Manufacturing method of rigid-flex PCB

A technology for a PCB board and a manufacturing method, which is applied in the field of rigid-flex combined PCB board manufacturing, can solve problems such as low efficiency and need to be improved in quality, and achieve the effects of improving versatility, reducing labor intensity and improving production efficiency

Active Publication Date: 2015-10-07
SHENZHEN KINWONG ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a rigid-flexible PCB manufacturing method, aiming to solve the problems of low efficiency and quality improvement of the existing rigid-flexible PCB manufacturing method

Method used

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  • Manufacturing method of rigid-flex PCB
  • Manufacturing method of rigid-flex PCB

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Embodiment Construction

[0024] The present invention provides a rigid-flexible PCB manufacturing method. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0025] A method for manufacturing a rigid-flex PCB board provided by the present invention comprises the steps of:

[0026] S101, making a screen film, the area of ​​the oil level under the screen is 1mm smaller than the single side of the window slot;

[0027] S102. Perform acid and alkali-resistant peelable adhesive printing, and fill and cover the window slots;

[0028] S103, perform baking treatment, and cure the acid and alkali resistant peelable adhesive;

[0029] S104. Carry out copper immersion electroplating, and tear off the acid and alkali resistant peelable adhesi...

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Abstract

The invention discloses a manufacturing method of a rigid-flex PCB. The method includes the steps: A, manufacturing a screen print film, the lower oil level area of the screen print film being 1mm smaller than a windowing duct single side; B, performing acid and alkali resistance glue peelable printing, and filling and covering a windowing duct; C, carrying out a baking step, and solidifying acid and alkali resistance peelable glue; and D, performing electroless copper electroplating, and tearing off the acid and alkali resistance peelable glue after electroplating. A screen printing technology is adopted to fill peelable glue in windowing places to replace conventional gluing by hands, so the production efficiency is greatly improved and the labor intensity is reduced. For different dimensions, people can perform printing filling on flexible areas with different shapes without considering whether glue paper matches the flexible areas in shape and dimension. Therefore, the manufacturing method is improved in universality.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing a rigid-flexible PCB board. Background technique [0002] The structure of the rigid-flex PCB is usually divided into two types, one is that the flexible area is on the outermost layer, and the other is that the flexible area is in the middle. [0003] In the PCB manufacturing process, the rigid board and the flexible board need to be made separately, and then the rigid-flex board is pressed together through the adhesive sheet. In order to expose the required flexible area, the following two methods are generally used ( Take the flexible board on the outer layer as an example): [0004] Window opening method: CNC machine tools are used, controlled by computer programs, to cut off the rigid board corresponding to the area that needs to expose the flexible board with a gong knife, and then press the rigid board and the flexible board ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/282H05K3/4691H05K2203/0582
Inventor 王俊谢伦魁刘赟张传超
Owner SHENZHEN KINWONG ELECTRONICS
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