type of printed board realizes the electrical interconnection between layers through a large number of micro-holes. Some vias need to be plugged with metal for more stable performance and higher quality. However, traditional electroplating is difficult to meet the technical requirements of electroplating copper vias. 【Content of invention】 [0003] The present invention overcomes the deficiencies of the prior art, and provides a method that can well fill the microholes that need to be plugged wit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/42
Inventor 英浩兴何锋
Owner 广东兴达鸿业电子有限公司
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