47results about "Directly printed exposure masks" patented technology

The presently described embodiments use a printing process, e.g. a wax printing technique, to pattern a mask layer (such as a soldermask layer) of, for example, a printed circuit. Substantially all other conventional processes in developing soldermask and exposure processes can be maintained. According to the presently described embodiments, each printed circuit will have a unique pattern that matches uniform and non-uniform runout. In one form, the pattern is comprised of wax single drops having a specified gap to make the process transparent to the current industry practice. Furthermore, the single drops can be used for both large and small areas without any development time differences. In at least one form, the wax pattern and the soldermask in the gap are removed during development.

The invention discloses a preparation method and equipment of a copper-thickening printed circuit board. After external light imaging is performed for the first time, selective copper thickening treatment is performed firstly, so that the problems in the prior art as follows can be avoided: the lower side wall of a dry film in a winding region in secondary external light imaging suffers from medicinal liquid attack and corrosion to be hollowed out to hide medicinal water, and a poor tin plating phenomenon is caused in the secondary copper plating and tin plating due to the hidden medicinal liquid; by adoption of the preparation method, the selective copper thickening flow is performed on the dry film firstly to satisfy the partial copper thickness requirement; and the subsequent production is performed based on the normal board flow, so that the poor tin plating phenomenon caused by the previous two times of copper plating and tin plating and an open-circuit phenomenon in the subsequent etching can be relieved.

An object of the present invention is to provide the printed wiring board capable of forming fine conductor patterns easily and with high precision, simplifying the manufacturing method and reducing the manufacturing cost. The manufacturing method includes the steps of: forming a base metal pattern on a surface of an insulating substrate; coating the surface with a negative photoresist, where the metal pattern is formed; forming a plating resist pattern on the insulating substrate in such a way that the insulating substrate is irradiated with light so as to transmit therethrough from a surface of the opposite side to the surface of the insulating substrate, and the negative photoresist of a part, where the base metal pattern is not formed, is irradiated with the transmitted light and is exposed with the base metal patterns as a self-alignment mask, and thereafter is developed; and forming a metal pattern selectively on the base metal pattern by plating the surface of the base metal pattern of a part where the plating resist pattern is not formed. In the method, conductor patterns are formed by laminating base metal patterns and plating metal patterns.

A circuit pattern is formed by following steps: forming a light-blocking mask over a major surface of a light-transmitting substrate, forming a first film in a first region over the substrate and the mask, forming a photocatalytic film in at least a part of the first region over the first film, changing wettability of the first film in a second region which is in the first region, being in contact with the photocatalytic film, and not overlapping the mask, by light irradiation from a back surface opposite to the major surface of the substrate, removing the photocatalytic film, and forming a composition including a pattern forming material in the second region.

The method for producing a wired circuit board including an insulating layer and a conductive pattern provided on the insulating layer includes the steps of the following: a step (1), in which the insulating layer is provided; a step (2), in which a metal thin film is provided on an inclined face of the insulating layer; a step (3), in which a photoresist is provided on the metal thin film; a step (4), in which a photomask is disposed so that in the photoresist, a portion where the conductive pattern is to be provided is shielded from light, and the photoresist is exposed to light through the photomask; a step (5), in which the portion of the photoresist shielded from light by the photomask is removed to expose the metal thin film corresponding to the portion; and a step (6), in which the conductive pattern is provided on the metal thin film exposed from the photoresist. When exposing the photoresist, reflection is caused by the metal thin film positioned on the inclined face to reduce light projected to the portion.

A method of manufacturing a capacitor device of the present invention, includes the steps of, forming an insulating layer on a substrate, forming a recess portion in the insulating layer by an imprinting process, forming a lower electrode by filling a metal layer in the recess portion in the insulating layer, forming a photosensitive dielectric layer on the lower electrode, forming an upper electrode on the dielectric layer, and forming a dielectric layer pattern under the upper electrode by exposing / developing the dielectric layer while using the upper electrode as a mask.

Film for use in preparing a printed circuit board (PCB) along with methods for making a PCB and producing a printable film are described herein. The film includes a first layer formed of a radiation-transparent material, a second layer formed of a curable adhesive material, a third layer formed of an electrically conductive material, and optionally, a fourth layer formed of an adhesive and a fifth layer formed of a removable material. Through the adhesive layers, the layers are bonded together to produce the printable film. To produce a PCB, the first layer is covered in ink distributed in a pattern representing the PCB, and the ink-covered film is exposed to radiation until the non-ink-covered portions of the second layer have cured. Then, the fifth layer is removed tearing away the electrically conductive material associated with the non-ink-covered portions of the second layer producing the PCB.

A method of manufacturing a printed circuit board is disclosed. The method, which includes forming a base pattern over one side of a negative photoresist, exposing the one side, attaching an insulation layer on the one side, developing the negative photoresist such that the base pattern is uncovered, and forming a circuit pattern over the base pattern, can increase the thickness of the circuit pattern and strengthen the adhesion between the circuit pattern and the insulation layer.

