159results about How to "Fabrication can be reduced" patented technology

The present invention provides a unique device structure and method that provides increased transistor performance in integrated bipolar circuit devices. The preferred embodiment of the present invention provides improved high speed performance by providing reduced base resistence. The preferred design forms the extrinsic base by diffusing dopants from a dopant source layer and into the extrinsic base region. This diffusion of dopants forms at least a portion of the extrinsic base. In particular, the portion adjacent to the intrinsic base region is formed by diffusion. This solution avoids the problems caused by traditional solutions that implanted the extrinsic base. Specifically, by forming at least a portion of the extrinsic base by diffusion, the problem of damage to base region is minimized. This reduced damage enhances dopant diffusion into the intrinsic base. Additionally, the formed extrinsic base can have improved resistence, resulting in an improved maximum frequency for the bipolar device. Additionally, the extrinsic base can be formed with a self-aligned manufacturing process that reduces fabrication complexity.

A lens of a side emitting LED includes a bottom surface, an incident surface, a reflective surface, a first refractive surface, a second refractive surface and a third refractive surface. An light emitted by a LED enters the lens through the incident surface. A portion of the light is reflected by the reflective surface in an internal total reflection manner to the second refractive surface and emits out of the lens along a first optical path. The other portion of light directly emits out of the lens through the first refractive surface and the third refractive surface. A transitive surface is located between the first refractive surface and the reflective surface. Such a design allows the light entered the lens through the incident surface not cross with the transitive surface. Hence an improper reflection or refraction can be prevented.

In various embodiments, a monolithic integrated transmitter, comprising an on-chip laser source and a modulator structure capable of generating advanced modulation format signals based on amplitude and phase modulation are described.

A system and methodology are disclosed for monitoring and controlling a semiconductor fabrication process. One or more structures formed on a wafer matriculating through the process facilitate concurrent measurement of critical dimensions and overlay via scatterometry or a scanning electron microscope (SEM). The concurrent measurements mitigate fabrication inefficiencies, thereby reducing time and real estate required for the fabrication process. The measurements can be utilized to generate feedback and / or feed-forward data to selectively control one or more fabrication components and / or operating parameters associated therewith to achieve desired critical dimensions and to mitigate overlay error.

A fluid transportation device includes a valve supporting module, a first fluid transportation module and a second fluid transportation module. Through the valve supporting module, the first fluid transportation module and the second fluid transportation module may be combined together in a side-by-side arrangement or a vertically-stacked arrangement. The combination of the first fluid transportation module and the second fluid transportation module can increase the flow rate and the pumping head of transporting the fluid. Moreover, the combination of two fluid transportation modules of the present fluid transportation device can be synchronously or asynchronously actuated to increase the flow rate and the pumping head of transporting the fluid. Since the additional coupling mechanism is omitted, the fabricating cost of the present fluid transportation device is largely reduced, and the overall volume of the present fluid transportation device is reduced to comply with the miniaturization requirement.

The invention relates to a supporting mechanism for a deck frame of a folding-up treadmill having a support frame, a base frame and a deck frame. The supporting mechanism includes a supporting rod with one end connected to the base frame and with the other end connected through an extension spring to an extension piece of the front roller is interposed between the base frame and the deck frame. A slide wheel is provided between the supporting rod and the inner side of the deck frame. The slide wheel is cooperative with a supporting piece 38 at bottom end of the deck frame to create a supporting effect.

A device includes a source for transmitting an electronic charge through a conduction path; a drain for receiving the electronic charge; a stack for providing at least part of the conduction path; and a gate operatively connected to the stack for controlling a conduction of the electronic charge. The stack includes an insulator layer, an N-polar layer and a barrier layer selected such that, during an operation of the device, the conduction path formed in the N-polar layer includes a two-dimensional electron gas (2DEG) channel and an inversion carrier channel.

