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485results about How to "Accurate thickness" patented technology

Method of fabricating silicon-doped metal oxide layer using atomic layer deposition technique

There are provided methods of fabricating a silicon-doped metal oxide layer on a semiconductor substrate using an atomic layer deposition technique. The methods include an operation of repeatedly performing a metal oxide layer formation cycle K times and an operation of repeatedly performing a silicon-doped metal oxide layer formation cycle Q times. At least one of the values K and Q is an integer of 2 or more. K and Q are integers ranging from 1 to about 10 respectively. The metal oxide layer formation cycle includes the steps of supplying a metal source gas to a reactor containing the substrate, and then injecting an oxide gas into the reactor. The silicon-doped metal oxide layer formation cycle includes supplying a metal source gas including silicon into a reactor containing the substrate, and then injecting an oxide gas into the reactor. The sequence of operations of repeatedly performing the metal oxide layer formation cycle K times, followed by repeatedly performing the silicon-doped metal oxide layer formation cycle Q times, is performed one or more times until a silicon-doped metal oxide layer with a desired thickness is formed on the substrate. In addition, a method of fabricating a silicon-doped hafnium oxide (Si-doped HfO2) layer according to a similar invention method is also provided.
Owner:SAMSUNG ELECTRONICS CO LTD

Smart device to measure tissue thickness

The invention relates to an intelligent instrument for measuring the tissue thickness. The intelligent instrument comprises a button cell type intelligent thickness measuring clip or an external power supply type intelligent thickness measuring clip, a linear incision anastomat or a manual thickness measuring instrument or an automatic thickness measuring instrument, and a staple anvil. The button cell type intelligent thickness measuring clip comprises an outer shell, a pressing key, waterproof soft glass, an integrated circuit board and a bottom cover. The waterproof soft glass is arranged between the pressing key and the integrated circuit board and covers the surface of the pressing key. A button cell, a power module, a display module, a tissue pressure intensity measuring module, a tissue thickness measuring module, a control module and a wireless transmission module are mounted on the back face of the integrated circuit board. An eddy-current transducer and a pressure sensor are mounted on the front face of the integrated circuit board. The button cell type intelligent thickness measuring clip is matched with a wireless transmission device. The intelligent instrument for measuring the tissue thickness has the advantages that the tissue thickness can be measured in a quantitative mode, tissue thickness measurement is accurate, corresponding anastomotic staple cartridges can be selected conveniently, and the success rate of anastomotic surgery is increased.
Owner:UNIV OF SHANGHAI FOR SCI & TECH

Intelligent instrument for measuring tissue thickness

The invention relates to an intelligent instrument for measuring the tissue thickness. The intelligent instrument comprises a button cell type intelligent thickness measuring clip or an external power supply type intelligent thickness measuring clip, a linear incision anastomat or a manual thickness measuring instrument or an automatic thickness measuring instrument, and a staple anvil. The button cell type intelligent thickness measuring clip comprises an outer shell, a pressing key, waterproof soft glass, an integrated circuit board and a bottom cover. The waterproof soft glass is arranged between the pressing key and the integrated circuit board and covers the surface of the pressing key. A button cell, a power module, a display module, a tissue pressure intensity measuring module, a tissue thickness measuring module, a control module and a wireless transmission module are mounted on the back face of the integrated circuit board. An eddy-current transducer and a pressure sensor are mounted on the front face of the integrated circuit board. The button cell type intelligent thickness measuring clip is matched with a wireless transmission device. The intelligent instrument for measuring the tissue thickness has the advantages that the tissue thickness can be measured in a quantitative mode, tissue thickness measurement is accurate, corresponding anastomotic staple cartridges can be selected conveniently, and the success rate of anastomotic surgery is increased.
Owner:UNIV OF SHANGHAI FOR SCI & TECH

Processing method of differential type high-precision accelerometer

The invention discloses a processing method of a differential type high-precision accelerometer. The accelerometer comprises an upper electrode cover plate, a movable silicon structural assembly with a beam-mass block structure and a lower electrode cover plate which are sequentially connected from top to bottom. The method comprises the following steps of: processing the upper electrode plate and the lower electrode plate by using a glass sheet or a monocrystalline silicon wafer as a substrate; processing the movable silicon structural assembly with the beam-mass block structure by using a double-device-layer SOI (Silicon-On-Insulator) monocrystalline silicon wafer as a substrate; and connecting the upper electrode plate and the lower electrode plate which are processed by using the substrates with the movable silicon structural assembly based on a bonding mode. In the invention, only one monocrystalline silicon wafer is adopted to process the movable silicon structural assembly, thereby avoiding the condition that a frequently used high-temperature silicon-silicon bonding process is used for preparing the movable silicon structural assembly, reducing the process difficulty, lowering the highest process temperature and eliminating bonding stress problems introduced by silicon-silicon bonding; and moreover, the beam-mass block structure has generality.
Owner:PEKING UNIV