Fabrication methods for electronic devices with via through holes and thin film transistor devices are presented. The fabrication method the electronic device includes providing a substrate, forming a patterned lower electrode on the substrate, and forming a photosensitive insulating layer on the substrate covering the patterned lower electrode. A patterned optical shielding layer is applied on the photosensitive insulating layer. Exposure procedure is performed curing the exposed photosensitive insulating layer. The optical shielding layer and the underlying photosensitive insulating layer are sequentially removed, thereby forming an opening. A patterned upper electrode is formed on the photosensitive insulating layer filling the opening to create a conductive via hole.

A method for masking regions of photoresist in the manufacture of a soldermask for printed circuit boards is disclosed. Following application of photoresist over patterned traces on a substrate, a sheet-like thin film is applied over the photosensitive material. The thin film may adhere to the photosensitive material by way of the adhesive state of the photosensitive material or by way of an adhesive applied to the photosensitive material or the thin film or carried by the thin film. Digital mask printing may proceed on the surface of the thin film. The photosensitive material may then be exposed through the printed photomask, the thin film (with photomask) removed, and the photosensitive material developed.

An aluminum substrate resistance welding screen making method for preventing photosensitive slurry from falling off comprises the following steps: (1) using double-sided adhesive to paste a PET protective film to each of the positions, corresponding to the running tracks at the two ends of a scraper, on the front of a screen mesh; (2) applying glue water to the positions, corresponding to the PET protective films, on the back of the screen mesh, and naturally drying the glue water for a period of time after glue water applying to make the PET protective films cured on the screen mesh; (3) before photosensitive slurry is applied, adding boiling oil water to the photosensitive slurry according to the ratio of 30ml boiling oil water to 1kg photosensitive slurry, manually stirring the boiling oil water and the photosensitive slurry, and letting the mixture stand for a period of time; (4) spray-coating a given photosensitive slurry applying position of the screen mesh with the photosensitive slurry added with boiling oil water; and (5) after the photosensitive slurry is applied, baking the screen in an oven for a period of time to make the photosensitive slurry cured on the screen mesh. By using the method, the problem that the photosensitive slurry on the mesh in the positions of the two ends of the scraper is easy to fall off is improved effectively, the product quality is improved, and the service life of the screen is increased.

The invention provides a novel circuit forming method, and relates to the technical field of circuit forming. The new circuit forming method comprises the following steps: S1, pretreating a product substrate; S2, coating photoresist on the pre-treated substrate by using a coating roller to obtain a product with a photoresist pattern; S3, baking the product coated with the photoresist pattern to cure the photoresist; and S4, etching the baked product with the cured photoresist pattern to remove a copper foil which is not covered by the photoresist, and then, carrying out development to remove the photoresist on the surface of the product to obtain a required circuit pattern. According to the invention, the circuit board is manufactured by using a roller pattern coating method, so that the processes of exposure, development and the like are omitted, the original production process steps can be simplified, the labor and equipment costs are greatly reduced, adverse effects caused by manualoperation are avoided, the product quality can be ensured, and the production efficiency is improved.

The present invention provides a pattern formation method comprising a step of forming on a substrate a film of a first photosensitive material having low sensitivity to a light beam with a main wavelength at h-line emitted from a mask-less drawing exposure apparatus but having high sensitivity to an energy light beam containing ultraviolet light; a step of forming on the first photosensitive material a film of a second photosensitive material having higher sensitivity to a light beam with the main wavelength at h-line; a step of drawing a second pattern on the second photosensitive material with the mask-less direct drawing exposure apparatus; a step of developing the second photosensitive material; and a step of exposing to a light beam the second photosensitive material with the second pattern formed thereon and the first photosensitive material in batch to form a target first pattern on the first photosensitive material.

The invention belongs to the technical field of printed circuit boards, and particularly relates to a high-electromagnetic-compatibility circuit board and a manufacturing method thereof. The manufacturing method includes the steps: after a circuit pretreatment procedure, protecting the positions, not needing gold plating, on the circuit board through a selective dry film; plating the whole board with gold, and then processing the circuit board through the circuit dry film. According to the invention, the problems of more personnel, large material consumption, low product percent of pass and quality, heavy pollution and high cost caused by a redundant and complex production process are solved, the reliability of the product is greatly improved, and the manufacturing cost of the circuit board is reduced.

The presently described embodiments use a printing process, e.g. a wax printing technique, to pattern a mask layer (such as a soldermask layer) of, for example, a printed circuit. Substantially all other conventional processes in developing soldermask and exposure processes can be maintained. According to the presently described embodiments, each printed circuit will have a unique pattern that matches uniform and non-uniform runout. In one form, the pattern is comprised of wax single drops having a specified gap to make the process transparent to the current industry practice. Furthermore, the single drops can be used for both large and small areas without any development time differences. In at least one form, the wax pattern and the soldermask in the gap are removed during development.

A support is provided for fabrication of an electronic device. The support includes at least one component to be protected and at least one three-dimensional element of a height at least equal to a height of the electronic component. The three-dimensional element is disposed laterally opposite the at least one component to be protected. The three-dimensional element is chiefly constituted of a permanent assembling material.