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32 results about "Piezoresistive accelerometer" patented technology

Processing method of integrated piezoresistive accelerometer and pressure meter which are based on prefabricated cavity SOI (silicon on insulator) substrate

The invention discloses a processing method of an integrated piezoresistive accelerometer and a pressure meter which are based on a prefabricated cavity SOI (silicon on insulator) substrate. The accelerometer comprises an elastic beam-mass block structure with a force sensitive resistor, and the pressure meter comprises a pressure sensitive diaphragm with a force sensitive resistor. The method is as follows: preparing dosage concentration resistor stripes as the force sensitive resistor and a temperature sensitive resistor on a device layer of the SOI substrate; processing a metal wire layer and a passivation layer; deeply etching to the prefabricated cavity, releasing the elastic beam-mass block structure; and bonding a cover sheet cover to protect the movable structure. Compared with the prior art, according to the processing method, the symmetrical elastic beam-mass block structure with precise size can be processed by a single-surface and single-step process, a monocrystalline silicon sensitive resistor and the temperature sensitive resistor of the accelerometer and the pressure meter can be processed, the device sensitivity is high, the process repeatability is good, a vacuum packaging step of a traditional absolute-pressure pressure meter is omitted; and the prepared elastic beam-mass block structure is universal.
Owner:PEKING UNIV

Silicon micro-piezoresistive accelerometer capable of reducing temperature excursion

The invention relates to a piezoresistive silicon-micro-accelerometer, in particular to the piezoresistive silicon-micro-accelerometer which can reduce temperature drift. The temperature property of the piezoresistive silicon-micro-accelerometer is improved, and the temperature drift is reduced. The accelerometer comprises a silicon basal framework, a socle beam, a mass block, a strain varistor arranged at the fixed end part of the socle beam, the mass block and the silicon basal framework, a reference varistor arranged on the silicon basal framework and a peripheral zero-regulating resistor arranged outside the silicon basal framework; the peripheral zero-regulating resistor, the strain varistors and the reference varistor are connected to form a wheatstone bridge, the peripheral zero-regulating resistor is independently taken as a bridge arm of the wheatstone bridge; and the peripheral zero-regulating resistor is a varistor which is produced on anther silicon substrate with the same property by adopting an ion injection technology, and the wheatstone bridge containing the varistor is zeroed by controlling the ion injection speed when the varistor is produced. The invention has the advantages of convenient zeroing, low temperature drift, small error output and large operation temperature range.
Owner:ZHONGBEI UNIV

MEMS piezoresistive accelerometer

The invention discloses an MEMS piezoresistive accelerometer. The MEMS piezoresistive accelerometer comprises a substrate, a frame, elastic beams, a main mass block, secondary mass blocks, an upper sealing cap and a plurality of sets of piezoresistors, wherein the main mass block is arranged in the center of the frame through the elastic beams in a supporting suspension mode, the frame is fixed to the upper end of the substrate, the secondary mass blocks are arranged on the elastic beams respectively, a specially-shaped elastic beam structure is formed by the secondary mass blocks and the elastic beams, the piezoresistors are arranged in the middle of the elastic beams and the positions of connection between the elastic beams and the frame respectively, the main mass block and the elastic beams are the same in thickness, the upper sealing cap is fixed to the upper end face of the frame, a groove structure is arranged inside the upper sealing cup, and the main mass block is arranged inside a groove in a suspended mode, and can freely move when sensing inertia force in all the directions. According to the MEMS piezoresistive accelerometer, due to the facts that the structure that the elastic beams and the single main mass block are arranged is adopted, and changes of stress, at different positions, of the specially-shaped elastic beams are reflected when the main mass block senses the inertia force in different directions, the size of a device is effectively reduced, and the MEMS piezoresistive accelerometer has the advantages of being high in sensitivity and natural frequency, good in high-overload resistant capacity and the like.
Owner:DALIAN UNIV OF TECH

Low cross-axis sensitivity piezoresistive accelerometer structure and manufacturing method thereof

