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A method of manufacturing a structure

A mask, gold layer technology, applied in the field of manufacturing microelectronic devices with this structure, can solve the problems of limiting micro-contact printing, harmfulness, etc.

Inactive Publication Date: 2008-10-29
KONINKLIJKE PHILIPS ELECTRONICS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such plasma treatment effectively limits the application of microcontact printing as it is basically a method to be performed in a clean room and can be harmful to other materials on the substrate surface

Method used

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  • A method of manufacturing a structure
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  • A method of manufacturing a structure

Examples

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Embodiment Construction

[0028] Figure 1 shows the six stages in a first embodiment of the method of the invention in cross-sectional view. Microcontact printing was used in this example for the patterning of the gold oxide layer. Therefore, patterning occurs after oxidation. More details are given in Examples 1-7.

[0029] Figure 1A A substrate 10 is shown with a gold layer 20 thereon. The substrate is a silicon substrate. The substrate has been thermally oxidized and provided with a Ti adhesion layer. Thereafter, the gold oxide layer 30 is provided by oxidizing the gold layer 20 in a plasma treatment ( Figure 1B ). Then, the gold oxide layer 30 is patterned using the stamp 100 ( Figure 1C). A stamp 100 suitable for microcontact printing has a stamp surface 101 conforming to a desired pattern. As is known to those skilled in the art, such a stamp is suitably fabricated from PDMS and any ink is provided to the stamp 100 prior to embossing. The ink includes a solvent with an active componen...

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Abstract

A gold layer (20) is patterned with a gold oxide mask (30), which mask is patterned with an acid, preferably with microcontactprinting. The gold oxide mask (30) is stable in alkalic etch solutions for the gold layer (20). The gold oxide mask (30) may be maintained to create a reexposable gold pad (20).

Description

field of invention [0001] The invention relates to a method of fabricating a structure on a gold layer by providing a mask on the gold layer. [0002] The invention also relates to methods of fabricating microelectronic devices comprising fabricating such structures. Background technique [0003] Such a method is known, for example, from US-A 2004 / 0102050. This known method is a specific example of microcontact printing. The patterning method comprises patterning of the surface by transferring material from the stamp to the substrate layer according to a pattern provided on the embossing surface of the stamp. The transferred material then forms a self-assembled monolayer, also known as a SAM, on the substrate. The most suitable substrate layer is gold, and the preferred material for forming the SAM is alkanethiol, especially n-octadecanethiol. Although other uses of the SAM are not excluded, the SAM is suitable to be used as an etch mask for subsequent etching of the sub...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/68
CPCB82Y10/00H01L21/76838H01L21/32139B82Y40/00H01L21/76885H05K3/061H05K1/09H05K2203/0108H05K2203/0315H05K2203/122H05K2203/1157G03F7/0002H05K2203/0537H05K2203/0582H05K2203/1189B82Y30/00H05K3/062H01L21/02
Inventor D·伯丁斯基R·B·A·夏普M·H·布利斯J·休斯肯斯
Owner KONINKLIJKE PHILIPS ELECTRONICS NV
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