47results about "Directly printed exposure masks" patented technology

A method for masking regions of photoresist in the manufacture of a soldermask for printed circuit boards is disclosed. Following application of photoresist over patterned traces on a substrate, a sheet-like thin film is applied over the photosensitive material. The thin film may adhere to the photosensitive material by way of the adhesive state of the photosensitive material or by way of an adhesive applied to the photosensitive material or the thin film or carried by the thin film. Digital mask printing may proceed on the surface of the thin film. The photosensitive material may then be exposed through the printed photomask, the thin film (with photomask) removed, and the photosensitive material developed.

The presently described embodiments use a printing process, e.g. a wax printing technique, to pattern a mask layer (such as a soldermask layer) of, for example, a printed circuit. Substantially all other conventional processes in developing soldermask and exposure processes can be maintained. According to the presently described embodiments, each printed circuit will have a unique pattern that matches uniform and non-uniform runout. In one form, the pattern is comprised of wax single drops having a specified gap to make the process transparent to the current industry practice. Furthermore, the single drops can be used for both large and small areas without any development time differences. In at least one form, the wax pattern and the soldermask in the gap are removed during development.

Production of a resist pattern involves applying first then second photohardenable resist films (F1, F2), sensitive to light in first and second wavelength regions (WL1, WL2) respectively, to a semiconductor chip or a circuit board, where film F2 blocks light of WLR1. Laser light in WL2 is applied through a screen onto part of F2 followed by applying a developer solution, to form a mask pattern. F1 is illuminated with light in WL1 through a membrane mask, and finally F1 is developed.

The invention discloses a preparation method and equipment of a copper-thickening printed circuit board. After external light imaging is performed for the first time, selective copper thickening treatment is performed firstly, so that the problems in the prior art as follows can be avoided: the lower side wall of a dry film in a winding region in secondary external light imaging suffers from medicinal liquid attack and corrosion to be hollowed out to hide medicinal water, and a poor tin plating phenomenon is caused in the secondary copper plating and tin plating due to the hidden medicinal liquid; by adoption of the preparation method, the selective copper thickening flow is performed on the dry film firstly to satisfy the partial copper thickness requirement; and the subsequent production is performed based on the normal board flow, so that the poor tin plating phenomenon caused by the previous two times of copper plating and tin plating and an open-circuit phenomenon in the subsequent etching can be relieved.

A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing the printed circuit board in accordance with an embodiment of the present invention can include: forming an opaque conductive pattern on one side of a transparent insulation layer; forming a photosensitive insulation layer on the transparent insulation layer such that the conductive pattern is covered; hardening the photosensitive insulation layer excluding an area covering the conductive pattern by irradiating light on the other side of the transparent insulation layer; and forming an opening on the photosensitive insulation layer by removing the area of the photosensitive insulation layer covering the conductive pattern such that the conductive pattern is exposed.

Disclosed is a PCB including an embedded capacitor, in which a dielectric layer and an upper electrode layer are formed after a lower electrode layer of the embedded capacitor is formed, thereby providing a microcircuit pattern on a circuit layer having a lower electrode layer formed thereon, and a method of fabricating the same.

The method for producing a wired circuit board including an insulating layer and a conductive pattern provided on the insulating layer includes the steps of the following: a step (1), in which the insulating layer is provided; a step (2), in which a metal thin film is provided on an inclined face of the insulating layer; a step (3), in which a photoresist is provided on the metal thin film; a step (4), in which a photomask is disposed so that in the photoresist, a portion where the conductive pattern is to be provided is shielded from light, and the photoresist is exposed to light through the photomask; a step (5), in which the portion of the photoresist shielded from light by the photomask is removed to expose the metal thin film corresponding to the portion; and a step (6), in which the conductive pattern is provided on the metal thin film exposed from the photoresist. When exposing the photoresist, reflection is caused by the metal thin film positioned on the inclined face to reduce light projected to the portion.

A method of manufacturing a capacitor device of the present invention, includes the steps of, forming an insulating layer on a substrate, forming a recess portion in the insulating layer by an imprinting process, forming a lower electrode by filling a metal layer in the recess portion in the insulating layer, forming a photosensitive dielectric layer on the lower electrode, forming an upper electrode on the dielectric layer, and forming a dielectric layer pattern under the upper electrode by exposing / developing the dielectric layer while using the upper electrode as a mask.

A method of manufacturing a capacitor device of the present invention, includes the steps of, forming an insulating layer on a substrate, forming a recess portion in the insulating layer by an imprinting process, forming a lower electrode by filling a metal layer in the recess portion in the insulating layer, forming a photosensitive dielectric layer on the lower electrode, forming an upper electrode on the dielectric layer, and forming a dielectric layer pattern under the upper electrode by exposing / developing the dielectric layer while using the upper electrode as a mask.