Substrate processing apparatus includes a lithographic apparatus which comprises an illumination system for supplying a projection beam of radiation, an array of individually controllable elements serving to impart the projection beam with a pattern in its cross-section, and a projection system for projecting the patterned beam onto a target portion of a substrate. The processing apparatus also includes a substrate supply arranged to output at least one unbroken length of substrate, and a substrate conveying system arranged to convey each outputted unbroken length of substrate from the substrate supply and past the projection system such that the projection system is able to project the patterned beam onto a series of target portions along each unbroken length of substrate. In certain embodiments, long lengths of substrate are supplied from a roll, but alternatively a series of separate sheets can be supplied.

Various embodiments of a coherent receiver including a widely tunable local oscillator laser are described herein. In some embodiments, the coherent receiver can be integrated with waveguides, optical splitters and detectors to form a monolithic optical hetero / homodyne receiver. In some embodiments, the coherent receiver can demodulate the full phase information in two polarizations of a received optical signal over a range of optical wavelengths.

A keeping device for a refrigerator and a refrigerator having the same are disclosed. A moving shelf is installed to adjust the space between door baskets according to the height of food items received in the door baskets. When the moving shelf is folded, a long food item can be stably received, and when the folded moving shelf is unfolded, the receiving space can be extended to receive more food items. Also, because moving support portions supporting the moving shelf are provided at both sides, collision noise can be reduced when the moving shelf is unfolded, and because a restraining unit is to provided between the moving shelf and the door, the folded state of the moving shelf can be stably maintained. In addition, because the keeping device is hung and fixed such that it is tightly attached to the door, the keeping space can be extended.

An active device array substrate including a plurality of scan lines, data lines and pixel units is provided. The pixel units are connected to the scan lines and data lines correspondingly, and each pixel unit includes a first active device, a second active device, a first pixel electrode, and a second pixel electrode. The first active device has a first gate, a first source connected to one of the data lines, and a first drain. The second active device has a second gate, a second source, and a second drain, wherein the first and the second gates are connected to the same scan line. The first and the second pixel electrodes are connected to the first drain and the second drain, respectively. The second source of each pixel unit is connected to the first pixel electrode of an adjacent pixel unit controlled by the next scan line.

A photocurable adhesive composition is disclosed which includes a photocurable adhesive and an effective amount of a ceramic-containing modifier which does not substantially reduce a photocure rate of the photocurable adhesive. The modifier alters the flow properties of the composition to facilitate controlled dispensing of the uncured adhesive composition. The modifier alters the thermal expansion properties of the cured composition to reduce bondline stress. The preferred modifier includes inert, alkali alumino-silicate microspheres. A method of adhesive bonding is also disclosed in which an adherend is adhered to a substrate using a photocurable adhesive composition containing a photocurable adhesive and microspheres.

A method of fabricating a printed circuit board is disclosed. A method of fabricating a printed circuit board that includes: stacking an insulation layer on at least one surface of a core layer, on which an inner circuit is formed, and forming an outer circuit pattern; burying the outer circuit pattern in the insulation layer; removing the outer circuit pattern to form minute grooves and curing the insulation layer; and forming an outer circuit by filling metal in the minute grooves, makes it possible to readily form high-resolution fine-line circuits, as well as to reduce fabrication costs and increase productivity.

When forming a rubber member which is made up of a combination of a plurality of rubber compounds by winding spirally a ribbon-shaped unvulcanized rubber strip material in an overlapping fashion, the number of times of winding is reduced so as to shorten a fabrication cycle time of the rubber member to thereby increase the productivity thereof. As a means therefore, a rubber strip material whose cross section is divided into two or more regions which are made up of different rubber compounds is wound spirally on to a drum in an overlapping fashion so as to build a green tire or a tire rubber member.

An apparatus for fabricating a semiconductor device in which a substance is deposited on a semiconductor wafer. The apparatus includes a heating arrangement and / or a shower head arrangement. The shower head arrangement supplies at least two source gases to the apparatus. The heating arrangement heats at least one of the source gases supplied to a process chamber of the apparatus. The heating arrangement may include a heat pipe including at least one part. A method of reducing thermal disturbance during fabrication of a semiconductor device using the heating arrangement and a method of exchanging heat during fabrication of the semiconductor device using the heating arrangement.