The invention discloses a low cross-axis sensitivity piezoresistive accelerometer structure and a manufacturing method thereof and belongs to the field of micro-electro-mechanical systems. A low cross-axis sensitivity piezoresistive accelerometer is formed by a mass block (1), eight support beams (2), four sensing beams (3) and a frame (4). The center of gravity of the mass block (1) is located ina neutral plane of the support beams (2). The upper surfaces of the sensing beams (3) are located on the surface of a chip such that piezoresistors (5) are made on the surfaces of the sensing beams.The thickness of the sensing beams is far smaller than that of the support beams. Under the action of Z-axis acceleration on the surface of a vertical chip, the mass block (1) moves in a Z-axis direction and drives the sensing beams (3) to move together, the strain of the sensing beams (3) is detected by the piezoresistors (5), thus Z-axis acceleration is obtained. Since the center of gravity of the mass block (1) is located in the neutral plane of the support beams (2), the deflection angle of the mass block (1) under X-axis or Y-axis acceleration within the chip surface is small, and so thestructure has small cross-axis sensitivity.
Owner:CHINA JILIANG UNIV

Pure axial deformation based MEMS three-axis piezoresistive accelerometer chip and preparation method thereof

The invention discloses a pure axial deformation based MEMS three-axis piezoresistive accelerometer chip and a preparation method thereof. An X measurement unit, a Y measurement unit and a Z measurement unit in a sensor are used for measuring the accelerations in the X direction, the Y direction and the Z direction respectively, so that the separate measurement of the accelerations in the three directions is realized; each measurement unit comprises mass blocks, a supporting beam and a sensitive beam; for no matter which of the measurement units, the supporting beam and the sensitive beam areseparately arranged through the mass blocks, the supporting beam supports the mass blocks to move, and the stress is mainly concentrated in the sensitive beam, so that the resistance value of a piezoresistor strip on the sensitive beam is changed; the supporting beam and the sensitive beam perform respective functions, so that the direct coupling relation between the sensitivity and the resonant frequency is greatly weakened; meanwhile, due to the synchronous movement of the two mass blocks, the two ends of the sensitive beam fixed with the mass blocks synchronously move, and the sensitive beam always meets the pure axial deformation condition; and under the same resonant frequency, the sensitivity of the sensor is optimal, so that the sensor chip has good performance indexes.
Owner:XI AN JIAOTONG UNIV

Method of making self-aligned MEMS piezoresistive accelerometer

The invention discloses a method of making a self-aligned MEMS piezoresistive accelerometer, comprising the following steps: making a cavity at the bottom of a silicon substrate through a KOH etching process; growing an oxide layer and a silicon nitride layer on the top of the silicon substrate in sequence from bottom to top; making a piezoresistive pattern and a structure release pattern on the silicon nitride layer at the same time through a lithography process, and etching the silicon nitride layer at the piezoresistive pattern and at the structure release pattern; etching the oxide layer at the piezoresistive pattern, and forming a piezoresistor through an injecting process and an annealing process; etching the oxide layer at the structure release pattern to form a structure release area; deeply etching the silicon substrate in the structure release area to form a movable structure, thus getting an MEMS piezoresistive accelerometer. The piezoresistive pattern and the structure release pattern are formed in the same lithography process. There is no need for equipment to carry out alignment in the machining process. Self-alignment of the piezoresistor and a device structure is realized. Thus, the symmetry of devices is improved, error caused by position deviation of the piezoresistor is reduced, and the performance of devices is improved.
Owner:NORTH ELECTRON RES INST ANHUI CO LTD

A mems piezoresistive accelerometer

The invention discloses an MEMS piezoresistive accelerometer. The MEMS piezoresistive accelerometer comprises a substrate, a frame, elastic beams, a main mass block, secondary mass blocks, an upper sealing cap and a plurality of sets of piezoresistors, wherein the main mass block is arranged in the center of the frame through the elastic beams in a supporting suspension mode, the frame is fixed to the upper end of the substrate, the secondary mass blocks are arranged on the elastic beams respectively, a specially-shaped elastic beam structure is formed by the secondary mass blocks and the elastic beams, the piezoresistors are arranged in the middle of the elastic beams and the positions of connection between the elastic beams and the frame respectively, the main mass block and the elastic beams are the same in thickness, the upper sealing cap is fixed to the upper end face of the frame, a groove structure is arranged inside the upper sealing cup, and the main mass block is arranged inside a groove in a suspended mode, and can freely move when sensing inertia force in all the directions. According to the MEMS piezoresistive accelerometer, due to the facts that the structure that the elastic beams and the single main mass block are arranged is adopted, and changes of stress, at different positions, of the specially-shaped elastic beams are reflected when the main mass block senses the inertia force in different directions, the size of a device is effectively reduced, and the MEMS piezoresistive accelerometer has the advantages of being high in sensitivity and natural frequency, good in high-overload resistant capacity and the like.
Owner:DALIAN UNIV OF TECH