Film for use in preparing a printed circuit board (PCB) along with methods for making a PCB and producing a printable film are described herein. The film includes a first layer formed of a radiation-transparent material, a second layer formed of a curable adhesive material, a third layer formed of an electrically conductive material, and optionally, a fourth layer formed of an adhesive and a fifth layer formed of a removable material. Through the adhesive layers, the layers are bonded together to produce the printable film. To produce a PCB, the first layer is covered in ink distributed in a pattern representing the PCB, and the ink-covered film is exposed to radiation until the non-ink-covered portions of the second layer have cured. Then, the fifth layer is removed tearing away the electrically conductive material associated with the non-ink-covered portions of the second layer producing the PCB.

A method of manufacturing a printed circuit board is disclosed. The method, which includes forming a base pattern over one side of a negative photoresist, exposing the one side, attaching an insulation layer on the one side, developing the negative photoresist such that the base pattern is uncovered, and forming a circuit pattern over the base pattern, can increase the thickness of the circuit pattern and strengthen the adhesion between the circuit pattern and the insulation layer.

The method of manufacturing a wiring substrate includes the steps of: forming a photocatalyst containing layer which is made of a material containing a photocatalytic material, on a substrate made of an insulating material; forming a resin layer in regions other than wire regions on the photocatalyst containing layer; radiating ultraviolet light on the photocatalyst containing layer while the substrate provided with the resin layer and the photocatalyst containing layer is immersed in a solution containing at least a metal ion and a sacrificial reagent, in such a manner that metal is deposited on exposed regions of the photocatalyst containing layer.

An aluminum substrate resistance welding screen making method for preventing photosensitive slurry from falling off comprises the following steps: (1) using double-sided adhesive to paste a PET protective film to each of the positions, corresponding to the running tracks at the two ends of a scraper, on the front of a screen mesh; (2) applying glue water to the positions, corresponding to the PET protective films, on the back of the screen mesh, and naturally drying the glue water for a period of time after glue water applying to make the PET protective films cured on the screen mesh; (3) before photosensitive slurry is applied, adding boiling oil water to the photosensitive slurry according to the ratio of 30ml boiling oil water to 1kg photosensitive slurry, manually stirring the boiling oil water and the photosensitive slurry, and letting the mixture stand for a period of time; (4) spray-coating a given photosensitive slurry applying position of the screen mesh with the photosensitive slurry added with boiling oil water; and (5) after the photosensitive slurry is applied, baking the screen in an oven for a period of time to make the photosensitive slurry cured on the screen mesh. By using the method, the problem that the photosensitive slurry on the mesh in the positions of the two ends of the scraper is easy to fall off is improved effectively, the product quality is improved, and the service life of the screen is increased.

The invention provides a novel circuit forming method, and relates to the technical field of circuit forming. The new circuit forming method comprises the following steps: S1, pretreating a product substrate; S2, coating photoresist on the pre-treated substrate by using a coating roller to obtain a product with a photoresist pattern; S3, baking the product coated with the photoresist pattern to cure the photoresist; and S4, etching the baked product with the cured photoresist pattern to remove a copper foil which is not covered by the photoresist, and then, carrying out development to remove the photoresist on the surface of the product to obtain a required circuit pattern. According to the invention, the circuit board is manufactured by using a roller pattern coating method, so that the processes of exposure, development and the like are omitted, the original production process steps can be simplified, the labor and equipment costs are greatly reduced, adverse effects caused by manualoperation are avoided, the product quality can be ensured, and the production efficiency is improved.

The present invention provides a pattern formation method comprising a step of forming on a substrate a film of a first photosensitive material having low sensitivity to a light beam with a main wavelength at h-line emitted from a mask-less drawing exposure apparatus but having high sensitivity to an energy light beam containing ultraviolet light; a step of forming on the first photosensitive material a film of a second photosensitive material having higher sensitivity to a light beam with the main wavelength at h-line; a step of drawing a second pattern on the second photosensitive material with the mask-less direct drawing exposure apparatus; a step of developing the second photosensitive material; and a step of exposing to a light beam the second photosensitive material with the second pattern formed thereon and the first photosensitive material in batch to form a target first pattern on the first photosensitive material.

A method for individualised marking of electronic components in electronics manufacture, such as circuit boards. On the photosensitive surface required for manufacturing the blanks is exposed, on each blank, a machine-readable pattern, which is subsequently used in the manufacture of the product itself, for individualising the blanks in question.

The invention belongs to the technical field of printed circuit boards, and particularly relates to a high-electromagnetic-compatibility circuit board and a manufacturing method thereof. The manufacturing method includes the steps: after a circuit pretreatment procedure, protecting the positions, not needing gold plating, on the circuit board through a selective dry film; plating the whole board with gold, and then processing the circuit board through the circuit dry film. According to the invention, the problems of more personnel, large material consumption, low product percent of pass and quality, heavy pollution and high cost caused by a redundant and complex production process are solved, the reliability of the product is greatly improved, and the manufacturing cost of the circuit board is reduced.