An organic light emitting display having a small thickness and a fabrication method thereof are provided. The organic light emitting display includes a substrate, an non-transmissive layer formed on the substrate, a semiconductor layer formed on the non-transmissive layer, a gate insulation layer formed on the semiconductor layer, a gate electrode formed on the gate insulation layer, an inter-layer dielectric layer formed on the gate electrode, a source / drain electrode formed on the inter-layer dielectric layer, an insulation layer formed on the source / drain electrode, and an organic light emitting diode formed on the insulation layer.

Provided is a patterned conductive film may include a conductive interconnected nano-structure film. The conductive interconnected nano-structure film may include a first region and a second region adjacent to the first region. A conductivity of the first region may be at least 1000 times a conductivity of the second region.

A magnetic assembly includes plural first magnetic cores, plural coil windings and a second magnetic core. Each of the plural first magnetic cores includes plural legs and a first connection part. The first connection part is connected with first terminals of the plural legs. The first connection part of the first magnetic core at an upper position is located adjacent to second terminals of the plural legs of the adjacent first magnetic core at a lower position. Each coil winding is wound around at least one leg of the plural legs of the corresponding first magnetic core so as to form a magnetic element of the corresponding converter. The second magnetic core is stacked over the plural first magnetic cores. The second magnetic core is located adjacent to the second terminals of the legs of the topmost first magnetic core.

Various embodiments of a coherent receiver including a widely tunable local oscillator laser are described herein. In some embodiments, the coherent receiver can be integrated with waveguides, optical splitters and detectors to form a monolithic optical hetero / homodyne receiver. In some embodiments, the coherent receiver can demodulate the full phase information in two polarizations of a received optical signal over a range of optical wavelengths.

A template is provided that aids quilt member fabrication. More specifically, a template is provided for selective interconnection to layered fabric members wherein the template indicates the location for sewing and cutting individual fabric pieces that make up the layered fabric thereby yielding a composite quilt member.

Solar cell array solutions including monolithic solar cell arrays and fabrication methods. A first patterned cell metallization contacts base and emitter regions of each of a plurality of solar cells having a light receiving frontside and a backside. An electrically insulating continuous backplane layer is attached to the backside of the solar cells and covers the first cell metallization of each of the solar cells. Via holes through the continuous backplane layer provide access to the first cell metallization. A second cell metallization is connected to the first cell metallization of each of the solar cells and electrically interconnects the solar cells in the array.

An accelerometer and a method of fabricating an integrated accelerometer comprises the steps of providing an SOI wafer with a selected resistivity to eliminate any need for additional doping of the SOI wafer, providing a single mask on the SOI wafer, and simultaneously defining all components of the accelerometer in the SOI wafer without using any pn-junctions to define any piezoresistive components and to provide the same resistivity of all components. The step of simultaneously defining all components of the accelerometer in the SOI wafer comprises defining all components of a linear or angular accelerometer.

A low voltage current mirror design is used to control a high voltage boost converter. A high amperage reference current emanating from a high voltage inductor based DC-to-DC boost converter is mirrored to a low amperage output current. On-chip CMOS elements are used to measure and manipulate the output current, eliminating the need for a high precision, low resistance, external resistor. The measured and manipulated current is used to control the PWM duty cycle of an inductor based DC-to-DC boost converter, allowing for a lower cost solution in a high voltage, high current situation.

A photovoltaic solar cell comprises a light absorbing layer of n-type crystalline silicon. An emitter layer is on the front side of the n-type crystalline silicon. A front passivation layer physically contacts the emitter layer. A front metal contact is on the front passivation layer and contacts the emitter layer. A back layer of wide bandgap semiconductor physically contacts a back side of the n-type crystalline silicon layer. A back metal contact physically contacts the wide bandgap semiconductor layer.

A varnish comprising a ground substance consisting of a polymer or oligomer of 200 to 50′104 molecular weight or organic compound of 200 to 1000 molecular weight and a solvent containing a good solvent and a poor solvent whose boiling point (under 760 mmHg) is at least 20° C. lower than that of the good solvent, wherein the ground substance is dissolved in the solvent. Any thin film prepared from this varnish is substantially from generation of foreign matter, so that it can appropriately be used as thin films for electronic devices and those for use in other technical fields.