A self-aligning mems piezoresistive accelerometer manufacturing method

The invention discloses a method of making a self-aligned MEMS piezoresistive accelerometer, comprising the following steps: making a cavity at the bottom of a silicon substrate through a KOH etching process; growing an oxide layer and a silicon nitride layer on the top of the silicon substrate in sequence from bottom to top; making a piezoresistive pattern and a structure release pattern on the silicon nitride layer at the same time through a lithography process, and etching the silicon nitride layer at the piezoresistive pattern and at the structure release pattern; etching the oxide layer at the piezoresistive pattern, and forming a piezoresistor through an injecting process and an annealing process; etching the oxide layer at the structure release pattern to form a structure release area; deeply etching the silicon substrate in the structure release area to form a movable structure, thus getting an MEMS piezoresistive accelerometer. The piezoresistive pattern and the structure release pattern are formed in the same lithography process. There is no need for equipment to carry out alignment in the machining process. Self-alignment of the piezoresistor and a device structure is realized. Thus, the symmetry of devices is improved, error caused by position deviation of the piezoresistor is reduced, and the performance of devices is improved.
Owner:NORTH ELECTRON RES INST ANHUI CO LTD

A pure axial deformation mems triaxial piezoresistive accelerometer chip and its preparation method

The invention discloses a pure axial deformation based MEMS three-axis piezoresistive accelerometer chip and a preparation method thereof. An X measurement unit, a Y measurement unit and a Z measurement unit in a sensor are used for measuring the accelerations in the X direction, the Y direction and the Z direction respectively, so that the separate measurement of the accelerations in the three directions is realized; each measurement unit comprises mass blocks, a supporting beam and a sensitive beam; for no matter which of the measurement units, the supporting beam and the sensitive beam areseparately arranged through the mass blocks, the supporting beam supports the mass blocks to move, and the stress is mainly concentrated in the sensitive beam, so that the resistance value of a piezoresistor strip on the sensitive beam is changed; the supporting beam and the sensitive beam perform respective functions, so that the direct coupling relation between the sensitivity and the resonant frequency is greatly weakened; meanwhile, due to the synchronous movement of the two mass blocks, the two ends of the sensitive beam fixed with the mass blocks synchronously move, and the sensitive beam always meets the pure axial deformation condition; and under the same resonant frequency, the sensitivity of the sensor is optimal, so that the sensor chip has good performance indexes.
Owner:XI AN JIAOTONG UNIV

A piezoresistive acceleration and pressure integrated sensor and its manufacturing method

The invention provides a piezoresistive acceleration and pressure integrated sensor based on anodic bonding and packaging and a method for manufacturing the piezoresistive acceleration and pressure integrated sensor. The piezoresistive acceleration and pressure integrated sensor integrates a piezoresistive acceleration sensor and a piezoresistive pressure sensor and is provided with a first bonding glass-silicon substrate-second bonding glass type sandwich structure. The piezoresistive acceleration and pressure integrated sensor is novel in structure, low in weight, small in size, high in stability, and high in anti-pollution capacity. In addition, according to the piezoresistive acceleration and pressure integrated sensor and the method for manufacturing the piezoresistive acceleration and pressure integrated sensor, the same technology is applied to the same chip, the pressure measurement capacity and the acceleration measurement capacity are achieved through different kinds of design, and the technological processes are simple and easy to implement. The piezoresistive acceleration and pressure integrated sensor has a certain application prospect in the fields such as the aviation field, the military field, the automobile field and the environment monitoring field.
Owner:江苏英特神斯科技有限公司
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