Preparation method of foamed aluminum sandwich plate

The invention relates to a preparation method of a layered composite material, in particular to a preparation method of a foamed aluminum sandwich plate. The method comprises the following steps of: firstly, uniformly mixing an aluminum alloy, a tackifier and a foaming agent to obtain a platy or blocky foamable precast blank material; then, performing hot-pressing compounding of the precast blankand a steel plate after the surface plating to obtain a foamable composite plate sandwiching the precast blank; placing the foamable composite plate sandwiching the precast blank in a mould sleeve closed around, and delivering into an infrared foaming furnace heating at the upper and lower parts at the same time so as to heat and foam the composite plate sandwiching the precast blank under infrared radiation; and finally, pulling the mould sleeve out of the foaming furnace, and cooling to obtain a foamed aluminum sandwich plate with a fixed thickness. The foamed aluminum sandwich plate prepared by the method provided by the invention has an accurate thickness, a uniform structure and a high yield; and moreover, the preparation processes in the invention can be automatically controlled, thereby being favorable for realizing semi-continuous preparation of the foamed aluminum sandwich plate.
Owner:NORTHEASTERN UNIV

Single-phase winding coiling method used for p axial magnetic field motors and winding structures thereof, printed circuit board and motor

The invention provides single-phase winding structures used for axial magnetic field motors and a coiling method thereof, a printed circuit board and a motor. The windings are arranged on 2N layers of PCB. The windings arranged on all layers of PCB except for the first layer of PCB are provided with winding cycle rings of which the number is the same with that of motor magnetic poles. The adjacent winding layers are serially connected via connecting holes arranged at the central parts of the winding cycles. The head end and the tail end of the winding end parts are arranged on the first layer of PCB. Cost of the windings is relatively low; the motor coefficient of the windings is relatively high; and the windings are realized through the mode of the PCB so that the shape of the 2D windings can be arbitrary, and the size and the thickness of the windings can be accurately controlled. The aforementioned is important for realization of the thin motor structure and enhancement of motor performance; and the lines of a motor driving circuit, a Hall sensor circuit and other electronic devices can be manufactured on the same PCB forming the motor windings so that utilization rate of motor space can be enhanced.
Owner:FORTIOR TECH SHENZHEN

Pressure sensor

In manufacturing a pressure sensor a recess that will form part of the sensor cavity is formed in a lower silicon substrate. An SOI-wafer having a monocrystalline silicon layer on top of a substrate is bonded to the lower silicon substrate closing the recess and forming the cavity. The supporting substrate of the SOI-wafer is then etched away, the portion of the monocrystalline layer located above the recess forming the sensor diaphragm. The oxide layer of the SOI-wafer here acts as an “ideal” etch stop in the case where the substrate wafer is removed by dry (plasma) or wet etching using e.g. KOH. This is due to high etch selectivity between silicon and oxide for some etch processes and it results in a diaphragm having a very accurately defined and uniform thickness. The cavity is evacuated by forming a opening to the cavity and then sealing the cavity by closing the opening using LPCVD. Sensor paths for sensing the deflection of the diaphragm are applied on the outer or inner surface of the diaphragm. The monocrystalline diphragm gives the sensor a good long-term stability. Also the sensor path can be made of monocrystalline material, this giving the sensor even better good long-term characteristics. An increased sensitivity can be obtained by making active portions of the sensor paths freely extending, unsupported by other material of the pressure sensor, by suitable etching procedures.
Owner:SILEX MICROSYST

Reinforced concrete shear wall with positioning prefabricated member inside and construction method of reinforced concrete shear wall

The invention relates to a reinforced concrete shear wall with a positioning prefabricated member inside and a construction method of the reinforced concrete shear wall. The construction method includes: manufacturing the prefabricated member; arranging the prefabricated member on a floor slab structure; making positioning ladder rebars; binding rebars; mounting the prefabricated member; mounting steel formworks; setting up a steel formwork inclined strut. During constructing the reinforced concrete shear wall, vertical ladder rebars and horizontal ladder rebars are adopted as a positioning supporting frame for rebar binding, and the positioning prefabricated member is clamped in horizontally-vertically-distributed rebars, so that thickness of a protection layer is guaranteed and connection of rebar nets is enhanced; the assembly steel formworks are arranged on two sides of the rebar nets, oppositely-puling threaded rods penetrate connecting steel pipes to be fastened on embedded members of the steel formwork inclined strut and the floor slab structure through screws, and concrete is poured to form a shear wall structure. By using the construction method, construction site order and construction efficiency are improved, related measures guarantee construction quality of the shear wall, rebar positioning accuracy and thickness accuracy of the protection layer are improved remarkably, and the construction method has good technical and economic benefit.
Owner:ZHONGDA CONSTR
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