This invention relates to the field of MEMS
optical scanning device technology, and discloses a
silicon-based MEMS micromirror structure and its molding method. The structure includes a
fixed frame, a movable mirror, and an elastic support structure. A support skeleton is provided on the back of the movable mirror. The support skeleton includes a main support rib extending perpendicular to the torsion axis, two side ribs located on either side of the main support rib, a load-bearing plate integrally extended from the end of the main support rib for fixing a central
magnet, and perforated grooves formed between the main support rib and side ribs one and two, respectively, extending through the thickness direction. The inner contours of side ribs one and two are arc-shaped or bow-shaped, concave towards the main support rib. The molding method uses the non-optical area on the back as the
design domain. Under the constraint of a volume
retention rate not exceeding 50%, the main load-bearing path is extracted using the SIMP
variable density method, the moving asymptote
algorithm, and Helmholtz density filtering. After converting the
etching pattern according to the minimum feature size requirement, the support skeleton is integrally molded.