The invention discloses a blade height measuring device and a scribing
machine for
semiconductor processing in the technical field of
semiconductor processing, and the device comprises a lower installation plate, an upper installation plate is arranged above the lower installation plate, a rotating ring is rotatably installed between the lower installation plate and the upper installation plate, and an upper supporting frame is fixedly installed on the upper surface of the upper installation plate. A
cutting knife is fixedly installed at the upper end of the rotating ring, a movable plate is arranged at the bottom of the rotating ring, a plurality of through grooves are formed in the movable plate, an
infrared distance sensor is fixedly installed at the position, corresponding to the
cutting knife, of the upper surface of the movable plate, and clamping assemblies are arranged at the positions, corresponding to the two sides of the
cutting knife, of the upper surface of the movable plate; the distance between the blade and the upper end of the
wafer is detected before each division, uneven division of the
wafer can be ensured, the accuracy of each division thickness is ensured, interference caused by blade abrasion and position movement is avoided,
powder after cutting can be automatically cleaned, abrasion of the blade by the
powder is reduced, and the cutting efficiency is improved. The service life of the blade is prolonged.