Method for manufacturing outer layer graph of thick copper plate

Abstract

The invention discloses a method for making an outer layer pattern of a thick copper plate, comprising the following steps: a. sticking a dry film on the copper surface of the thick copper plate according to the copper thickness of the outer layer; b. first exposure and first development; c. , coating wet film; d, second exposure, second development, making outer layer circuit graphics; e, laser window opening, will need to make thick copper layer by laser window opening at the position where the hole is sealed by dry film; f , Pattern electroplating, to meet the requirements for the thickness of the copper layer in the hole and on the surface of the copper plate. For the thick copper core board with uneven surface, apply the dry film first, seal the hole with the dry film after making the circuit pattern, and then apply the wet film to fill the gap, which improves the dry film and copper surface only. Combined with the problem of being weak and easy to fall off, the quality of the thick copper plate is improved, the production yield is improved, and the production cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and in particular relates to a method for producing an outer layer pattern of a thick copper plate. Background technique [0002] With the continuous advancement of electronic information technology, users are increasingly demanding printed circuit boards (PCBs) such as high-power, high-current server power boards, and such PCBs often require high heat resistance, high heat dissipation, etc. characteristics, so the inner core board is required to be a thick copper board. [0003] Because of the thick copper layer on the surface of the core board (≥3OZ), thick copper boards have many processing difficulties in the PCB processing process, such as the outer layer circuit pattern production process, and the outer layer pattern production process usually refers to the use of photoresist dry film (referred to as Dry film) through exposure and development to form a negative ant...

AI Technical Summary

Problems solved by technology

[0004] However, the above process has the following problems: Since the copper thickness of the inner core board of the thick copper plate is ≥ 3OZ, there is a height difference during the pressing process, and there is often a drop during the pressing process when the height difference is filled with the prepreg. If the drop position is too large, the surface of the board will be uneven, and air bubbles will easily occur after the outer layer is pasted with the dry film. Scrapping affects the production of product lines and increases production costs