2results about How to "Small load" patented technology

The application discloses a kind of fine-grained monitoring method and system for computing cluster job.The method is: deploying a monitoring agent on each execution node of computing cluster, and mounting eBPF probe in the kernel of execution node;Cluster scheduler divides the total job of cluster to obtain multiple jobs and assigns to each execution node;Monitoring agent constructs the direct mapping of JobID-kernel event;Based on direct mapping, kernel event and its associated kernel process are fused to generate job-level observability entity;JobID-node-PID set dynamic mapping relationship is established by using probe to capture job start and stop event;Job-level observability entity is based on dynamic mapping relationship to aggregate all observable data streams of job on execution node;From the total observable data stream of monitoring target, set index data is collected;The collected data is persisted to time series warehouse, and the semantic features of set topic data are extracted as index.

This application discloses a die bonding method, equipment, and process product, relating to the field of semiconductor processing technology. The die bonding method includes transporting a conveyor belt to transport any row of initial labels on the belt to a dispensing station; the conveyor belt array has multiple rows and columns of initial labels; a dispensing module is moved to the dispensing station along a first direction, and the dispensing module is used to position, identify, and dispense each row of initial labels, and to perform dispensing quality inspection; the first direction is parallel to the arrangement direction of each row of initial labels; the conveyor belt is stepped with a preset row spacing to transport the next row of initial labels to the dispensing station, and dispensing is performed on multiple rows and columns of initial labels sequentially; the dispensed labels on the conveyor belt are sequentially subjected to chip bonding, pressing, and curing to obtain finished chip labels. This application replaces the movement of a large inertia platform with a lightweight movement method of the dispensing module, achieving a balance between cost and control accuracy.