The invention discloses a moisture-proof stain-resistant composite circuit board and a production process thereof. A plurality of groups of heat dissipation through holes are formed in the side wall of the rear end of the circuit board box body; and fixed seats are arranged at four corners of the inner side of the front end of the circuit board box body. A box body mounting frame is fixedly mounted at the rear end of the circuit board box body; positioning sleeves are arranged at four corners of a circuit board mounting base; positioning holes matched with the positioning sleeves are formed inthe fixed seats; mounting screw holes are formed in the bottoms of the positioning holes; a rotating cover drives a sealing baffle to rotate to seal or open an air hole, heat dissipation is started when the circuit board works, the use performance and the heat dissipation effect of the circuit board are ensured, and the sealing baffle seals the air holes when the circuit board does not work, so that external dust and impurities are effectively prevented from entering the circuit board, impurities are prevented from adhering to the surface of the circuit board, and the use performance is prevented from being affected.

In this etching method, the surface (11a) of a target object (11) is processed by using a corrosive agent to corrode said surface (11a) as a means of solving the problem addressed by the present invention. The etching method comprises: a resist formation step in which resist liquid is inkjet-printed on the surface (11a) so that the resist liquid forms a resist (12); a surface corrosion step in which the side (11a) of the target object (11) on which the resist (12) was formed by the resist formation step is brought into contact with a corrosive agent so that the part of the surface (11a) not having the resist (12) formed thereon is corroded; and a resist peeling step in which the resist (12) is peeled from the surface (11a) after the surface corrosion step. The etching method is characterized by the resist formation step being a step in which the resist (12) is formed using a resist liquid containing a monofunctional monomer or a monofunctional oligomer and a polyfunctional monomer or a polyfunctional oligomer.

The presently described embodiments use a printing process, e.g. a wax printing technique, to pattern a mask layer (such as a soldermask layer) of, for example, a printed circuit. Substantially all other conventional processes in developing soldermask and exposure processes can be maintained. According to the presently described embodiments, each printed circuit will have a unique pattern that matches uniform and non-uniform runout. In one form, the pattern is comprised of wax single drops having a specified gap to make the process transparent to the current industry practice. Furthermore, the single drops can be used for both large and small areas without any development time differences. In at least one form, the wax pattern and the soldermask in the gap are removed during development.

The invention provides a method for forming a COF circuit and relates to the technical field of integrated circuits. The method for forming the COF circuit comprises steps that S1, a base material ispunched, and guide holes on two sides of the base material are punched; S2, photoresist printing of a punched product is performed, and a required photoresist pattern is printed on a surface of a copper foil and cured; S3, the product printed with the photoresist pattern is etched, and the copper which is not covered by the photoresist under the action of an etching solution is removed; and S4, afilm of the etched product is stripped, the photoresist pattern protected on the copper surface is removed, and the circuit pattern is exposed. The method is advantaged in that circuit forming is carried out in a printing manner, operations of exposure and development processes are omitted, so occurrence of bad short circuit conditions is reduced, cost of the exposure and development processes isgreatly saved, a product processing period can be shortened, and equipment cost is greatly reduced.

The invention discloses a method of forming a conductive totem by using a gravure printing mode. A conductive layer is firstly formed on a substrate; the gravure printing mode is then used to form a shielding protection totem on the conductive layer; and finally, the conductive layer is etched, and the conductive layer forms a conductive totem corresponding to the shielding protection totem. With the help of the gravure printing mode, the shielding protection totem can be formed directly without processes such as yellow light exposure and development, and thus, the process complexity can be reduced to improve the process speed, and the stock use is reduced to reduce the cost.

The invention relates to a flexible circuit board and a manufacturing method thereof. The flexible circuit board comprises a flexible base material 1 which is provided with a transition layer 2, an optical antireflection layer 3, an optical antireflection layer 4, a protective transition layer 5, a transition layer 6, a seed layer 7, a copper layer 8 and a protective layer 9 from bottom top to top. The manufacturing method comprises the steps of (1) plating and (2) etching the circuit. According to the invention, the transition layer, the protective layer and the seed layer are introduced between the flexible substrate 1 and the conductive copper layer 8, so that the adhesive force between the substrate and the conductive copper is improved, the copper foil with the thickness of 20-30 microns can be electroplated on the surface of the substrate, and the drawing force of the bonding pad can reach more than 1N. According to the invention, the optical antireflection layer 3 and the optical antireflection layer 4 are introduced and form an optical anti-reflection structure, so that the visible light transmittance of the circuit board is improved, and the loss value of the transmittancecan be reduced to less than 5%.

Substrates, such as printed circuit boards, are coated with an aqueous alkaline developable UV photosensitive material followed by applying an aqueous soluble UV transparent film to coat the UV photosensitive material. An aqueous alkaline strippable UV blocking composition is selectively applied to the surface of the UV transparent film to function as a mask. UV light is applied to portions of the UV photosensitive material not covered by the mask. The UV blocking composition, UV transparent film and selective sections of the UV photosensitive material are simultaneously removed with an aqueous alkaline developer solution to form an image on the substrate.